公开(公告)号：US10019029B1

公开(公告)日：2018-07-10

申请号：US14791708

申请日：2015-07-06

Applicant: Amazon Technologies, Inc.

Inventor： Michael Xingyi Yu ,  Brandon Michael Potens ,  Kelly Erin Johnson ,  Mark Novak ,  Ge PengJin ,  Robert Cong Liang ,  Angel Wilfredo Martinez ,  Srivatsan Subbarayan ,  Mandar Nilkanth Kulkarni ,  Marc Anthony Zampino ,  Felipe Alonso Varela ,  Michael Christopher Kouxommone

IPC: G06F1/16 ,  G02F1/1333 ,  B29C67/00 ,  H05K7/14 ,  B29C45/14 ,  B29C45/16 ,  H05K5/00 ,  H05K5/03 ,  G06F1/18 ,  B29K69/00 ,  B29K705/00 ,  B29L31/34

CPC classification number: G06F1/1601 ,  B29C45/14336 ,  B29C45/1671 ,  B29C45/1676 ,  B29K2069/00 ,  B29K2105/08 ,  B29K2105/12 ,  B29K2705/00 ,  B29L2031/3481 ,  G06F1/1626 ,  G06F1/1635 ,  G06F1/1637 ,  G06F1/183 ,  H05K7/1417

Abstract: A housing for an electronic device includes a single rear housing assembly coupled to the cover glass of a display assembly. The rear housing assembly includes a metal rear chassis with two layers of injection molded material formed on at least the chassis side regions. The first injection molded layer includes a high reinforcing agent content percentage to provide increased stiffness, and the second injection molded layer includes a low reinforcing agent content percentage, which provides less structural support than the first injection molded layer, but an improved aesthetic appearance.