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    Detachable Interface For High Powered Electronic Modules
    2.
    发明申请
    Detachable Interface For High Powered Electronic Modules 有权
    高功率电子模块的可拆卸接口

    公开(公告)号：US20150223365A1

    公开(公告)日：2015-08-06

    申请号：US14429114

    申请日：2014-07-14

    Applicant: BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC.

    Inventor： Kevin W. Sliech ,  Timothy M. Dresser ,  Jared P. Majcher

    IPC: H05K7/20 ,  H02B1/20

    CPC classification number: H02B1/56 ,  H01L23/473 ,  H01Q21/0087 ,  H01R4/48 ,  H01R12/52 ,  H02B1/20 ,  H05K7/20218 ,  H05K7/20254 ,  H05K7/209 ,  H05K7/20927

    Abstract: A detachable high powered electronic module of a high powered electronic system capable of receiving high power is disclosed. In one embodiment, the detachable high powered electronic includes a sub-array of the high powered electronic module a heat exchanger assembly, a power converter module, and a mechanical interface. The mechanical interface is configured to detachably couple the sub-array and the power converter module via the heat exchanger assembly. Further, the detachable sub-array assembly is configured to deliver power received from the power converter module to the sub-array and also to substantially simultaneously extract heat away from the detachable sub-array.

    Abstract translation: 公开了一种能够接收高功率的大功率电子系统的可拆卸大功率电子模块。 在一个实施例中，可拆卸高功率电子器件包括高功率电子模块的子阵列，热交换器组件，功率转换器模块和机械接口。 机械接口被配置成经由热交换器组件可拆卸地联接子阵列和功率转换器模块。 此外，可拆卸子阵列组件被配置为将从功率转换器模块接收的功率传送到子阵列，并且还基本上同时将热量从可拆卸子阵列提取出来。

    Analog modulated repeater/transceiver
    5.
    发明授权
    Analog modulated repeater/transceiver 有权

    公开(公告)号：US10014884B1

    公开(公告)日：2018-07-03

    申请号：US15694228

    申请日：2017-09-01

    Applicant: BAE SYSTEMS Information and Electronic Systems Integration Inc.

    Inventor： Timothy M. Dresser ,  Michael D. Blazej ,  Gregory M. Flewelling ,  Brian J. Smith

    IPC: H04B1/04 ,  H04B1/00 ,  H04B7/15 ,  H04B1/40

    CPC classification number: H04B1/0014 ,  H04B1/40 ,  H04B7/15 ,  H04B7/15528

    Abstract: An analog transceiver having low latency for processing a received RF/MW signal and modifying the received RF/MW signal into a modified RF/MW signal prior to transmission of the modified RF/MW signal. The analog transceiver comprises a receiving antenna; a direct conversion receiver, coupled with the receiving antenna, for splitting the received RF/MW signal into an in-phase portion and a quadrature portion; an analog signal processing device, having a plurality of actuatable switches, for modifying the in-phase and quadrature portions and outputting modified signals while only introducing minimal latency during processing; a direct conversion transmitter, for receiving the suitably modified in-phase and quadrature portions and forming the modified RF/MW signal; and a transmitting antenna for receiving the modified RF/MW signal and transmitting the modified RF/MW signal.

    Dense out of plane interconnect inside hermetically sealed modules
    6.
    发明授权
    Dense out of plane interconnect inside hermetically sealed modules 有权

    公开(公告)号：US09642265B2

    公开(公告)日：2017-05-02

    申请号：US14744382

    申请日：2015-06-19

    Applicant: BAE SYSTEMS Information and Electronic Systems Integration Inc.

    Inventor： Timothy M. Dresser

    IPC: H05K5/00 ,  H05K5/06

    CPC classification number: H05K9/0056

    Abstract: A hermetically sealed module which comprises a central core housing including a perimeter side wall and a central core with opposed primary and secondary support surfaces. At least one coupling passageway is formed within the central core adjacent the perimeter side wall. The side wall has an sealed internal/external electrical connector which facilitates communication with the module. A multilayer substrate, with at least one flexible coupling tab, is supported by the primary support surface and at least one surface mounted component is supported by the secondary support surface. The flexible coupling tab passes through the at least one coupling passageway to facilitate coupling of a plurality of components of the multilayer substrate with a plurality of components of the at least one surface mounted component via a SMT connector. Primary and secondary lids are secured to opposed sides of the perimeter side wall and forming the hermetically sealed module.

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