公开(公告)号：US11842974B2

公开(公告)日：2023-12-12

申请号：US16612883

申请日：2018-05-11

Applicant: Alpha Assembly Solutions Inc.

Inventor： Angelo Gulino ,  Bogdan Bankiewicz ,  Oscar Khaselev ,  Anna Lifton ,  Michael T. Marczi ,  Girard Sidone ,  Paul Salerno ,  Paul J. Koep

IPC: H01L23/00 ,  B23K35/26 ,  B23K35/30 ,  C22C13/00 ,  B23K101/42

CPC classification number: H01L24/29 ,  B23K35/262 ,  B23K35/302 ,  C22C13/00 ,  H01L24/83 ,  B23K2101/42 ,  H01L2224/29209 ,  H01L2224/29211 ,  H01L2224/29216 ,  H01L2224/29239 ,  H01L2224/29247 ,  H01L2224/29311 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/83815 ,  H01L2924/014 ,  H01L2924/0105 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01082

Abstract: A solder material comprising a solder alloy and a thermal conductivity modifying component. The solder material has a bulk thermal conductivity of between about 75 and about 150 W/m-K and is usable in enhancing the thermal conductivity of the solder, allowing for optimal heat transfer and reliability in electronic packaging applications.