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    Method and system for CMOS based MEMS bump stop contact damage prevention
    1.
    发明授权
    Method and system for CMOS based MEMS bump stop contact damage prevention 有权

    公开(公告)号：US09751756B2

    公开(公告)日：2017-09-05

    申请号：US14451092

    申请日：2014-08-04

    Applicant: Apple Inc.

    Inventor： Milind S. Bhagavat ,  Richard Yeh ,  Henry H. Yang

    IPC: H01L21/00 ,  B81C1/00

    CPC classification number: B81C1/00825 ,  B81B2203/0118 ,  B81B2207/115

    Abstract: In some embodiments, a microelectromechanical system may include a semiconductor substrate, a plurality of wiring layers, and a stop. The plurality of wiring layers may be coupled to a first surface of the semiconductor substrate. The stop may be coupled to the plurality of wiring layers. In some embodiments, at least a portion of the plurality of wiring layers between the stop and the first surface of the substrate comprises an insulating material. In some embodiments, at least the portion excludes wiring within. In some embodiments, a volume of the portion may be determined by a use of the microelectromechanical system. In some embodiments, the portion may inhibit, during use, electrical failures adjacent to the stop.

    Biometric Sensor Chip Having Distributed Sensor and Control Circuitry
    2.
    发明申请
    Biometric Sensor Chip Having Distributed Sensor and Control Circuitry 有权
    具有分布式传感器和控制电路的生物传感器芯片

    公开(公告)号：US20160278671A1

    公开(公告)日：2016-09-29

    申请号：US15181229

    申请日：2016-06-13

    Applicant: Apple Inc.

    Inventor： Milind S. Bhagavat ,  Jun Zhai

    IPC: A61B5/1172 ,  G06K9/00 ,  A61B5/053

    CPC classification number: A61B5/1172 ,  A61B5/053 ,  A61B2562/0214 ,  A61B2562/182 ,  G06K9/0002 ,  H01L27/14634 ,  H01L27/14636

    Abstract: A sensor includes a sensor array formed on a first side of a substrate and at least one circuit operative to communicate with the sensor array formed on a second side of the substrate. At least one via extends through the substrate to electrically connect the sensor array to the at least one circuit. Placing the at least one circuit on the second side of the substrate allows the sensor array to occupy substantially all of the first side of the substrate.

    Abstract translation: 传感器包括形成在基板的第一侧上的传感器阵列和至少一个可操作地与形成在基板的第二侧上的传感器阵列通信的电路。 至少一个通孔延伸穿过衬底以将传感器阵列电连接到至少一个电路。 将至少一个电路放置在基板的第二侧上，使得传感器阵列基本上占据基板的所有第一侧。

    Biometric sensor chip having distributed sensor and control circuitry
    3.
    发明授权
    Biometric sensor chip having distributed sensor and control circuitry 有权
    具有分布式传感器和控制电路的生物传感器芯片

    公开(公告)号：US09305959B2

    公开(公告)日：2016-04-05

    申请号：US14294903

    申请日：2014-06-03

    Applicant: Apple Inc.

    Inventor： Milind S. Bhagavat ,  Jun Zhai

    IPC: G06K9/00 ,  H01L27/146

    CPC classification number: G06K9/0002 ,  H01L27/14634 ,  H01L27/14636

    Abstract: A sensor includes a sensor array formed on a first side of a substrate and at least one circuit operative to communicate with the sensor array formed on a second side of the substrate. At least one via extends through the substrate to electrically connect the sensor array to the at least one circuit. Placing the at least one circuit on the second side of the substrate allows the sensor array to occupy substantially all of the first side of the substrate.

    Abstract translation: 传感器包括形成在基板的第一侧上的传感器阵列和至少一个可操作地与形成在基板的第二侧上的传感器阵列通信的电路。 至少一个通孔延伸穿过衬底以将传感器阵列电连接到至少一个电路。 将至少一个电路放置在基板的第二侧上，使得传感器阵列基本上占据基板的所有第一侧。

    Biometric Sensor Chip Having Distributed Sensor And Control Circuitry
    6.
    发明申请
    Biometric Sensor Chip Having Distributed Sensor And Control Circuitry 审中-公开
    具有分布式传感器和控制电路的生物传感器芯片

    公开(公告)号：US20160217311A1

    公开(公告)日：2016-07-28

    申请号：US15090474

    申请日：2016-04-04

    Applicant: Apple Inc.

    Inventor： Milind S. Bhagavat ,  Jun Zhai

    IPC: G06K9/00

    CPC classification number: G06K9/0002 ,  H01L27/14634 ,  H01L27/14636

    Abstract: A sensor includes a sensor array formed on a first side of a substrate and at least one circuit operative to communicate with the sensor array formed on a second side of the substrate. At least one via extends through the substrate to electrically connect the sensor array to the at least one circuit. Placing the at least one circuit on the second side of the substrate allows the sensor array to occupy substantially all of the first side of the substrate.

    Abstract translation: 传感器包括形成在基板的第一侧上的传感器阵列和至少一个可操作地与形成在基板的第二侧上的传感器阵列通信的电路。 至少一个通孔延伸穿过衬底以将传感器阵列电连接到至少一个电路。 将至少一个电路放置在基板的第二侧上，使得传感器阵列基本上占据基板的所有第一侧。

    METHOD AND SYSTEM FOR CMOS BASED MEMS BUMP STOP CONTACT DAMAGE PREVENTION
    7.
    发明申请
    METHOD AND SYSTEM FOR CMOS BASED MEMS BUMP STOP CONTACT DAMAGE PREVENTION 有权
    基于CMOS的MEMS BUMP停止触点损伤预防方法与系统

    公开(公告)号：US20150291413A1

    公开(公告)日：2015-10-15

    申请号：US14451092

    申请日：2014-08-04

    Applicant: Apple Inc.

    Inventor： Milind S. Bhagavat ,  Richard Yeh ,  Henry H. Yang

    IPC: B81B3/00 ,  B81C1/00

    CPC classification number: B81C1/00825 ,  B81B2203/0118 ,  B81B2207/115

    Abstract: In some embodiments, a microelectromechanical system may include a semiconductor substrate, a plurality of wiring layers, and a stop. The plurality of wiring layers may be coupled to a first surface of the semiconductor substrate. The stop may be coupled to the plurality of wiring layers. In some embodiments, at least a portion of the plurality of wiring layers between the stop and the first surface of the substrate comprises an insulating material. In some embodiments, at least the portion excludes wiring within. In some embodiments, a volume of the portion may be determined by a use of the microelectromechanical system. In some embodiments, the portion may inhibit, during use, electrical failures adjacent to the stop.

    Abstract translation: 在一些实施例中，微机电系统可以包括半导体衬底，多个布线层和停止件。 多个布线层可以耦合到半导体基板的第一表面。 止动件可以联接到多个布线层。 在一些实施例中，多个布线层的至少部分在基片的止挡件和第一表面之间包括绝缘材料。 在一些实施例中，至少该部分排除其内的布线。 在一些实施例中，该部分的体积可以通过使用微机电系统来确定。 在一些实施例中，该部分在使用期间可以阻止与停止相邻的电气故障。

    METHOD AND SYSTEM FOR CMOS BASED MEMS BUMP STOP CONTACT DAMAGE PREVENTION
    10.
    发明申请
    METHOD AND SYSTEM FOR CMOS BASED MEMS BUMP STOP CONTACT DAMAGE PREVENTION 审中-公开

    公开(公告)号：US20170355599A1

    公开(公告)日：2017-12-14

    申请号：US15669231

    申请日：2017-08-04

    Applicant: Apple Inc.

    Inventor： Milind S. Bhagavat ,  Richard Yeh ,  Henry H. Yang

    IPC: B81C1/00

    CPC classification number: B81C1/00825 ,  B81B2203/0118 ,  B81B2207/115

    Abstract: In some embodiments, a microelectromechanical system may include a semiconductor substrate, a plurality of wiring layers, and a stop. The plurality of wiring layers may be coupled to a first surface of the semiconductor substrate. The stop may be coupled to the plurality of wiring layers. In some embodiments, at least a portion of the plurality of wiring layers between the stop and the first surface of the substrate comprises an insulating material. In some embodiments, at least the portion excludes wiring within. In some embodiments, a volume of the portion may be determined by a use of the microelectromechanical system. In some embodiments, the portion may inhibit, during use, electrical failures adjacent to the stop.

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