公开(公告)号：US5391919A

公开(公告)日：1995-02-21

申请号：US141402

申请日：1993-10-22

申请人： Aldo Torti ,  Emilio Mattiuzzo

发明人： Aldo Torti ,  Emilio Mattiuzzo

IPC分类号： H01L23/24 ,  H01L23/495 ,  H01L29/91 ,  H01L21/52 ,  H01L21/60 ,  H01L25/03

CPC分类号： H01L23/49575 ,  H01L23/24 ,  H01L23/49562 ,  H01L24/37 ,  H01L2224/37147 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  Y10S257/925

摘要： A semiconductor device module is formed of four identical frame sections which each have a flat base and perpendicularly extending strap terminal. Semiconductor chips are soldered to the center of the top surfaces of each base, and the devices are interconnected by flat brass strips having one end soldered to the top of one chip and the other end soldered to the base of an adjacent section. The base sections lie in a common plane at the bottom of an insulative filled insulation cup. The terminals extend parallel and out of the top of the cup.

摘要翻译： 半导体器件模块由四个相同的框架部分形成，每个部分具有平坦的基部和垂直延伸的带端子。 半导体芯片被焊接到每个基座的顶表面的中心，并且这些器件通过扁平的黄铜条相互连接，其一端焊接到一个芯片的顶部，另一端焊接到相邻部分的基部。 基座部分位于绝缘填充绝缘杯底部的公共平面中。 端子平行延伸出杯子的顶部。

公开(公告)号：US06559529B2

公开(公告)日：2003-05-06

申请号：US09829809

申请日：2001-04-10

申请人： Aldo Torti ,  Mario Merlin ,  Emilio Mattiuzzo

发明人： Aldo Torti ,  Mario Merlin ,  Emilio Mattiuzzo

IPC分类号： H01L2306

CPC分类号： H01L24/01 ,  H01L23/04 ,  H01L23/049 ,  H01L23/3135 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082

摘要： A force-fit diode for high circuit application has a cylindrical constant diameter conductive body which has a tapered top and bottom peripheral edge. An axial conductor extends from one end of the housing. The tapered top and bottom peripheral edges allow the housing to be forced into an opening in the bus, with either the housing bottom or the axial lead being the first to enter the openings.