公开(公告)号：US20180321299A1

公开(公告)日：2018-11-08

申请号：US16025869

申请日：2018-07-02

Applicant: Applied Materials Israel Ltd.

Inventor： Zvi GOREN ,  Adi BOEHM ,  Amit BATIKOFF

IPC: G01R31/26 ,  H01L21/66 ,  G01R31/28

CPC classification number: G01R31/2601 ,  G01R31/2831 ,  G01R31/303 ,  H01L22/12

Abstract: There is provided an inspection system for inspecting a specimen, an inspection unit capable to operate in conjunction with an inspection machine unit, a die layout clipping unit, methods of inspecting a specimen, and a method of providing a die layout clip. The method of inspecting a specimen comprises: obtaining location information indicative of coordinates of a potential defect of interest revealed in the specimen and of one or more inspected layers corresponding to the potential defect of interest; sending to a die layout clipping unit a first data indicative of the location information and dimensions of an inspection area containing the potential defect of interest; receiving a die layout clip generated in accordance with the first data; specifying at least one inspection algorithm of the inspection area using information comprised in the die layout clip; and enabling inspection of the inspection area using the specified inspection algorithm.

公开(公告)号：US20200018789A1

公开(公告)日：2020-01-16

申请号：US16582877

申请日：2019-09-25

Applicant: Applied Materials Israel Ltd.

Inventor： Zvi GOREN ,  Adi BOEHM ,  Amit BATIKOFF

IPC: G01R31/26 ,  G01R31/28 ,  H01L21/66

Abstract: Data indicative of location information of a potential defect of interest revealed in a specimen and of one or more layers of the specimen corresponding to the potential defect of interest may be received. A die layout clip may be generated in accordance with the data by deriving the die layout clip based on the location information of the potential defect of interest and the one or more layers of the specimen corresponding to the potential defect of interest. The die layout clip may include information indicative of one or more patterns characterizing an inspection area that includes the potential defect of interest of the specimen. The generated die layout clip may be transmitted to a semiconductor inspection unit where an inspection by the semiconductor inspection unit of a semiconductor wafer that includes the specimen corresponding to the potential defect of interest is based on the one or more patterns of the die layout clip.

公开(公告)号：US20190391085A1

公开(公告)日：2019-12-26

申请号：US16553946

申请日：2019-08-28

Applicant: Applied Materials Israel Ltd.

Inventor： Saar SHABTAY ,  Moshe AMZALEG ,  Zvi GOREN

IPC: G01N21/88 ,  G06T7/00 ,  G01N21/95

Abstract: Inspection data that corresponds to potential defects of an object may be received. A first set of locations of first potential defects can be identified. The first set of locations of the first potential defects can be imaged with a review tool to obtain a first set of review images. The first potential defects can be classified based on the first set of review images to obtain first classification results of the first potential defects. A determination can be made as to whether an examination stopping criteria has been satisfied. In response to determining that the examination stopping criteria has not been satisfied, a second set of locations of second potential defects can be identified to be imaged with the review tool to obtain a second set of review images. The second set of locations can be different than the first set of locations.

公开(公告)号：US20190079022A1

公开(公告)日：2019-03-14

申请号：US15703937

申请日：2017-09-13

Applicant: Applied Materials Israel Ltd.

Inventor： Saar SHABTAY ,  Moshe AMZALEG ,  Zvi GOREN

IPC: G01N21/88 ,  G06T7/00 ,  G01N21/95

CPC classification number: G01N21/8803 ,  G01N21/8851 ,  G01N21/9501 ,  G01N2021/8461 ,  G01N2021/8867 ,  G06T7/0004 ,  G06T7/0006 ,  G06T2207/10061 ,  G06T2207/30148

Abstract: Examination system, method and computer-readable medium, the method comprising: processing by a processor using a first recipe at least one image comprised in images and metadata generated by an inspection tool and stored, to detect a first location set of first potential defects and attributes thereof; selecting and imaging part of the first location set with a review tool to obtain an image set; obtaining classification results of said first potential defects and determining a further recipe based thereon; processing the image using the further recipe for detecting a further location set of further defects; selecting part of the further location set; imaging the part with the review tool to obtain a further image set, and obtaining further classification results; and repeating determining the further recipe, processing the image, selecting and imaging part of the further location set, and obtaining further classification results, until a stopping criteria is met.

公开(公告)号：US20160282404A1

公开(公告)日：2016-09-29

申请号：US14668749

申请日：2015-03-25

Applicant: Applied Materials Israel Ltd.

Inventor： Zvi GOREN ,  Adi BOEHM ,  Amit BATIKOFF

IPC: G01R31/26

CPC classification number: G01R31/2601 ,  G01R31/2831 ,  G01R31/303 ,  H01L22/12

Abstract: There is provided an inspection system for inspecting a specimen, an inspection unit capable to operate in conjunction with an inspection machine unit, a die layout clipping unit, methods of inspecting a specimen, and a method of providing a die layout clip. The method of inspecting a specimen comprises: obtaining location information indicative of coordinates of a potential defect of interest revealed in the specimen and of one or more inspected layers corresponding to the potential defect of interest; sending to a die layout clipping unit a first data indicative of the location information and dimensions of an inspection area containing the potential defect of interest; receiving a die layout clip generated in accordance with the first data; specifying at least one inspection algorithm of the inspection area using information comprised in the die layout clip; and enabling inspection of the inspection area using the specified inspection algorithm.

Abstract translation: 提供了用于检查样本的检查系统，能够与检查机单元结合操作的检查单元，模具布局限制单元，检查样本的方法以及提供管芯布局夹的方法。 检查样本的方法包括：获得指示样本中显示的感兴趣的潜在缺陷的坐标的位置信息和对应于感兴趣的潜在缺陷的一个或多个被检查层; 向模具布局剪切单元发送指示包含感兴趣的潜在缺陷的检查区域的位置信息和尺寸的第一数据; 接收根据第一数据生成的管芯布局夹; 使用包含在所述管芯布局夹中的信息指定所述检查区域的至少一个检查算法; 并使用指定的检查算法实现对检查区域的检查。