公开(公告)号：US20210082730A1

公开(公告)日：2021-03-18

申请号：US16997300

申请日：2020-08-19

Applicant: Applied Materials, Inc.

Inventor： Yogananda SARODE VISHWANATH ,  Steven E. BABAYAN ,  Stephen Donald PROUTY ,  Alvaro Garcia DE GORORDO ,  Andreas SCHMID ,  Andrew Antoine NOUJAIM

IPC: H01L21/683 ,  H01J37/32

Abstract: Embodiments described herein relate to a substrate support assembly which enables a cryogenic temperature operation of an electrostatic chuck (ESC) so that a substrate disposed thereon is maintained at a cryogenic processing temperature suitable for processing while other surfaces of a processing chamber are maintained at a different temperature. The substrate support assembly includes an electrostatic chuck (ESC), an ESC base assembly coupled to the ESC having a base channel disposed therein, and a facility plate having a facility channel disposed therein. The facility plate includes a plate portion and a wall portion. The plate portion is coupled to the ESC base assembly and the wall portion coupled to the ESC with a seal assembly. A vacuum region is defined by the ESC, the ESC base assembly, the plate portion of the facility plate, the wall portion of the facility plate, and the seal assembly.

公开(公告)号：US20210375599A1

公开(公告)日：2021-12-02

申请号：US16887596

申请日：2020-05-29

Applicant: Applied Materials, Inc.

Inventor： Andrew Antoine NOUJAIM ,  Álvaro GARCÍA DE GORORDO ,  Andreas SCHMID ,  Stephen Donald PROUTY

IPC: H01J37/32 ,  H01L21/683 ,  H01L21/67

Abstract: An electrical connector for a substrate support assembly is disclosed herein. The electrical connector includes a first interface body, and a second interface body coupled to the first interface body and to a third interface body. The second interface body is circumscribed by the third interface body. The first interface body and the second interface body each comprise a plurality of electrical terminals disposed in sockets formed in the respective first and second interface bodies, each electrical terminal disposed in sockets of the first interface body coupled to a respective one of the electrical terminals disposed in sockets of the second interface body to form a plurality of isolated conductive electrical unions, wherein the second interface body includes a plurality of protruding sidewalls that extend into the first interface body between each of the electrical terminals of the first interface body.

公开(公告)号：US20240110836A1

公开(公告)日：2024-04-04

申请号：US18368052

申请日：2023-09-14

Applicant: Applied Materials, Inc.

Inventor： Sankaranarayanan RAVI ,  Alvaro GARCIA ,  Martin Perez GUZMAN ,  Stephen Donald PROUTY ,  Andrew Antoine NOUJAIM

IPC: G01K11/00 ,  H01J37/32

CPC classification number: G01K11/00 ,  H01J37/32715 ,  H01J2237/2007 ,  H01J2237/24585 ,  H01J2237/334

Abstract: The disclosure relates to a substrate support assembly and apparatus for measuring the temperature of a substrate disposed on the support assembly. In one embodiment, a substrate temperature measurement apparatus includes a substrate support assembly, a probe assembly, and a probe target. The substrate support assembly includes an electrostatic chuck and one or more plates. The probe assembly within the substrate support assembly extends through one or more of the one or more plates. The probe assembly includes an optical probe sensor, an optical fiber coupled to the optical probe sensor, and an insulating sheath surrounding the optical fiber. The probe target includes a phosphor coating, is in contact with the electrostatic chuck, and is spaced from the probe assembly.

公开(公告)号：US20210343512A1

公开(公告)日：2021-11-04

申请号：US16863719

申请日：2020-04-30

Applicant: Applied Materials, Inc.

Inventor： Vijay D. PARKHE ,  Andreas SCHMID ,  Andrew Antoine NOUJAIM ,  Stephen Donald PROUTY ,  Alvaro GARCIA DE GORORDO ,  Martin PEREZ-GUZMAN

IPC: H01J37/32 ,  H01L21/67 ,  H01L21/683

Abstract: A substrate support assembly is described herein that includes a facility plate, a ground plate coupled to the facility plate, a fluid conduit disposed within the substrate support assembly disposed through the facility plate and the ground plate, and a connector coupled to the ground plate that houses a portion of the fluid conduit. The connector includes a biasing assembly and a fastener disposed in a pocket formed in the ground plate.

公开(公告)号：US20220262664A1

公开(公告)日：2022-08-18

申请号：US17174591

申请日：2021-02-12

Applicant: Applied Materials, Inc.

Inventor： Yogananda SARODE VISHWANATH ,  Steven E. BABAYAN ,  Andreas SCHMID ,  Stephen Donald PROUTY ,  Andrew Antoine NOUJAIM

IPC: H01L21/683 ,  H05K7/20

Abstract: Embodiments described herein relate to a substrate support assembly. The substrate support assembly includes an ESC base assembly having a base channel disposed therein, a facility plate, the facility plate coupled to the ESC base assembly with a vacuum region therebetween, and a seal assembly. The seal assembly includes an upper flange coupled to the base channel of the ESC base assembly, the upper flange disposed in the facility plate, a lower flange coupled to the upper flange, the lower flange disposed in the facility plate, a gasket disposed between the upper flange and the lower flange, and an insulator tube coupled to the lower flange. A passage is connected to the base channel, the passage is defined by connected openings of the upper flange, the gasket, the lower flange, the insulator tube, and the base assembly.

公开(公告)号：US20210296101A1

公开(公告)日：2021-09-23

申请号：US16825466

申请日：2020-03-20

Applicant: Applied Materials, Inc.

Inventor： Stephen Donald PROUTY ,  Alvaro GARCIA DE GORORDO ,  Andreas SCHMID ,  Andrew Antoine NOUJAIM

IPC: H01J37/32 ,  H01L21/683 ,  H01L21/67

Abstract: Semiconductor chamber components are described herein that includes one or more conduits for carrying a fluid between powered and grounded portions of the chamber component, the conduit configure to be less prone to arcing as compared to conventional components. In one example, a semiconductor chamber component is provided that includes a powered region, a grounded region, and a fluid conduit. The fluid conduit is disposed within the semiconductor chamber component and passes through the powered and grounded regions. The fluid conduit has an end to end electrical resistance of between 0.1 to 100 MΩ.

公开(公告)号：US20200185248A1

公开(公告)日：2020-06-11

申请号：US16217036

申请日：2018-12-11

Applicant: Applied Materials, Inc.

Inventor： Yogananda SARODE VISHWANATH ,  Steven E. BABAYAN ,  Stephen Donald PROUTY ,  Álvaro GARCÍA DE GORORDO ,  Andreas SCHMID ,  Andrew Antoine NOUJAIM

IPC: H01L21/683 ,  H01L21/67

Abstract: Embodiments described herein relate to a substrate support assembly which enables a cryogenic temperature operation of an electrostatic chuck (ESC) so that a substrate disposed thereon is maintained at a cryogenic processing temperature suitable for processing while other surfaces of a processing chamber are maintained at a different temperature. The substrate support assembly includes an electrostatic chuck (ESC), an ESC base assembly coupled to the ESC having a refrigerant channel disposed therein, and a facility plate having a coolant channel disposed therein. The facility plate includes a plate portion and a flange portion. The plate portion is coupled to the ESC base assembly and the flange portion coupled to the ESC with a seal assembly. A vacuum region is defined by the ESC, the ESC base assembly, the plate portion of the facility plate, the flange portion of the facility plate, and the seal assembly.