公开(公告)号：US11815492B2

公开(公告)日：2023-11-14

申请号：US17232100

申请日：2021-04-15

Applicant: BFLY Operations, Inc.

Inventor： Chao Chen ,  Youn-Jae Kook ,  Jihee Lee ,  Kailiang Chen ,  Leung Kin Chiu ,  Joseph Lutsky ,  Nevada J. Sanchez ,  Sebastian Schaetz ,  Hamid Soleimani

IPC: G01N29/24 ,  A61B8/00 ,  H03F1/32 ,  H03K5/24 ,  H03M3/00 ,  G01N29/30 ,  G01S7/52 ,  B06B1/02 ,  G01S15/89 ,  H03F3/45

CPC classification number: G01N29/2406 ,  A61B8/58 ,  G01N29/30 ,  G01S7/5205 ,  H03F1/3211 ,  H03F3/45475 ,  H03K5/24 ,  H03M3/458 ,  B06B1/0292 ,  G01N2291/02475 ,  G01S15/8915 ,  H03F2200/129 ,  H03F2203/45116

Abstract: Aspects of the technology described herein relate to built-in self-testing (BIST) of circuitry (e.g., a pulser or receive circuitry) and/or transducers in an ultrasound device. A BIST circuit may include a transconductance amplifier coupled between a pulser and receive circuitry, a capacitor network coupled between a pulser and receive circuitry, and/or a current source couplable to the input terminal of receive circuitry to which a transducer is also couplable. The collapse voltages of transducers may be characterized using BIST circuitry, and a bias voltage may be applied to the membranes of the transducers based at least in part on their collapse voltages. The capacitances of transducers may also be measured using BIST circuitry and a notification may be generated based on the sets of measurements.

公开(公告)号：US12203894B2

公开(公告)日：2025-01-21

申请号：US18507509

申请日：2023-11-13

Applicant: BFLY OPERATIONS, INC.

Inventor： Chao Chen ,  Youn-Jae Kook ,  Jihee Lee ,  Kailiang Chen ,  Leung Kin Chiu ,  Joseph Lutsky ,  Nevada J. Sanchez ,  Sebastian Schaetz ,  Hamid Soleimani

IPC: G01N29/24 ,  A61B8/00 ,  B06B1/02 ,  G01N29/30 ,  G01S7/52 ,  G01S15/89 ,  H03F1/32 ,  H03F3/45 ,  H03K5/24 ,  H03M3/00

Abstract: Aspects of the technology described herein relate to built-in self-testing (BIST) of circuitry (e.g., a pulser or receive circuitry) and/or transducers in an ultrasound device. A BIST circuit may include a transconductance amplifier coupled between a pulser and receive circuitry, a capacitor network coupled between a pulser and receive circuitry, and/or a current source couplable to the input terminal of receive circuitry to which a transducer is also couplable. The collapse voltages of transducers may be characterized using BIST circuitry, and a bias voltage may be applied to the membranes of the transducers based at least in part on their collapse voltages. The capacitances of transducers may also be measured using BIST circuitry and a notification may be generated based on the sets of measurements.

公开(公告)号：US20240159714A1

公开(公告)日：2024-05-16

申请号：US18507509

申请日：2023-11-13

Applicant: BFLY OPERATIONS, INC.

Inventor： Chao Chen ,  Youn-Jae Kook ,  Jihee Lee ,  Kailiang Chen ,  Leung Kin Chiu ,  Joseph Lutsky ,  Nevada J. Sanchez ,  Sebastian Schaetz ,  Hamid Soleimani

IPC: G01N29/24 ,  A61B8/00 ,  G01N29/30 ,  G01S7/52 ,  H03F1/32 ,  H03F3/45 ,  H03K5/24 ,  H03M3/00

CPC classification number: G01N29/2406 ,  A61B8/58 ,  G01N29/30 ,  G01S7/5205 ,  H03F1/3211 ,  H03F3/45475 ,  H03K5/24 ,  H03M3/458 ,  B06B1/0292

Abstract: Aspects of the technology described herein relate to built-in self-testing (BIST) of circuitry (e.g., a pulser or receive circuitry) and/or transducers in an ultrasound device. A BIST circuit may include a transconductance amplifier coupled between a pulser and receive circuitry, a capacitor network coupled between a pulser and receive circuitry, and/or a current source couplable to the input terminal of receive circuitry to which a transducer is also couplable. The collapse voltages of transducers may be characterized using BIST circuitry, and a bias voltage may be applied to the membranes of the transducers based at least in part on their collapse voltages. The capacitances of transducers may also be measured using BIST circuitry and a notification may be generated based on the sets of measurements.

公开(公告)号：US11529127B2

公开(公告)日：2022-12-20

申请号：US16910783

申请日：2020-06-24

Applicant: BFLY Operations, Inc.

Inventor： Leung Kin Chiu ,  Karl Thiele ,  Nevada J. Sanchez ,  Sheng-Wen Huang

IPC: A61B8/00 ,  A61B8/14 ,  A61B8/12

Abstract: Ultrasound apparatus and methods of processing signals are described. The ultrasound apparatus may include multiple channels. In some embodiments, signal processing techniques are described, which in some embodiments are performed on a per-channel basis. The signal processing techniques may involve using down-conversion and filtering of signals on multiple channels. The down-conversion and filtering may be done prior to beamforming.