公开(公告)号：US09218020B1

公开(公告)日：2015-12-22

申请号：US14195523

申请日：2014-03-03

Applicant: Amazon Technologies, Inc.

Inventor： Angel Wilfredo Martinez ,  Michael Xingyi Yu ,  Joshua Paul Davies ,  Brandon Michael Potens ,  Andrew McIntyre ,  Joshua Danel Lemons ,  Kelly Erin Johnson

IPC: G06F1/16

CPC classification number: G06F1/1656

Abstract: A computing device is assembled to withstand drops, to be re-workable, and to reduce unaesthetic variances between the components. A computing device has a display module that is removably hinged on the bottom, held in place by snap fits on the top before being screwed in place, and held in place by replaceable snap fits on the sides. A battery module and a battery connector can be secured in place with stretch removable tape. A peripheral port component may be biased towards an interior of the housing opening when installed. A laser direct structuring antenna module located in a recess of a plastic molding can be grounded to a metal alloy housing. A plastic molding can be mechanically interlocked to a housing.

Abstract translation: 组装计算装置可以承受液滴，可重复使用，并减少组件之间的不美观差异。 计算设备具有可拆卸地铰接在底部的显示模块，通过在被拧入就位之前通过卡扣配合保持在适当的位置，并且通过可更换的卡扣配合保持在适当的位置。 电池模块和电池连接器可以用伸缩式可移动胶带固定到位。 当安装时，外围端口部件可以朝向壳体开口的内部偏置。 位于塑料模制件的凹部中的激光直接结构化天线模块可以接地到金属合金外壳。 塑料模制件可以机械地互锁到外壳。

公开(公告)号：US10019029B1

公开(公告)日：2018-07-10

申请号：US14791708

申请日：2015-07-06

Applicant: Amazon Technologies, Inc.

Inventor： Michael Xingyi Yu ,  Brandon Michael Potens ,  Kelly Erin Johnson ,  Mark Novak ,  Ge PengJin ,  Robert Cong Liang ,  Angel Wilfredo Martinez ,  Srivatsan Subbarayan ,  Mandar Nilkanth Kulkarni ,  Marc Anthony Zampino ,  Felipe Alonso Varela ,  Michael Christopher Kouxommone

IPC: G06F1/16 ,  G02F1/1333 ,  B29C67/00 ,  H05K7/14 ,  B29C45/14 ,  B29C45/16 ,  H05K5/00 ,  H05K5/03 ,  G06F1/18 ,  B29K69/00 ,  B29K705/00 ,  B29L31/34

CPC classification number: G06F1/1601 ,  B29C45/14336 ,  B29C45/1671 ,  B29C45/1676 ,  B29K2069/00 ,  B29K2105/08 ,  B29K2105/12 ,  B29K2705/00 ,  B29L2031/3481 ,  G06F1/1626 ,  G06F1/1635 ,  G06F1/1637 ,  G06F1/183 ,  H05K7/1417

Abstract: A housing for an electronic device includes a single rear housing assembly coupled to the cover glass of a display assembly. The rear housing assembly includes a metal rear chassis with two layers of injection molded material formed on at least the chassis side regions. The first injection molded layer includes a high reinforcing agent content percentage to provide increased stiffness, and the second injection molded layer includes a low reinforcing agent content percentage, which provides less structural support than the first injection molded layer, but an improved aesthetic appearance.