公开(公告)号：US08903913B2

公开(公告)日：2014-12-02

申请号：US13564531

申请日：2012-08-01

申请人： Ajay Somani ,  Ryan da Piedade Menezes ,  Rahul Narayan Iyer ,  Serkan Piantino

发明人： Ajay Somani ,  Ryan da Piedade Menezes ,  Rahul Narayan Iyer ,  Serkan Piantino

IPC分类号： G06F15/16

CPC分类号： G06Q50/01 ,  G06Q10/107

摘要： A message tracking engine facilitates processing of a message through a determined workflow. In particular, the message tracking engine may route the message to various services in an order specified by the workflow. During processing, the message tracking engine tracks the progress of the message through the workflow. If any issues are encountered, the message tracking engine handles the encountered issues. In one aspect, the message tracking engine facilitates performance of one or more synchronous processing steps of the workflow during a first phase. Following the first phase, the message tracking engine serializes one or more asynchronous processing steps of the workflow to a storage device. After serializing the asynchronous processing steps, the message tracking engine facilitates performance of the asynchronous processing steps during a second phase.

摘要翻译： 消息跟踪引擎有助于通过确定的工作流处理消息。 特别地，消息跟踪引擎可以以工作流指定的顺序将消息路由到各种服务。 在处理期间，消息跟踪引擎通过工作流跟踪消息的进度。 如果遇到任何问题，邮件跟踪引擎可以处理遇到的问题。 在一个方面，消息跟踪引擎促进在第一阶段期间工作流的一个或多个同步处理步骤的性能。 在第一阶段之后，消息跟踪引擎将工作流的一个或多个异步处理步骤序列化到存储设备。 在串行化异步处理步骤之后，消息跟踪引擎便于在第二阶段期间执行异步处理步骤。

公开(公告)号：US20140040386A1

公开(公告)日：2014-02-06

申请号：US13564531

申请日：2012-08-01

申请人： Ajay Somani ,  Ryan de Piedade Menezes ,  Rahul Narayan Iyer ,  Serkan Piantino

发明人： Ajay Somani ,  Ryan de Piedade Menezes ,  Rahul Narayan Iyer ,  Serkan Piantino

IPC分类号： G06F15/16

CPC分类号： G06Q50/01 ,  G06Q10/107

摘要： A message tracking engine facilitates processing of a message through a determined workflow. In particular, the message tracking engine may route the message to various services in an order specified by the workflow. During processing, the message tracking engine tracks the progress of the message through the workflow. If any issues are encountered, the message tracking engine handles the encountered issues. In one aspect, the message tracking engine facilitates performance of one or more synchronous processing steps of the workflow during a first phase. Following the first phase, the message tracking engine serializes one or more asynchronous processing steps of the workflow to a storage device. After serializing the asynchronous processing steps, the message tracking engine facilitates performance of the asynchronous processing steps during a second phase.

摘要翻译： 消息跟踪引擎有助于通过确定的工作流处理消息。 特别地，消息跟踪引擎可以以工作流指定的顺序将消息路由到各种服务。 在处理期间，消息跟踪引擎通过工作流跟踪消息的进度。 如果遇到任何问题，邮件跟踪引擎可以处理遇到的问题。 在一个方面，消息跟踪引擎促进在第一阶段期间工作流的一个或多个同步处理步骤的性能。 在第一阶段之后，消息跟踪引擎将工作流的一个或多个异步处理步骤序列化到存储设备。 在串行化异步处理步骤之后，消息跟踪引擎便于在第二阶段期间执行异步处理步骤。

公开(公告)号：US20120104626A1

公开(公告)日：2012-05-03

申请号：US13343207

申请日：2012-01-04

申请人： Ajay Somani

发明人： Ajay Somani

IPC分类号： H01L23/498

CPC分类号： H01L25/50 ,  H01L21/6835 ,  H01L21/76898 ,  H01L24/16 ,  H01L25/0657 ,  H01L2224/13009 ,  H01L2224/13025 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/01078

摘要： An electronic device can include a first die having a first terminal at a first front side, and a second die having a second terminal at a second front side and a through via. In one aspect, a process of forming the electronic device includes supplying a second substrate including a die location of the second die. The process can also include attaching the second substrate to a handling substrate and singulating the second die from the second substrate before removing the handling substrate. In another aspect, the handling substrate can include a rigid substrate. The process can include orienting the front side of the first die and a back side of the second substrate front-to-back with respect to each other. In yet another aspect, the first terminal is electrically connected to the through via and the second terminal. In one embodiment, the electronic device can include a third die.

摘要翻译： 电子设备可以包括在第一前侧具有第一端子的第一管芯和在第二前侧具有第二端子的第二管芯和贯通通孔。 一方面，形成电子设备的过程包括提供包括第二管芯的管芯位置的第二衬底。 该方法还可以包括在移除处理衬底之前将第二衬底附接到处理衬底并且将第二裸片从第二衬底分离。 在另一方面，处理基板可以包括刚性基板。 该方法可以包括相对于彼此前后定向第一管芯的前侧和第二基板的背面。 在另一方面，第一端子电连接到通孔和第二端子。 在一个实施例中，电子设备可以包括第三管芯。

公开(公告)号：US20090001600A1

公开(公告)日：2009-01-01

申请号：US11770295

申请日：2007-06-28

申请人： Ajay Somani

发明人： Ajay Somani

IPC分类号： H01L23/48 ,  H01L21/00

CPC分类号： H01L25/50 ,  H01L21/6835 ,  H01L21/76898 ,  H01L24/16 ,  H01L25/0657 ,  H01L2224/13009 ,  H01L2224/13025 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/01078

摘要： An electronic device can include a first die having a first terminal at a first front side, and a second die having a second terminal at a second front side and a through via. In one aspect, a process of forming the electronic device includes supplying a second substrate including a die location of the second die. The process can also include attaching the second substrate to a handling substrate and singulating the second die from the second substrate before removing the handling substrate. In another aspect, the handling substrate can include a rigid substrate. The process can include orienting the front side of the first die and a back side of the second substrate front-to-back with respect to each other. In yet another aspect, the first terminal is electrically connected to the through via and the second terminal. In one embodiment, the electronic device can include a third die.

摘要翻译： 电子设备可以包括在第一前侧具有第一端子的第一管芯和在第二前侧具有第二端子的第二管芯和贯通通孔。 一方面，形成电子设备的过程包括提供包括第二管芯的管芯位置的第二衬底。 该方法还可以包括在移除处理衬底之前将第二衬底附接到处理衬底并且将第二裸片从第二衬底分离。 在另一方面，处理基板可以包括刚性基板。 该方法可以包括相对于彼此前后定向第一管芯的前侧和第二基板的背面。 在另一方面，第一端子电连接到通孔和第二端子。 在一个实施例中，电子设备可以包括第三管芯。

公开(公告)号：US08093102B2

公开(公告)日：2012-01-10

申请号：US11770295

申请日：2007-06-28

申请人： Ajay Somani

发明人： Ajay Somani

IPC分类号： H01L21/00

CPC分类号： H01L25/50 ,  H01L21/6835 ,  H01L21/76898 ,  H01L24/16 ,  H01L25/0657 ,  H01L2224/13009 ,  H01L2224/13025 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/01078

摘要： An electronic device can include a first die having a first terminal at a first front side, and a second die having a second terminal at a second front side and a through via. In one aspect, a process of forming the electronic device includes supplying a second substrate including a die location of the second die. The process can also include attaching the second substrate to a handling substrate and singulating the second die from the second substrate before removing the handling substrate. In another aspect, the handling substrate can include a rigid substrate. The process can include orienting the front side of the first die and a back side of the second substrate front-to-back with respect to each other. In yet another aspect, the first terminal is electrically connected to the through via and the second terminal. In one embodiment, the electronic device can include a third die.

摘要翻译： 电子设备可以包括在第一前侧具有第一端子的第一管芯和在第二前侧具有第二端子的第二管芯和贯通通孔。 一方面，形成电子设备的过程包括提供包括第二管芯的管芯位置的第二衬底。 该方法还可以包括在移除处理衬底之前将第二衬底附接到处理衬底并且将第二裸片从第二衬底分离。 在另一方面，处理基板可以包括刚性基板。 该方法可以包括相对于彼此前后定向第一管芯的前侧和第二基板的背面。 在另一方面，第一端子电连接到通孔和第二端子。 在一个实施例中，电子设备可以包括第三管芯。

公开(公告)号：US07514340B2

公开(公告)日：2009-04-07

申请号：US11368720

申请日：2006-03-06

申请人： Robert E. Jones ,  Ajay Somani

发明人： Robert E. Jones ,  Ajay Somani

IPC分类号： H01L21/30

CPC分类号： H01L21/76885 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/50 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13021 ,  H01L2224/13099 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2225/06513 ,  H01L2924/0001 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/19043

摘要： A method for making a composite integrated device includes providing a first integrated device having a substrate, an overlying interconnect region, and a contact, wherein the contact electrically contacts the interconnect region and is at a surface of the first integrated device. The method further includes forming a sidewall spacer along a sidewall of a first opening in a first dielectric layer, located over the surface of the integrated device, and providing a deformable metal feature adjacent to the sidewall spacer and in the first opening. The method further includes providing a second integrated device having a substrate, an overlying interconnect region, a contact, and a second dielectric layer surrounding the contact of the second integrated device. The method further includes contacting the contact of the second integrated device with the deformable metal feature and pressing the first dielectric layer against the second dielectric layer.

摘要翻译： 一种制造复合集成器件的方法包括提供具有衬底，上覆互连区和触点的第一集成器件，其中所述触点与所述互连区电接触并位于所述第一集成器件的表面。 该方法还包括沿位于集成器件表面上的第一介电层中的第一开口的侧壁形成侧墙，并提供邻近侧壁间隔物和第一开口中的可变形金属特征。 该方法还包括提供具有衬底，上覆互连区域，接触件和围绕第二集成器件的触点的第二介电层的第二集成器件。 该方法还包括使第二集成器件的触点与可变形金属特征接触，并将第一电介质层压在第二介电层上。

公开(公告)号：US20070170585A1

公开(公告)日：2007-07-26

申请号：US11368720

申请日：2006-03-06

申请人： Robert Jones ,  Ajay Somani

发明人： Robert Jones ,  Ajay Somani

IPC分类号： H01L23/48

CPC分类号： H01L21/76885 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/50 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13021 ,  H01L2224/13099 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2225/06513 ,  H01L2924/0001 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/19043

摘要： A method for making a composite integrated device includes providing a first integrated device having a substrate, an overlying interconnect region, and a contact, wherein the contact electrically contacts the interconnect region and is at a surface of the first integrated device. The method further includes forming a sidewall spacer along a sidewall of a first opening in a first dielectric layer, located over the surface of the integrated device, and providing a deformable metal feature adjacent to the sidewall spacer and in the first opening. The method further includes providing a second integrated device having a substrate, an overlying interconnect region, a contact, and a second dielectric layer surrounding the contact of the second integrated device. The method further includes contacting the contact of the second integrated device with the deformable metal feature and pressing the first dielectric layer against the second dielectric layer.

摘要翻译： 一种制造复合集成器件的方法包括提供具有衬底，上覆互连区和触点的第一集成器件，其中所述触点与所述互连区电接触并位于所述第一集成器件的表面。 该方法还包括沿位于集成器件表面上的第一介电层中的第一开口的侧壁形成侧墙，并提供邻近侧壁间隔物和第一开口中的可变形金属特征。 该方法还包括提供具有衬底，上覆互连区域，接触件和围绕第二集成器件的触点的第二介电层的第二集成器件。 该方法还包括使第二集成器件的触点与可变形金属特征接触，并将第一电介质层压在第二介电层上。