公开(公告)号：US20230307590A1

公开(公告)日：2023-09-28

申请号：US18161764

申请日：2023-01-30

Applicant: Apple Inc.

Inventor： Young Cheol Yang ,  Young Seok Kim ,  Aaron L Holsteen ,  Cheng Cheng ,  Chin Wei Hsu ,  Hsin I Lu ,  Ileana G. Rau ,  Jaein Choi ,  James M. Perkins ,  James P. Ibbetson ,  Joy M. Johnson ,  Jui-Chih Liao ,  Steven E. Molesa ,  Sunggu Kang ,  Yang Deng ,  Zhibing Ge

IPC: H01L33/58 ,  H01L25/075 ,  H01L33/50 ,  H01L33/10

CPC classification number: H01L33/58 ,  H01L25/0753 ,  H01L33/505 ,  H01L33/10

Abstract: An electronic device may have a display with an array of inorganic light-emitting diodes. The array of inorganic light-emitting diodes may be overlapped by a polarizer layer such as a circular polarizer. Alternatively, the display may be a polarizer-free display without any polarizer layer over the array of inorganic light-emitting diodes. Each inorganic light-emitting diode may be surrounded by a diffuser that redirects edge-emissions towards a viewer. A top diffuser, a color filter layer, a microlens, and/or a microlens with color filtering and/or diffusive properties may also optionally overlap each inorganic light-emitting diode. The inorganic light-emitting diodes may have reflective sidewalls to mitigate edge-emissions. In this type of arrangement, the array of inorganic light-emitting diodes may be coplanar with one or more opaque masking layers. To mitigate reflections, the display may include two opaque masking layers having differing properties or a single phase separated opaque masking layer.

公开(公告)号：US10734269B1

公开(公告)日：2020-08-04

申请号：US15914595

申请日：2018-03-07

Applicant: Apple Inc.

Inventor： Dariusz Golda ,  James M. Perkins ,  Andreas Bibl ,  Sumant Sood ,  Hyeun-Su Kim

IPC: H01L21/683 ,  H01L23/00 ,  H01L25/075 ,  H01L33/62 ,  H01L21/67 ,  B65G47/92 ,  H01L33/06 ,  H01L33/30 ,  H01L33/28 ,  H01L33/60

Abstract: Metal-to-metal adhesion joints are described as a manner to hold down micro devices to a carrier substrate within the context of a micro device transfer manufacturing process. In accordance with embodiments, the metal-to-metal adhesion joints must be broken in order to pick up the micro devices from a carrier substrate, resulting in micro devices with nubs protruding from bottom contacts of the micro devices. Once integrated, the micro devices are bonded to a receiving substrate, the nubs may be embedded in a metallic joint, or alternatively be diffused within the metallic joint as interstitial metallic material that is embedded within the metallic joint.