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公开(公告)号：US20190157535A1
公开(公告)日：2019-05-23
申请号：US16257441
申请日：2019-01-25
Applicant: Alpha Assembly Solutions Inc.
Inventor： Morgana de Avila Ribas , Pritha Choudhury , Siuli Sarkar , Ranjit Pandher , Nicholas G. Herrick , Amit Patel , Ravindra M. Bhatkal , Bawa Singh
Abstract: Improved electrical and thermal properties of solder alloys are achieved by the use of micro-additives in solder alloys to engineer the electrical and thermal properties of the solder alloys and the properties of the reaction layers between the solder and the metal surfaces. The electrical and thermal conductivity of alloys and that of the reaction layers between the solder and the -metal surfaces can be controlled over a wide range of temperatures. The solder alloys produce stable microstructures wherein such stable microstructures of these alloys do not exhibit significant changes when exposed to changes in temperature, compared to traditional interconnect materials.
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公开(公告)号：US12084583B2
公开(公告)日：2024-09-10
申请号：US17524891
申请日：2021-11-12
Applicant: Alpha Assembly Solutions Inc.
Inventor： Narahari Pujari , Jayaprakash Sundaramurthy , Siuli Sarkar , Ravindra M. Bhatkal
IPC: C09D11/322 , B41F15/40 , B41M5/00 , C09D11/037 , C09D11/101 , C09D11/102 , C09D11/104 , C09D11/107 , C09D11/38 , H05K1/03 , H05K3/00 , C09D11/30
CPC classification number: C09D11/322 , B41F15/40 , B41M5/0023 , C09D11/037 , C09D11/101 , C09D11/102 , C09D11/104 , C09D11/107 , C09D11/38 , H05K1/0393 , H05K3/0011 , C09D11/30 , H05K2201/0133 , C09D11/10 , C09D11/52
Abstract: The present invention relates to flexible and stretchable UV and thermally curable dielectric ink compositions that can be thermo or vacuum formed. The flexible ink can form a stretchable dielectric coating having excellent adhesion. The dielectric ink compositions can be applied on a circuit board, such as a paper-phenolic resin board, plastic board (PMMA, PET or the like) or a glass-epoxy resin board, by screen printing or the like, followed by heat/UV curing. The compositions are suitable for use in applications such as a capacitive touch, in-mold forming, creating cross over insulation layers, and manufacturing electronic circuitry and devices.
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公开(公告)号：US11193031B2
公开(公告)日：2021-12-07
申请号：US16613344
申请日：2018-05-14
Applicant: Alpha Assembly Solutions Inc.
Inventor： Narahari Pujari , Jayaprakash Sundaramurthy , Siuli Sarkar , Ravindra M. Bhatkal
IPC: C09D11/322 , B41F15/40 , B41M5/00 , C09D11/037 , C09D11/101 , C09D11/102 , C09D11/104 , C09D11/107 , C09D11/38 , H05K1/03 , H05K3/00 , C09D11/30
Abstract: The present invention relates to flexible and stretchable UV and thermally curable dielectric ink compositions that can be thermo or vacuum formed. The flexible ink can form a stretchable dielectric coating having excellent adhesion. The dielectric ink compositions can be applied on a circuit board, such as a paper-phenolic resin board, plastic board (PMMA, PET or the like) or a glass-epoxy resin board, by screen printing or the like, followed by heat/UV curing. The compositions are suitable for use in applications such as a capacitive touch, in-mold forming, creating cross over insulation layers, and manufacturing electronic circuitry and devices.
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