公开(公告)号：US20210340295A1

公开(公告)日：2021-11-04

申请号：US17259854

申请日：2019-07-12

Applicant: BASF SE

Inventor： Pirro CIPI ,  Mary THOMSON ,  Libor SEDA ,  Timothy KLOTS ,  Jon DEBLING

IPC: C08F220/12 ,  C09D11/107

Abstract: An oligomeric resin adduct, compositions comprising the oligomeric resinadduct, and process for making oligomeric resin adduct, wherein the the process includes charging into a reactor a mixture including a vinylic monomer that includes a styrenic monomer, a (meth)acrylic monomer, or a mixture thereof; a polymerization initiator; and optionally a reaction solvent; maintaining the reactor at a temperature sufficient to produce an oligomeric resin from the vinylic monomer; maintaining the vinylic monomer, the polymerization initiator, and optionally the reaction solvent at a sufficient amount to produce the oligomeric resin, wherein the oligomeric resin contains at least one terminal olefinic unsaturation; and reacting the oligomeric resin with a compound of Formula I, Formula II, or a mixture thereof as defined herein.

公开(公告)号：US20230287627A1

公开(公告)日：2023-09-14

申请号：US18004529

申请日：2021-07-09

Applicant: BASF SE

Inventor： Pirro CIPI ,  Amirpouyan SARDASHTI ,  Frank REINHOLD ,  Daniel Scott NIEDZWIECKI ,  Kevin PAYNE ,  Nathaniel Troy GREENE ,  Alex RUDD

IPC: D21H19/22 ,  C09D125/14 ,  C09D133/06 ,  C09D7/63 ,  C09D7/65 ,  D21H19/18 ,  D21H21/16 ,  D21H27/10

CPC classification number: D21H19/22 ,  C09D7/63 ,  C09D7/65 ,  C09D125/14 ,  C09D133/062 ,  D21H19/18 ,  D21H21/16 ,  D21H27/10

Abstract: Disclosed herein is a composition that can provide moisture barrier during packaging. Additionally disclosed herein is a substrate coated with the composition that is recyclable and repulpable. The composition includes at least one ester and at least one styrene acrylic copolymer with a glass transition temperature in the range of from -54° C. to 10° C.