公开(公告)号：US20190254185A1

公开(公告)日：2019-08-15

申请号：US16396456

申请日：2019-04-26

Applicant: Apple Inc.

Inventor： Tyler B. CATER ,  Benjamin J. POPE ,  Scott A. MYERS ,  Benjamin Shane BUSTLE ,  Tseng-Mau YANG ,  Adam J. BRINKMAN

IPC: H05K5/02 ,  H04B1/3827 ,  H04M1/02 ,  H01Q1/52 ,  H01Q1/24 ,  G06F1/16

CPC classification number: H05K5/0208 ,  B29C37/0085 ,  B29C45/14311 ,  B29C45/14467 ,  G06F1/1626 ,  H01Q1/24 ,  H01Q1/243 ,  H01Q1/521 ,  H04B1/3827 ,  H04M1/0202 ,  H04M1/0249 ,  H04M1/185 ,  H05K5/0217

Abstract: An electronic device having multiple housing components interlocked together by a molded material is disclosed. In order to provide interlocking surfaces for the molded material, the housing components can include various geometries designed to receive and retain the molded material such that the housing components are secured with one another. For example, a first housing part can undergo several material removal operations to form multiple ribs, each with through holes. When the molded material extends along the ribs and into the through holes, the molded material cures and interlocks with the first housing part. A second housing part can include several stepped indentions that receive the molded material. Also, a third housing part can include a dovetail indention to receive the molded material such that the first and second housing parts interlock with the third housing part. The indentions can provide retention in three dimensions to protect against decoupling.

公开(公告)号：US20190082546A1

公开(公告)日：2019-03-14

申请号：US16127064

申请日：2018-09-10

Applicant: Apple Inc.

Inventor： Marwan RAMMAH ,  Lee E. HOOTON ,  Srikanth V. THIRUPPUKUZHI ,  Stoyan P. HRISTOV ,  Adam J. BRINKMAN ,  James A. BERTIN

IPC: H05K5/00 ,  H05K5/02 ,  H05K5/03 ,  H05K5/06 ,  H05K9/00

Abstract: This application relates to an enclosure for a portable electronic device. The enclosure includes a protruding trim structure having walls that define a cavity, where the protruding trim structure is capable of carrying an electronic component within the cavity. The enclosure further includes a support plate that is coupled to the enclosure and the protruding trim structure, and a brace structure that secures and supports the protruding trim structure such that when the protruding trim structure is exposed to an external load during a drop event, the protruding trim structure is capable of redirecting an amount of the load away from the protruding trim structure and the electronic component.

公开(公告)号：US20180070465A1

公开(公告)日：2018-03-08

申请号：US15454826

申请日：2017-03-09

Applicant: Apple Inc.

Inventor： Tyler B. CATER ,  Benjamin J. POPE ,  Scott A. MYERS ,  Benjamin Shane BUSTLE ,  Tseng-Mau YANG ,  Adam J. BRINKMAN

IPC: H05K5/02 ,  H01Q1/24 ,  H04B1/3827

CPC classification number: H05K5/0208 ,  G06F1/1626 ,  H01Q1/24 ,  H01Q1/243 ,  H01Q1/521 ,  H04B1/3827 ,  H04M1/0202 ,  H05K5/0217

Abstract: An electronic device having multiple housing components interlocked together by a molded material is disclosed. In order to provide interlocking surfaces for the molded material, the housing components can include various geometries designed to receive and retain the molded material such that the housing components are secured with one another. For example, a first housing part can undergo several material removal operations to form multiple ribs, each with through holes. When the molded material extends along the ribs and into the through holes, the molded material cures and interlocks with the first housing part. A second housing part can include several stepped indentions that receive the molded material. Also, a third housing part can include a dovetail indention to receive the molded material such that the first and second housing parts interlock with the third housing part. The indentions can provide retention in three dimensions to protect against decoupling.