公开(公告)号：US20170026004A1

公开(公告)日：2017-01-26

申请号：US15216156

申请日：2016-07-21

Applicant: BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC.

Inventor： Mark E. Stuenkel ,  Kevin W. Sliech

IPC: H03F1/30 ,  H03F3/45 ,  H03F1/34

CPC classification number: H03F1/3211 ,  H03F3/45475 ,  H03F3/45977 ,  H03F3/72 ,  H03F2203/45534 ,  H03F2203/45562

Abstract: A feedback amplifier having an improved feedback network including two cross coupled switches that isolate the amplifier from extraneous undesired electrical signals present in a system or network when the amplifier is turned off (i.e., in an off-state). The cross coupled switches interconnect two feedback paths of a feedback network to enable out-of-phase differential signals to be summed and effectively canceled. Further, the feedback amplifier provides on-stage advantages to enable different amplifier characteristics and parameter to be selectively engaged by turning on or turning off certain feedback networks.

Abstract translation: 反馈放大器具有改进的反馈网络，包括两个交叉耦合的开关，当放大器被关闭（即，处于关闭状态）时，放大器与存在于系统或网络中的外来不需要的电信号隔离。 交叉耦合开关互连反馈网络的两个反馈路径，以使异相差分信号相加和有效地消除。 此外，反馈放大器提供了阶段上的优点，以通过打开或关闭某些反馈网络来使得能够选择性地接合不同的放大器特性和参数。

公开(公告)号：US09627864B2

公开(公告)日：2017-04-18

申请号：US14429114

申请日：2014-07-14

Applicant: BAE Systems Information and Electronic Systems Integration Inc.

Inventor： Kevin W. Sliech ,  Timothy M. Dresser ,  Jared P. Majcher

IPC: H05K7/20 ,  H01L23/473 ,  H02B1/56 ,  H01R4/48 ,  H01R12/52 ,  H01Q21/00 ,  H02B1/20

CPC classification number: H02B1/56 ,  H01L23/473 ,  H01Q21/0087 ,  H01R4/48 ,  H01R12/52 ,  H02B1/20 ,  H05K7/20218 ,  H05K7/20254 ,  H05K7/209 ,  H05K7/20927

Abstract: A detachable high powered electronic module of a high powered electronic system capable of receiving high power is disclosed. In one embodiment, the detachable high powered electronic includes a sub-array of the high powered electronic module, a heat exchanger assembly, a power converter module, and a mechanical interface. The mechanical interface is configured to detachably couple the sub-array and the power converter module via the heat exchanger assembly. Further, the detachable sub-array assembly is configured to deliver power received from the power converter module to the sub-array and also to substantially simultaneously extract heat away from the detachable sub-array.

公开(公告)号：US09538692B2

公开(公告)日：2017-01-03

申请号：US14429099

申请日：2014-07-09

Applicant: BAE Systems Information and Electronic Systems Integration Inc.

Inventor： Kevin W. Sliech ,  Stephen A. Hedges ,  Jared P. Majcher

IPC: H02B1/56 ,  H05K7/20 ,  H01R4/48 ,  H01R12/52 ,  H01Q21/00 ,  H02B1/20 ,  H01L23/473

CPC classification number: H02B1/56 ,  H01L23/473 ,  H01Q21/0087 ,  H01R4/48 ,  H01R12/52 ,  H02B1/20 ,  H05K7/20218 ,  H05K7/20254 ,  H05K7/209 ,  H05K7/20927

Abstract: An integrated heat exchanger and power delivery system for high powered electronic modules is disclosed. In one embodiment, the system includes a coolant manifold. The system further includes a heat exchanger and power delivery module. The heat exchanger and power delivery module comprises a plurality of heat exchanger and power delivery elements that are coupled to the coolant manifold. The system furthermore includes a high powered electronic module, wherein the high powered module comprises an array of sub-modules. The array of sub-modules is disposed on the plurality of heat exchanger and power delivery elements. The plurality of heat exchanger and power delivery elements are configured to substantially simultaneously deliver power and extract heat away from the sub-modules.

Abstract translation: 公开了一种用于大功率电子模块的集成热交换器和功率输送系统。 在一个实施例中，系统包括冷却剂歧管。 该系统还包括热交换器和电力输送模块。 热交换器和动力输送模块包括耦合到冷却剂歧管的多个热交换器和动力输送元件。 该系统还包括高功率电子模块，其中高功率模块包括子模块阵列。 子模块阵列设置在多​​个热交换器和电力输送元件上。 多个热交换器和动力输送元件构造成基本上同时地输送动力并将热量从子模块中提取出来。

公开(公告)号：US09859849B2

公开(公告)日：2018-01-02

申请号：US15216156

申请日：2016-07-21

Applicant: BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC.

Inventor： Mark E. Stuenkel ,  Kevin W. Sliech

IPC: H03F1/02 ,  H03F1/32 ,  H03F3/45 ,  H03F3/72

CPC classification number: H03F1/3211 ,  H03F3/45475 ,  H03F3/45977 ,  H03F3/72 ,  H03F2203/45534 ,  H03F2203/45562

Abstract: A feedback amplifier having an improved feedback network including two cross coupled switches that isolate the amplifier from extraneous undesired electrical signals present in a system or network when the amplifier is turned off (i.e., in an off-state). The cross coupled switches interconnect two feedback paths of a feedback network to enable out-of-phase differential signals to be summed and effectively canceled. Further, the feedback amplifier provides on-stage advantages to enable different amplifier characteristics and parameter to be selectively engaged by turning on or turning off certain feedback networks.

公开(公告)号：US20150223365A1

公开(公告)日：2015-08-06

申请号：US14429114

申请日：2014-07-14

Applicant: BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC.

Inventor： Kevin W. Sliech ,  Timothy M. Dresser ,  Jared P. Majcher

IPC: H05K7/20 ,  H02B1/20

CPC classification number: H02B1/56 ,  H01L23/473 ,  H01Q21/0087 ,  H01R4/48 ,  H01R12/52 ,  H02B1/20 ,  H05K7/20218 ,  H05K7/20254 ,  H05K7/209 ,  H05K7/20927

Abstract: A detachable high powered electronic module of a high powered electronic system capable of receiving high power is disclosed. In one embodiment, the detachable high powered electronic includes a sub-array of the high powered electronic module a heat exchanger assembly, a power converter module, and a mechanical interface. The mechanical interface is configured to detachably couple the sub-array and the power converter module via the heat exchanger assembly. Further, the detachable sub-array assembly is configured to deliver power received from the power converter module to the sub-array and also to substantially simultaneously extract heat away from the detachable sub-array.

Abstract translation: 公开了一种能够接收高功率的大功率电子系统的可拆卸大功率电子模块。 在一个实施例中，可拆卸高功率电子器件包括高功率电子模块的子阵列，热交换器组件，功率转换器模块和机械接口。 机械接口被配置成经由热交换器组件可拆卸地联接子阵列和功率转换器模块。 此外，可拆卸子阵列组件被配置为将从功率转换器模块接收的功率传送到子阵列，并且还基本上同时将热量从可拆卸子阵列提取出来。

公开(公告)号：US20150222099A1

公开(公告)日：2015-08-06

申请号：US14429099

申请日：2014-07-09

Applicant: BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC.

Inventor： Kevin W. Sliech ,  Stephen A. Hedges ,  Jared P. Majcher

IPC: H02B1/56 ,  H02B1/20

CPC classification number: H02B1/56 ,  H01L23/473 ,  H01Q21/0087 ,  H01R4/48 ,  H01R12/52 ,  H02B1/20 ,  H05K7/20218 ,  H05K7/20254 ,  H05K7/209 ,  H05K7/20927

Abstract: An integrated heat exchanger and power delivery system for high powered electronic modules is disclosed. In one embodiment, the system includes a coolant manifold. The system further includes a heat exchanger and power delivery module. The heat exchanger and power delivery module comprises a plurality of heat exchanger and power delivery elements that are coupled to the coolant manifold. The system furthermore includes a high powered electronic module, wherein the high powered module comprises an array of sub-modules. The array of sub-modules is disposed on the plurality of heat exchanger and power delivery elements. The plurality of heat exchanger and power delivery elements are configured to substantially simultaneously deliver power and extract heat away from the sub-modules.

Abstract translation: 公开了一种用于大功率电子模块的集成热交换器和功率输送系统。 在一个实施例中，系统包括冷却剂歧管。 该系统还包括热交换器和电力输送模块。 热交换器和动力输送模块包括耦合到冷却剂歧管的多个热交换器和动力输送元件。 该系统还包括高功率电子模块，其中高功率模块包括子模块阵列。 子模块阵列设置在多​​个热交换器和电力输送元件上。 多个热交换器和动力输送元件构造成基本上同时地输送动力并将热量从子模块中提取出来。