公开(公告)号：US20240124750A1

公开(公告)日：2024-04-18

申请号：US18531246

申请日：2023-12-06

Applicant: BASF SE

Inventor： Singa D. TOBING ,  Jason WOLFE ,  Timothy KLOTS ,  Philip S. WILLIAMS ,  Hiruy YIGEZU ,  Sujith CHACKO

IPC: C09J7/38 ,  C09J5/06 ,  C09J7/40 ,  C09J11/08 ,  C09J133/06

CPC classification number: C09J7/385 ,  C09J5/06 ,  C09J7/401 ,  C09J11/08 ,  C09J133/06 ,  C09J2301/302

Abstract: A multilayer composite containing a polymeric membrane, a hot-melt adhesive layer, and a release liner, wherein the hot-melt adhesive layer comprises a thermally curable pressure-sensitive adhesive. The invention further relates to a process to make the composite and to use the composite as a roofing material, label, tape, Graphics and Medical applications.

公开(公告)号：US20220325147A1

公开(公告)日：2022-10-13

申请号：US17633972

申请日：2020-08-10

Applicant: BASF SE

Inventor： Karl-Heinz SCHUMACHER ,  Matthias GERST ,  Peter PREISHUBER-PFLUEGL ,  Kevin PAYNE ,  Timothy KLOTS

IPC: C09J133/08 ,  B32B37/12 ,  B32B37/24 ,  B32B7/12 ,  B32B27/36 ,  B32B27/08 ,  B32B27/32

Abstract: A description is given of a method of making film laminates using a lamination adhesive comprising (a) at least one acrylic polymer A with anhydride groups which are reactive with primary or secondary amine groups; and (b) at least one compound B with at least two amine groups selected from primary and secondary amine groups. The acrylic polymer A has a molecular weight of from 3000 to 50000 and the lamination adhesive is free of organic solvents, free of water and free of compounds with isocyanate groups.

公开(公告)号：US20170298173A1

公开(公告)日：2017-10-19

申请号：US15517788

申请日：2015-10-07

Applicant: BASF SE

Inventor： Eric CALHOUN ,  Timothy KLOTS

IPC: C08G18/62 ,  C08L85/02 ,  C08G79/02 ,  C09D175/04 ,  C08G18/79

Abstract: A composition includes a polyphosphoric acid-modified acrylic polyol, wherein the polyphosphoric acid-modified acrylic polyol has greater than zero, but less than 1.0 wt % modification with polyphosphoric acid.

公开(公告)号：US20230303819A1

公开(公告)日：2023-09-28

申请号：US18124000

申请日：2023-03-21

Applicant: BASF SE

Inventor： Kaliappa RAGUNATHAN ,  Timothy KLOTS

IPC: C08L33/12 ,  C08L33/08 ,  C09D133/08 ,  C09D133/12 ,  C09D5/00 ,  C08F220/14 ,  C08F220/18

CPC classification number: C08L33/12 ,  C08L33/08 ,  C09D133/08 ,  C09D133/12 ,  C09D5/00 ,  C08F220/14 ,  C08F220/1802 ,  C08L2207/53 ,  C08L2201/50

Abstract: The present disclosure provides multilayer particles comprising (i) a first layer comprising a first copolymer with an Mn of greater than 50,000 g/mol derived from one or more soft ethylenically-unsaturated monomers, and one or more phosphorus-containing monomer; and (ii) a second layer surrounding at least a portion of the first layer comprising a second polymer having an Mn of 500 g/mol to 50,000 g/mol, derived from one or more ethylenically-unsaturated monomer, and at least one ethylenically unsaturated acid monomer, wherein the second layer is prepared by a high temperature polymerization process. The present disclosure further provides methods of making the multilayer particles.

公开(公告)号：US20210340295A1

公开(公告)日：2021-11-04

申请号：US17259854

申请日：2019-07-12

Applicant: BASF SE

Inventor： Pirro CIPI ,  Mary THOMSON ,  Libor SEDA ,  Timothy KLOTS ,  Jon DEBLING

IPC: C08F220/12 ,  C09D11/107

Abstract: An oligomeric resin adduct, compositions comprising the oligomeric resinadduct, and process for making oligomeric resin adduct, wherein the the process includes charging into a reactor a mixture including a vinylic monomer that includes a styrenic monomer, a (meth)acrylic monomer, or a mixture thereof; a polymerization initiator; and optionally a reaction solvent; maintaining the reactor at a temperature sufficient to produce an oligomeric resin from the vinylic monomer; maintaining the vinylic monomer, the polymerization initiator, and optionally the reaction solvent at a sufficient amount to produce the oligomeric resin, wherein the oligomeric resin contains at least one terminal olefinic unsaturation; and reacting the oligomeric resin with a compound of Formula I, Formula II, or a mixture thereof as defined herein.