公开(公告)号：US10734269B1

公开(公告)日：2020-08-04

申请号：US15914595

申请日：2018-03-07

Applicant: Apple Inc.

Inventor： Dariusz Golda ,  James M. Perkins ,  Andreas Bibl ,  Sumant Sood ,  Hyeun-Su Kim

IPC: H01L21/683 ,  H01L23/00 ,  H01L25/075 ,  H01L33/62 ,  H01L21/67 ,  B65G47/92 ,  H01L33/06 ,  H01L33/30 ,  H01L33/28 ,  H01L33/60

Abstract: Metal-to-metal adhesion joints are described as a manner to hold down micro devices to a carrier substrate within the context of a micro device transfer manufacturing process. In accordance with embodiments, the metal-to-metal adhesion joints must be broken in order to pick up the micro devices from a carrier substrate, resulting in micro devices with nubs protruding from bottom contacts of the micro devices. Once integrated, the micro devices are bonded to a receiving substrate, the nubs may be embedded in a metallic joint, or alternatively be diffused within the metallic joint as interstitial metallic material that is embedded within the metallic joint.