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1.
公开(公告)号:US20240240041A1
公开(公告)日:2024-07-18
申请号:US18558420
申请日:2022-04-29
Applicant: BASF SE
Inventor: Fan ZHANG , Jie LU , Chong Xi WANG , Zhi Zhong CAI
IPC: C09D11/38 , B29C64/112 , B29C64/124 , B29C64/40 , B33Y10/00 , B33Y70/10 , B33Y80/00
CPC classification number: C09D11/38 , B29C64/112 , B29C64/124 , B29C64/40 , B33Y10/00 , B33Y70/10 , B33Y80/00
Abstract: This disclosure relates to a radiation-curable composition comprising (A) at least one water-soluble monofunctional ethylenically unsaturated monomer; (B) at least one water-soluble non-curable component, wherein the weighted average melting point of component (B) is more than 22° C. preferably more than 25° C.; and (C) at least one photoinitiator.
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2.
公开(公告)号:US20240141086A1
公开(公告)日:2024-05-02
申请号:US18278445
申请日:2022-02-11
Applicant: BASF SE
Inventor: Fan ZHANG , Chong Xi WANG , Zhi Zhong CAI
IPC: C08F226/10 , B29C64/129 , C08F2/50 , C08F222/10 , C08G59/24 , C08G59/42 , C08G59/50 , C08K5/5397 , C09D11/101
CPC classification number: C08F226/10 , B29C64/129 , C08F2/50 , C08F222/102 , C08F222/1065 , C08F222/1067 , C08G59/245 , C08G59/42 , C08G59/5033 , C08K5/5397 , C09D11/101 , B33Y10/00
Abstract: This disclosure relates to a curable composition comprising (a) at least one light polymerizable liquid; (b) at least one epoxy precursor dissolved in component (a); and (c) at least one photoinitiator; wherein the curable composition exhibits no more than 15% increase in viscosity at 25° C. after 7 days at room temperature.
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