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公开(公告)号：US20190121933A1
公开(公告)日：2019-04-25
申请号：US16179700
申请日：2018-11-02
Applicant: Applied Materials Israel Ltd.
Inventor： Ron KATZIR , Imry KISSOS , Lavi SHACHAR , Amit BATIKOFF , Shaul COHEN , Noam ZAC
IPC: G06F17/50
Abstract: One or more metrology objects and one or more metrology operations may be identified. A design-based representation of a first metrology object of the one or more metrology objects may be received. Furthermore, an image-based representation of the first metrology object of the one or more metrology objects may be received where the one or more metrology operations include a first metrology operation associated with the first metrology object that is to be performed on the image-based representation of the first metrology object. The design-based representation of the first metrology object may be mapped with the image-based representation of the first metrology object. The first metrology operation may be performed based on the mapping.
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公开(公告)号：US20220222797A1
公开(公告)日：2022-07-14
申请号：US17149614
申请日：2021-01-14
Applicant: Applied Materials Israel Ltd.
Inventor： Shalom ELKAYAM , Shaul COHEN , Noam ZAC
Abstract: There are provided systems and methods of obtaining a segmented image of a semiconductor specimen, the image comprising first structural elements, obtaining a reference image of the semiconductor specimen, the reference image being based on design data and comprising second structural elements, determining, for at least one pair of elements including a first structural element and a corresponding second structural element, data Dspat informative of a spatial transformation required in order to match the elements of the pair in accordance with a matching criterion, and determining at least one of data informative of a defect in the first structural element and data informative of edge roughness of the first structural element using at least Dspat.
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Patent Agency Ranking
公开(公告)号：US20210407093A1
公开(公告)日：2021-12-30
申请号：US16917692
申请日：2020-06-30
Applicant: Applied Materials Israel Ltd.
Inventor： Elad BEN BARUCH , Shalom ELKAYAM , Shaul COHEN , Tal BEN-SHLOMO
Abstract: There is provided a system and method of segmenting an image of a fabricated semiconductor specimen. The method includes: obtaining a first probability map corresponding to the image representative of at least a portion of the fabricated semiconductor specimen and indicative of predicted probabilities of pixels in the image to correspond to one or more first structural elements presented in the image, obtaining a first label map informative of one or more segments representative of second structural elements and labels associated with the segments, performing simulation on the first label map to obtain a second probability map indicative of simulated probabilities of pixels in the first label map to correspond to the one or more segments, and generating a second label map based on the first probability map and the second probability map, the second label map being usable for segmentation of the image with enhanced repeatability.
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公开(公告)号：US20180268099A1
公开(公告)日：2018-09-20
申请号：US15698585
申请日：2017-09-07
Applicant: Applied Materials Israel Ltd.
Inventor： Ron KATZIR , Imry KISSOS , Lavi Jacov SHACHAR , Amit BATIKOFF , Shaul COHEN , Noam ZAC
CPC classification number: G06F17/5081 , G06T3/0068 , G06T7/0006 , G06T7/001 , G06T7/337 , G06T7/74 , G06T2200/24 , G06T2207/30148
Abstract: There are provided system and method of performing metrology operations related to a specimen. The method comprises: generating an examination recipe in accordance with a metrology application, the examination recipe specifying one or more metrology objects and one or more metrology operations related to the metrology application; obtaining an image-based representation of the specimen and a design-based representation of the specimen; mapping between the design-based representation of at least first metrology object and the image-based representation of at least first metrology object; and performing at least first metrology operation of the one or more metrology operations according to the examination recipe using the mapping, the at least first metrology operation specified as related to the at least first metrology object and to be performed on at least the image-based representation of the specimen.
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公开(公告)号：US20180268098A1
公开(公告)日：2018-09-20
申请号：US15460078
申请日：2017-03-15
Applicant: Applied Materials Israel Ltd.
Inventor： Ron KATZIR , Imry KISSOS , Lavi Jacov SHACHAR , Amit BATIKOFF , Shaul COHEN , Noam ZAC
IPC: G06F17/50
CPC classification number: G06F17/5081 , G06F2217/12
Abstract: There are provided system and method of performing metrology operations related to a specimen. The method comprises: accommodating definitions of metrology objects and metrology operations, at least one of the group consisting of the metrology objects and the metrology operations being defined using design data; accommodating a design-based representation and an image-based representation of the specimen, the design-based representation of the specimen comprising design-based representation of at least first metrology object, the image-based representation of the specimen comprising image-based representation of the at least first metrology object, the metrology operations including at least first metrology operation defined as related to the at least first metrology object and performed on at least the image-based representation of the specimen; mapping between the design-based representation and the image-based representation of the at least first metrology object; and performing the at least first metrology operation according to definition thereof using the mapping.
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公开(公告)号：US20230306580A1
公开(公告)日：2023-09-28
申请号：US17706306
申请日：2022-03-28
Applicant: Applied Materials Israel Ltd.
Inventor： Tal BEN-SHLOMO , Shalom ELKAYAM , Shaul COHEN , Tomer PELED
CPC classification number: G06T7/001 , G06T7/11 , G06T2207/30148 , G06T2207/20081
Abstract: There is provided a system and method of runtime examination of a semiconductor specimen. The method includes obtaining a runtime image representative of an inspection area of the specimen, the runtime image having a relatively low signal-to-noise ratio (SNR); and processing the runtime image using a machine learning (ML) model to obtain examination data specific for a given examination application, wherein the ML model is previously trained for the given examination application using one or more training samples, each training sample representative of a respective reference area sharing the same design pattern as the inspection area and comprising: a first training image of the respective reference area having a relatively low SNR; and label data indicative of ground truth in the respective reference area pertaining to the given examination application, the label data obtained by annotating a second training image of the respective reference area having a relatively high SNR.
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公开(公告)号：US20210407072A1
公开(公告)日：2021-12-30
申请号：US16916047
申请日：2020-06-29
Applicant: Applied Materials Israel Ltd.
Inventor： Elad BEN BARUCH , Shalom ELKAYAM , Shaul COHEN , Tal BEN-SHLOMO
Abstract: There is provided a system and method of generating a training set for training a Deep Neural Network usable for examination of a specimen. The method includes: for each given training image in a group: i) generating a first batch of training patches, including cropping the given training image into a first plurality of original patches; and augmenting at least part of the first plurality of original patches in order to simulate variations caused by a physical process of the specimen; and ii) generating a second batch of training patches, including: shifting the plurality of first positions on the given training image to obtain a second plurality of original patches, and repeating the augmenting to the second plurality of original patches to generate a second plurality of augmented patches; and including at least the first second batches of training patches corresponding to each given training image in the training set.
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