公开(公告)号：US20230052048A1

公开(公告)日：2023-02-16

申请号：US17946547

申请日：2022-09-16

Applicant: Applied Materials, Inc.

Inventor： Ashavani KUMAR ,  Ashwin CHOCKALINGAM ,  Sivapackia GANAPATHIAPPAN ,  Rajeev BAJAJ ,  Boyi FU ,  Daniel REDFIELD ,  Nag B. PATIBANDLA ,  Mario Dagio CORNEJO ,  Amritanshu SINHA ,  Yan ZHAO ,  Ranga Rao ARNEPALLI ,  Fred C. REDEKER

IPC: B24B37/24 ,  B33Y80/00 ,  B33Y10/00 ,  B24D11/04 ,  B24B37/26 ,  B24D18/00 ,  B29C64/112

Abstract: Embodiments described herein relate to integrated abrasive (IA) polishing pads, and methods of manufacturing IA polishing pads using, at least in part, surface functionalized abrasive particles in an additive manufacturing process, such as a 3D inkjet printing process. In one embodiment, a method of forming a polishing article includes dispensing a first plurality of droplets of a first precursor, curing the first plurality of droplets to form a first layer comprising a portion of a sub-polishing element, dispensing a second plurality of droplets of the first precursor and a second precursor onto the first layer, and curing the second plurality of droplets to form a second layer comprising portions of the sub-polishing element and portions of a plurality of polishing elements. Here, the second precursor includes functionalized abrasive particles having a polymerizable group chemically bonded to surfaces thereof.

公开(公告)号：US20190139788A1

公开(公告)日：2019-05-09

申请号：US16171000

申请日：2018-10-25

Applicant: Applied Materials, Inc.

Inventor： Boyi FU ,  Han-Wen CHEN ,  Kyuil CHO ,  Sivapackia GANAPATHIAPPAN ,  Roman GOUK ,  Steven VERHAVERBEKE ,  Nag B. PATIBANDLA ,  Yan ZHAO ,  Hou T. NG ,  Ankit VORA ,  Daihua ZHANG

IPC: H01L21/56 ,  H01L21/67

Abstract: Aspects of the disclosure generally relate to methods of immobilizing die on a substrate. In one method one or more immobilization features are formed in a selected pattern on a substrate. A die is positioned in contact with the one or more immobilization features and the substrate. The one or more immobilization features are cured, and a mold layer is formed on top of the cured one or more immobilization features and the die so as to encapsulate the die.

公开(公告)号：US20190030678A1

公开(公告)日：2019-01-31

申请号：US16042016

申请日：2018-07-23

Applicant: Applied Materials, Inc.

Inventor： Ashavani KUMAR ,  Ashwin CHOCKALINGAM ,  Sivapackia GANAPATHIAPPAN ,  Rajeev BAJAJ ,  Boyi FU ,  Daniel REDFIELD ,  Nag B. PATIBANDLA ,  Mario Dagio CORNEJO ,  Amritanshu SINHA ,  Yan ZHAO ,  Ranga Rao ARNEPALLI ,  Fred C. REDEKER

IPC: B24B37/24 ,  B29C64/112

Abstract: Embodiments described herein relate to integrated abrasive (IA) polishing pads, and methods of manufacturing IA polishing pads using, at least in part, surface functionalized abrasive particles in an additive manufacturing process, such as a 3D inkjet printing process. In one embodiment, a method of forming a polishing article includes dispensing a first plurality of droplets of a first precursor, curing the first plurality of droplets to form a first layer comprising a portion of a sub-polishing element, dispensing a second plurality of droplets of the first precursor and a second precursor onto the first layer, and curing the second plurality of droplets to form a second layer comprising portions of the sub-polishing element and portions of a plurality of polishing elements. Here, the second precursor includes functionalized abrasive particles having a polymerizable group chemically bonded to surfaces thereof.