公开(公告)号：US09859178B2

公开(公告)日：2018-01-02

申请号：US14876886

申请日：2015-10-07

Applicant: BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC.

Inventor： Yannick C. Morel ,  Sheila J. Konecke ,  Santos Nazario-Camacho ,  Clint J. Novotny ,  Keith K. Sturcken

IPC: H05K5/02 ,  H01L23/04 ,  H01L23/10 ,  H01L21/50

CPC classification number: H01L23/04 ,  H01L21/50 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A microwave module is described. The microwave module includes a base bracket, a window plate and a lid. The base bracket is configured to contain a photoconductive switch, a radio-frequency transformer and dielectric oil. The window plate, which is transparent to optical light, covers a first portion of the base bracket in which the photoconductive switch is located. The window plate is sealed to the base bracket. The lid, which includes a cutout to allow the radio-frequency transformer to pass through the lid, covers a second portion of the base bracket in which the radio-frequency transformer is located. The window plate is sealed to the base bracket, and the lid is sealed to the window plate, the base bracket and the radio-frequency transformer to contain the dielectric oil within the microwave module.

公开(公告)号：US20140175675A1

公开(公告)日：2014-06-26

申请号：US14191592

申请日：2014-02-27

Applicant: BAE Systems Information and Electronic Systems Integration Inc.

Inventor： Keith K. Sturcken ,  John A. Hughes ,  Thomas E. Love ,  Sheila J. Konecke ,  Jeffrey Montag ,  Peter M. Wallace

IPC: H01L25/065

CPC classification number: H01L25/0657 ,  G01R31/003 ,  G01R31/2849 ,  G01R31/2855 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/15331

Abstract: A method for manufacturing an electronic multi-chip module that involves stacking at least six tested devices to form the module. These devices may be individually tested prior to assembling the electronic module. After individually testing the devices, the devices may be stacked one on top of the other to form an electronic multi-chip module having at least six stacked devices. Other embodiments may be described and claimed.

Abstract translation: 一种用于制造电子多芯片模块的方法，其包括堆叠至少六个被测试的装置以形成模块。 这些设备可以在组装电子模块之前单独测试。 在对设备进行单独测试之后，可以将设备堆叠在一起而形成具有至少六个堆叠设备的电子多芯片模块。 可以描述和要求保护其他实施例。