SEMICONDUCTOR PROCESSING TOOL PLATFORM CONFIGURATION WITH REDUCED FOOTPRINT

    公开(公告)号:US20240258137A1

    公开(公告)日:2024-08-01

    申请号:US18632509

    申请日:2024-04-11

    Abstract: A substrate processing system includes a factory interface, a transfer chamber of heptagonal shape and including four first facets and three second facets, each having a width that is narrower than that of each of the four first facets. A processing chamber is attached to one of the four first facets. A first auxiliary chamber attached to a first of the three second facets and is smaller than the first processing chamber. A load lock is attached to a second of the three second facets and to the factory interface. A second auxiliary chamber is attached to a third of the three second facets. The load lock is attached to the transfer chamber between the first and second auxiliary chambers. A robot is attached to a bottom of the transfer chamber and adapted to transfer substrates to/from the first processing chamber, the first auxiliary chamber, and the load lock.

    INTEGRATED EPITAXY AND PRECLEAN SYSTEM

    公开(公告)号:US20220375751A1

    公开(公告)日:2022-11-24

    申请号:US17463966

    申请日:2021-09-01

    Abstract: Embodiments of the present disclosure generally relate to an integrated substrate processing system for cleaning a substrate surface and subsequently performing an epitaxial deposition process thereon. A processing system includes a film formation chamber, a transfer chamber coupled to the film formation chamber, and an oxide removal chamber coupled to the transfer chamber, the oxide removal chamber having a substrate support. The processing system includes a controller configured to introduce a process gas mixture into the oxide removal chamber, the process gas mixture including a fluorine-containing gas and a vapor including at least one of water, an alcohol, an organic acid, or combinations thereof. The controller is configured to expose a substrate positioned on the substrate support to the process gas mixture, thereby removing an oxide film from the substrate.

    SEMICONDUCTOR PROCESSING TOOL PLATFORM CONFIGURATION WITH REDUCED FOOTPRINT

    公开(公告)号:US20220199436A1

    公开(公告)日:2022-06-23

    申请号:US17317566

    申请日:2021-05-11

    Abstract: A substrate processing system includes a factory interface having a controlled environment and a transfer chamber. The transfer chamber includes four first facets and three second facets, where each of the three second facets has a width that is narrower than that of each of the four first facets. A first processing chamber is attached to one of the four first facets. A first auxiliary chamber is attached to a first of the three second facets, where the first auxiliary chamber is smaller than the first processing chamber. A load lock is attached to a second of the three second facets and to the factory interface. A robot is attached to a bottom of the transfer chamber, the robot adapted to transfer substrates to and from the first processing chamber, the first auxiliary chamber, and the load lock.

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