中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

100 records (took 0.024 seconds)

    Current sensor integrated circuits
    3.
    发明授权
    Current sensor integrated circuits 有权

    公开(公告)号：US11644485B2

    公开(公告)日：2023-05-09

    申请号：US17495879

    申请日：2021-10-07

    Applicant: Allegro MicroSystems, LLC

    Inventor： Shixi Louis Liu ,  Paul A. David ,  Natasha Healey

    IPC: G01R15/20 ,  H01L23/49 ,  G01R19/00 ,  H01L23/495

    CPC classification number: G01R19/0092 ,  G01R15/207 ,  H01L23/49541 ,  H01L23/49575 ,  H01L2224/49171

    Abstract: A current sensor integrated circuit configured to sense a current through a current conductor includes a lead frame at least one signal lead, a fan out wafer level package (FOWLP), and a mold material enclosing the FOWLP and a portion of the lead frame. The FOWLP includes a semiconductor die configured to support at least one magnetic field sensing element to sense a magnetic field associated with the current, wherein the semiconductor die has a first surface on which at least one connection pad is accessible, a redistribution layer in contact with the at least one connection pad, and an insulating layer in contact with the redistribution layer, wherein the insulating layer is configured to extend beyond a periphery of the semiconductor die by a minimum distance. The die connection pad is configured to be electrically coupled to the at least one signal lead.

    Current sensor integrated circuits
    4.
    发明授权
    Current sensor integrated circuits 有权

    公开(公告)号：US11519939B2

    公开(公告)日：2022-12-06

    申请号：US17472769

    申请日：2021-09-13

    Applicant: Allegro MicroSystems, LLC

    Inventor： Shixi Louis Liu ,  Paul A. David ,  Shaun D. Milano ,  Rishikesh Nikam ,  Alexander Latham ,  Wade Bussing ,  Natasha Healey ,  Georges El Bacha

    IPC: H01L21/44 ,  G01R15/08 ,  H01L43/04 ,  H01L43/06

    Abstract: A current sensor integrated circuit (IC) includes a unitary lead frame having at least one first lead having a terminal end, at least one second lead having a terminal end, and a paddle having a first surface and a second opposing surface. A semiconductor die is supported by the first surface of the paddle, wherein the at least one first lead is electrically coupled to the semiconductor die and the at least one second lead is electrically isolated from the semiconductor die. The current sensor IC further includes a first mold material configured to enclose the semiconductor die and the paddle and a second mold material configured to enclose at least a portion of the first mold material, wherein the terminal end of the at least one first lead and the terminal end of the at least one second lead are external to the second mold material.

    SENSOR INTEGRATED CIRCUIT WITH INTEGRATED COIL
    5.
    发明申请
    SENSOR INTEGRATED CIRCUIT WITH INTEGRATED COIL 有权

    公开(公告)号：US20220310853A1

    公开(公告)日：2022-09-29

    申请号：US17806758

    申请日：2022-06-14

    Applicant: Allegro MicroSystems, LLC

    Inventor： Ravi Vig ,  William P. Taylor ,  Paul A. David ,  P. Karl Scheller ,  Andreas P. Friedrich

    IPC: H01L29/82 ,  G01R33/06 ,  G01R33/00 ,  G01D5/14

    Abstract: A sensor includes a lead frame having a first surface, a second opposing surface, and a plurality of leads and a semiconductor die having a first surface attached to the first surface of the lead frame and a second, opposing surface. The sensor further includes a non-conductive mold material enclosing the die and at least a portion of the lead frame, a conductive coil secured to the non-conductive mold material, a mold material secured to the non-conductive mold material and enclosing the conductive coil, wherein the mold material has a central region and an element disposed in the central region of the mold material.

    CURRENT SENSOR INTEGRATED CIRCUITS
    6.
    发明申请
    CURRENT SENSOR INTEGRATED CIRCUITS 有权

    公开(公告)号：US20210405092A1

    公开(公告)日：2021-12-30

    申请号：US17472769

    申请日：2021-09-13

    Applicant: Allegro MicroSystems, LLC

    Inventor： Shixi Louis Liu ,  Paul A. David ,  Shaun D. Milano ,  Rishikesh Nikam ,  Alexander Latham ,  Wade Bussing ,  Natasha Healey ,  Georges El Bacha

    IPC: G01R15/08 ,  H01L43/04 ,  H01L43/06

    Abstract: A current sensor integrated circuit (IC) includes a unitary lead frame having at least one first lead having a terminal end, at least one second lead having a terminal end, and a paddle having a first surface and a second opposing surface. A semiconductor die is supported by the first surface of the paddle, wherein the at least one first lead is electrically coupled to the semiconductor die and the at least one second lead is electrically isolated from the semiconductor die. The current sensor IC further includes a first mold material configured to enclose the semiconductor die and the paddle and a second mold material configured to enclose at least a portion of the first mold material, wherein the terminal end of the at least one first lead and the terminal end of the at least one second lead are external to the second mold material.

    Current sensor integrated circuits
    7.
    发明授权
    Current sensor integrated circuits 有权

    公开(公告)号：US11150273B2

    公开(公告)日：2021-10-19

    申请号：US16884311

    申请日：2020-05-27

    Applicant: Allegro MicroSystems, LLC

    Inventor： Shixi Louis Liu ,  Paul A. David ,  Shaun D. Milano ,  Rishikesh Nikam ,  Alexander Latham ,  Wade Bussing ,  Natasha Healey ,  Georges El Bacha

    IPC: H01L23/495 ,  G01R15/08 ,  H01L43/04 ,  H01L43/06

    Abstract: A current sensor integrated circuit (IC) includes a unitary lead frame having at least one first lead having a terminal end, at least one second lead having a terminal end, and a paddle having a first surface and a second opposing surface. A semiconductor die is supported by the first surface of the paddle, wherein the at least one first lead is electrically coupled to the semiconductor die and the at least one second lead is electrically isolated from the semiconductor die. The current sensor IC further includes a first mold material configured to enclose the semiconductor die and the paddle and a second mold material configured to enclose at least a portion of the first mold material, wherein the terminal end of the at least one first lead and the terminal end of the at least one second lead are external to the second mold material.

    Magnetic field sensor and method having reduced false switching
    9.
    发明授权
    Magnetic field sensor and method having reduced false switching 有权

    公开(公告)号：US10976183B2

    公开(公告)日：2021-04-13

    申请号：US16522810

    申请日：2019-07-26

    Applicant: Allegro MicroSystems, LLC

    Inventor： Paul A. David ,  William P. Taylor

    IPC: G01D5/244

    Abstract: A magnetic field sensor includes a substrate first and second magnetic field sensing elements, comprising first and second magnetoresistance elements, respectively. The first and second magnetic field sensing elements are responsive to the magnet. At or more positions of the magnet relative to the first and second magnetic field sensing elements while the magnet is stopped moving, at least one of the first magnetic field sensing element or the second magnetic field sensing element is in saturation in response to the magnet. The magnetic field sensor also includes a third magnetic field sensing element proximate to the first and second magnetoresistance elements, the third magnetic field sensing element operable to generate a third magnetic field sensing element signal responsive to the magnet, wherein, at the one or more positions while the magnet is stopped moving, the third magnetic field sensing element is not in saturation in response to the magnet or saturates at a higher magnetic field than the first and second magnetic field sensing elements in response to the magnet.

    Magnetic field sensor able to identify an error condition
    10.
    发明授权
    Magnetic field sensor able to identify an error condition 有权

    公开(公告)号：US10921373B2

    公开(公告)日：2021-02-16

    申请号：US15825879

    申请日：2017-11-29

    Applicant: Allegro MicroSystems, LLC

    Inventor： Rémy Lassalle-Balier ,  Jeffrey Eagen ,  Paul A. David

    IPC: G01R31/319 ,  G01R33/09 ,  G01D5/14 ,  G01D18/00

    Abstract: A method of determining an error condition in a magnetic field sensor can include receiving a first bridge signal, the first bridge signal generated by a first full bridge circuit. The method can also include receiving a second bridge signal, the second bridge signal generated by a second full bridge circuit. The method can also include determining a bridge separation from the first bridge signal and the second bridge signal. The method can also include comparing a function of the bridge separation to a threshold value. The method can also include generating an error signal indicative of the error condition or not indicative of the error condition in response to the comparing.

Patent Agency Ranking