公开(公告)号：US20240077890A1

公开(公告)日：2024-03-07

申请号：US17901670

申请日：2022-09-01

Applicant: Applied Materials, Inc.

Inventor： Maxime CAYER ,  John L. KOENIG ,  Tony H. TONG ,  Shaun W. CRAWFORD ,  James L'HEUREUX ,  Andreas NEUBER ,  Ching-Hong HSIEH

IPC: G05D7/06 ,  B24B37/005 ,  B24B37/34 ,  G05B19/4155

CPC classification number: G05D7/0652 ,  B24B37/005 ,  B24B37/34 ,  G05B19/4155 ,  G05B2219/37371

Abstract: The present disclosure generally relates to methods and system used to collect waste fluids. A system controller is disclosed to control the operation of at least a portion of the system. The controller has a CPU. The fabrication facility includes a first processing system having fluid dispensed therein for processing a material on a part. A first drain is configured to collect the processing fluid as waste fluid after processing the part. The fabrication facility also includes a waste collection system fluidly coupled to the system drain. The waste collection system has two or more valves configured to couple the system drain and two or more facility drains. Each facility drain is uniquely coupled to one of the two or more valves. The CPU is configured to operate the valves between an open and a closed state in response to the fluid entering the system drain.

公开(公告)号：US20220341821A1

公开(公告)日：2022-10-27

申请号：US17240677

申请日：2021-04-26

Applicant: Applied Materials, Inc.

Inventor： Ryan T. DOWNEY ,  Hemant P. MUNGEKAR ,  James L'HEUREUX ,  Andreas NEUBER ,  Michael W. JOHNSON ,  Joseph A. VAN GOMPEL ,  Gino Gerardo CRISPIERI ,  Tony H. TONG ,  Maxime CAYER ,  John L. KOENIG ,  Mike M. HUANG

IPC: G01M99/00

Abstract: The present disclosure relates to systems and methods for detecting anomalies in a semiconductor processing system. According to certain embodiments, one or more external sensors are mounted to a sub-fab component, communicating with the processing system via a communication channel different than a communication channel utilized by the sub-fab component and providing extrinsic sensor data that the sub-fab component is not configured to provide. The extrinsic sensor data may be combined with sensor data from a processing tool of the system and/or intrinsic sensor data of the sub-fab component to form virtual sensor data. In the event the virtual data exceeds or falls below a threshold, an intervention or a maintenance signal is dispatched, and in certain embodiments, an intervention or maintenance action is taken by the system.

公开(公告)号：US20250123186A1

公开(公告)日：2025-04-17

申请号：US18990726

申请日：2024-12-20

Applicant: Applied Materials, Inc.

Inventor： Ryan T. DOWNEY ,  Hemant P. MUNGEKAR ,  James L'HEUREUX ,  Andreas NEUBER ,  Michael W. JOHNSON ,  Joseph VAN GOMPEL ,  Gino Gerardo CRISPIERI ,  Tony H. TONG ,  Maxime CAYER ,  John L. KOENIG ,  Mike M. HUANG

IPC: G01M99/00

Abstract: The present disclosure relates to systems and methods for detecting anomalies in a semiconductor processing system. According to certain embodiments, one or more external sensors are mounted to a sub-fab component, communicating with the processing system via a communication channel different than a communication channel utilized by the sub-fab component and providing extrinsic sensor data that the sub-fab component is not configured to provide. The extrinsic sensor data may be combined with sensor data from a processing tool of the system and/or intrinsic sensor data of the sub-fab component to form virtual sensor data. In the event the virtual data exceeds or falls below a threshold, an intervention or a maintenance signal is dispatched, and in certain embodiments, an intervention or maintenance action is taken by the system.