Foldable case for use with an electronic device

    公开(公告)号:US10591956B2

    公开(公告)日:2020-03-17

    申请号:US15694094

    申请日:2017-09-01

    Applicant: Apple Inc.

    Abstract: This is directed to a case for securing and protecting an electronic device. The case can include a cover connected to a pouch by a hinge such that the cover can be overlaid over a device interface (e.g., a device display). The case can be constructed by layering and combining several types of materials, including for example materials having resistant outer surfaces, materials limiting the deformation of the case, materials providing a soft surface to be placed in contact with the device, and rigid materials for defining a structure of the case. In some embodiments, the case can include a tab that allows a user to fold open the cover of the case to form a triangular prism. The prism can be placed on any of its surfaces such that the device can be oriented towards a user at particular angles (e.g., a typing-specific orientation and a media playback orientation).

    Electronic device enclosures and heatsink structures with thermal management features
    2.
    发明授权
    Electronic device enclosures and heatsink structures with thermal management features 有权
    具有热管理功能的电子设备外壳和散热器结构

    公开(公告)号:US09095076B2

    公开(公告)日:2015-07-28

    申请号:US14271353

    申请日:2014-05-06

    Applicant: Apple Inc.

    CPC classification number: H05K7/20436 H05K13/00 Y10T29/49002

    Abstract: An electronic device may have a housing in which electronic components are mounted. The electronic components may be mounted to a substrate such as a printed circuit board. A heat sink structure may dissipate heat generated by the electronic components. The housing may have a housing wall that is separated from the heat sink structure by an air gap. The housing wall may have integral support structures. Each of the support structures may have an inwardly protruding portion that protrudes through a corresponding opening in the heat sink structure. The protruding portions may each have a longitudinal axis and a cylindrical cavity that lies along the longitudinal axis. Each of the support structures may have fins that extend radially outward from the longitudinal axis.

    Abstract translation: 电子设备可以具有其中安装电子部件的壳体。 电子部件可以安装到诸如印刷电路板的基板上。 散热器结构可以散发由电子部件产生的热量。 壳体可以具有通过气隙与散热器结构分离的壳体壁。 外壳壁可以具有整体的支撑结构。 每个支撑结构可以具有突出穿过散热器结构中的对应开口的向内突出的部分。 突出部分可以各自具有纵向轴线和位于纵向轴线的圆柱形空腔。 每个支撑结构可以具有从纵向轴线径向向外延伸的翅片。

    FOLDABLE CASE FOR USE WITH AN ELECTRONIC DEVICE
    3.
    发明申请
    FOLDABLE CASE FOR USE WITH AN ELECTRONIC DEVICE 审中-公开
    与电子设备一起使用的折叠盒

    公开(公告)号:US20140183068A1

    公开(公告)日:2014-07-03

    申请号:US14167600

    申请日:2014-01-29

    Applicant: Apple Inc.

    Abstract: This is directed to a case for securing and protecting an electronic device. The case can include a cover connected to a pouch by a hinge such that the cover can be overlaid over a device interface (e.g., a device display). The case can be constructed by layering and combining several types of materials, including for example materials having resistant outer surfaces, materials limiting the deformation of the case, materials providing a soft surface to be placed in contact with the device, and rigid materials for defining a structure of the case. In some embodiments, the case can include a tab that allows a user to fold open the cover of the case to form a triangular prism. The prism can be placed on any of its surfaces such that the device can be oriented towards a user at particular angles (e.g., a typing-specific orientation and a media playback orientation).

    Abstract translation: 这是针对用于固定和保护电子设备的情况。 壳体可以包括通过铰链连接到袋的盖,使得盖可以覆盖在设备接口(例如,设备显示器)上。 这种情况可以通过层叠和组合几种类型的材料来构造,例如包括具有耐磨性外表面的材料,限制壳体变形的材料,提供要与设备接触的柔软表面的材料,以及用于限定 案例结构。 在一些实施例中,该情况可以包括允许用户折叠打开外壳的盖以形成三角形棱镜的突片。 棱镜可以放置在其任何表面上,使得该装置可以以特定角度朝向用户(例如,打字专门定向和媒体播放方向)定向。

    ELECTRONIC DEVICE ENCLOSURES AND HEATSINK STRUCTURES WITH THERMAL MANAGEMENT FEATURES
    4.
    发明申请
    ELECTRONIC DEVICE ENCLOSURES AND HEATSINK STRUCTURES WITH THERMAL MANAGEMENT FEATURES 审中-公开
    具有热管理功能的电子器件封装和散热器结构

    公开(公告)号:US20140293545A1

    公开(公告)日:2014-10-02

    申请号:US14271353

    申请日:2014-05-06

    Applicant: Apple Inc.

    CPC classification number: H05K7/20436 H05K13/00 Y10T29/49002

    Abstract: An electronic device may have a housing in which electronic components are mounted. The electronic components may be mounted to a substrate such as a printed circuit board. A heat sink structure may dissipate heat generated by the electronic components. The housing may have a housing wall that is separated from the heat sink structure by an air gap. The housing wall may have integral support structures. Each of the support structures may have an inwardly protruding portion that protrudes through a corresponding opening in the heat sink structure. The protruding portions may each have a longitudinal axis and a cylindrical cavity that lies along the longitudinal axis. Each of the support structures may have fins that extend radially outward from the longitudinal axis.

    Abstract translation: 电子设备可以具有其中安装电子部件的壳体。 电子部件可以安装到诸如印刷电路板的基板上。 散热器结构可以散发由电子部件产生的热量。 壳体可以具有通过气隙与散热器结构分离的壳体壁。 外壳壁可以具有整体的支撑结构。 每个支撑结构可以具有突出穿过散热器结构中的对应开口的向内突出的部分。 突出部分可以各自具有纵向轴线和位于纵向轴线的圆柱形空腔。 每个支撑结构可以具有从纵向轴线径向向外延伸的翅片。

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