公开(公告)号：US12225775B2

公开(公告)日：2025-02-11

申请号：US17531984

申请日：2021-11-22

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Qiuhua Meng ,  Ming Liu

IPC: H10K59/122 ,  H10K50/818 ,  H10K50/828 ,  H10K50/86 ,  H10K59/38 ,  H10K71/00 ,  H10K59/12 ,  H10K102/00

Abstract: Provided are an array substrate, a fabrication method thereof, and a display panel. The array substrate includes a substrate; a reflective electrode layer on the substrate; a pixel defining layer on a side of the reflective electrode layer away from the substrate; an anti-reflection layer between the reflective electrode layer and the pixel defining layer, and configured to absorb light from outside, an orthographic projection of the anti-reflection layer on the substrate being within an overlapping portion between the orthographic projection of the reflective electrode layer on the substrate and the orthographic projection of the pixel defining layer on the substrate; and a black matrix on a side of the pixel defining layer away from the substrate, an orthographic projection of at least a portion of the anti-reflection layer on the substrate not overlapping with an orthographic projection of the black matrix on the substrate.

公开(公告)号：US11758756B2

公开(公告)日：2023-09-12

申请号：US17228791

申请日：2021-04-13

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Ming Liu

IPC: H01L51/52

CPC classification number: H01L51/5253 ,  H01L2251/301

Abstract: Provided is a packaging structure, including an inorganic packaging layer and an organic packaging layer that are laminated on a substrate, wherein the organic packaging layer includes a microstructure layer and a planarization layer, a refractive index of the planarization layer being lower than that of the microstructure layer; wherein the microstructure layer includes a base structure on the inorganic packaging layer and a plurality of protrusion structures spaced apart on a surface of the base structure away from the inorganic packaging layer; and the planarization layer fills at least gaps between adjacent protrusion structures, and a side of the planarization layer away from the inorganic packaging layer is of a planar structure.

公开(公告)号：US11538271B2

公开(公告)日：2022-12-27

申请号：US17460012

申请日：2021-08-27

Applicant: BOE Technology Group Co., Ltd.

Inventor： Ming Liu ,  Hongwei Tian ,  Hao Liu ,  Jing Wang

IPC: G06V40/13 ,  H01L27/146

Abstract: The present disclosure provides a display panel, a manufacturing method thereof, and a display device. The display panel includes a plurality of optical fingerprint identification structures, each optical fingerprint identification structure includes a display region and a sensing region, the display region includes a driving circuitry layer, a planarization layer, a pixel definition layer, and a light-emitting element, and the light-emitting element includes an anode, a light-emitting material layer and a cathode. The sensing region includes a sensing region opening, an optical sensor and a cathode metal layer, the cathode metal layer includes a first cathode metal layer and a second cathode metal layer, and the first cathode metal layer is separated from the second cathode metal layer by a gap, so that light emitted by the light-emitting element is allowed to enter the optical sensor through the gap after being reflected by a fingerprint.

公开(公告)号：US11217723B2

公开(公告)日：2022-01-04

申请号：US16712075

申请日：2019-12-12

Applicant: BOE Technology Group Co., Ltd.

Inventor： Pinfan Wang ,  Shantao Chen ,  Shuai Zhang ,  Ming Liu ,  Qiuhua Meng

IPC: H01L33/00 ,  H01L25/075 ,  G06F1/16

Abstract: The present disclosure provides a flexible display substrate, a method for manufacturing the same, and a flexible display device, and belongs to the technical field of display. Among them, the method for manufacturing a flexible display substrate includes: providing a carrier substrate; forming a flexible display substrate including a plurality of pre-cuts on the carrier substrate, with the plurality of pre-cuts exposing the carrier substrate; forming an inverted frustum structure on the carrier substrate at the plurality of pre-cuts, an orthogonal projection of a lower end surface of the inverted frustum structure on the carrier substrate is located within an orthogonal projection of an upper end surface of the inverted frustum structure on the carrier substrate; packaging the flexible display substrate; and peeling the flexible display substrate packaged from the carrier substrate.

公开(公告)号：US20210405811A1

公开(公告)日：2021-12-30

申请号：US16761861

申请日：2019-12-16

Applicant: BOE Technology Group Co., Ltd.

Inventor： Ming Liu ,  Yueping Zuo ,  Qiuhua Meng

IPC: G06F3/044 ,  G06F3/041

Abstract: A touch control structure is provided. The touch control structure includes a first touch electrode including a plurality of first touch control blocks; a second touch electrode including a plurality of second touch control blocks; and one or more reversibly deformable elastic supports between and in direct contact with a respective one of the plurality of first touch control blocks and a respective one of the plurality of second touch control blocks. When the touch control structure is in a first state without a touch, the respective one of the plurality of first touch control blocks includes a first overlapping portion and a first margin portion abutting the first overlapping portion, and the respective one of the plurality of second touch control blocks includes a second overlapping portion and a second margin portion abutting the second overlapping portion.

公开(公告)号：US20210234124A1

公开(公告)日：2021-07-29

申请号：US16768146

申请日：2019-12-20

Applicant: BOE Technology Group Co., Ltd.

Inventor： Xiaolong Li ,  Ming Liu ,  Zheng Liu ,  Dawei Wang ,  Yanliu Sun

IPC: H01L51/52 ,  H01L51/56 ,  H01L27/32

Abstract: A display panel is provided, which includes a base substrate, and a light-emitting device and an encapsulation structure sequentially arranged on the base substrate. The encapsulation structure includes at least one first encapsulation film layer, the first encapsulation film layer includes at least two inorganic layers arranged in a stack, and refractive indexes of the at least two inorganic layers sequentially increase in a direction close to the light-emitting device. The first encapsulation film layer is configured to adjust an angle of an ambient light incident on the light-emitting device to reduce the ambient light reflected from the display panel.

公开(公告)号：US11854290B2

公开(公告)日：2023-12-26

申请号：US17425482

申请日：2020-09-18

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Hao Liu ,  Yueping Zuo ,  Huijuan Zhang ,  Ming Liu ,  Zheng Liu

IPC: G06K9/28 ,  G06V40/13 ,  G11C19/28 ,  H10K59/131 ,  H10K59/122

CPC classification number: G06V40/1306 ,  G11C19/287 ,  H10K59/131 ,  H10K59/122

Abstract: The present disclosure provides a display substrate and a display device, and belongs to the field of display technology. The display substrate of the present disclosure includes: a base substrate having a display region; a plurality of fingerprint identification circuits in the display region of the base substrate, wherein each fingerprint identification circuit includes a control sub-circuit and a detection electrode; wherein in a fingerprint identification phase, the control sub-circuit is configured to read a capacitance between the detection electrode and a valley and a ridge of a fingerprint in response to a fingerprint scanning signal, so as to perform fingerprint identification.

公开(公告)号：US11805671B2

公开(公告)日：2023-10-31

申请号：US17356380

申请日：2021-06-23

Applicant: BOE Technology Group Co., Ltd.

Inventor： Jing Wang ,  Hongwei Tian ,  Ming Liu ,  Ziang Han ,  Zunqing Song

IPC: H10K50/844 ,  H10K71/00 ,  H10K77/10

CPC classification number: H10K50/844 ,  H10K71/00 ,  H10K77/10

Abstract: A method for manufacturing a display backplane, a display backplate, and a display device are disclosed. The method includes: forming a planarization layer on one side of a substrate inside a pixel region, a partition region, and a perforation region; forming at least one girdle of annular passivation layer disposed around the perforation region on a surface, away from the substrate, of the planarization layer inside a portion of the partition layer; removing a portion of the planarization layer, inside the partition region, uncovered by the annular passivation layer and the planarization layer, inside the partition region, partially covered by the annular passivation layer, to obtain at least one girdle of annular isolation columns disposed between the substrate and the annular passivation layer and around the perforation region; and forming organic light-emitting elements on one side of the planarization layer away from the substrate to obtain the display backplane.

公开(公告)号：US11380876B2

公开(公告)日：2022-07-05

申请号：US16563214

申请日：2019-09-06

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Hongwei Tian ,  Yanan Niu ,  Dong Li ,  Ming Liu ,  Zheng Liu ,  Chunyang Wang

IPC: H01L51/52 ,  H01L27/32

Abstract: The disclosure provides a display substrate, a method for manufacturing the same and a display device, belonging to the display technology field, to solve the problem that ultraviolet irradiation has an adverse effect on the service life of existing OLED devices. The display substrate disclosed herein includes a light processing layer which comprising a condensed-ring conjugated polymer. The light processing layer can protect the display parts below it and prevent the display parts from being exposed to ambient light and reducing their service life.

公开(公告)号：US12193273B2

公开(公告)日：2025-01-07

申请号：US18512114

申请日：2023-11-17

Applicant: BOE Technology Group Co., Ltd.

Inventor： Jing Wang ,  Hongwei Tian ,  Ming Liu ,  Jia Zhao ,  Qiuhua Meng ,  Ziang Han

IPC: H10K59/121 ,  H10K59/122 ,  H10K59/124 ,  H10K71/00 ,  H01L21/02 ,  H01L27/12 ,  H01L29/66 ,  H01L29/786 ,  H10K59/12

Abstract: The present disclosure provides a displaying backplane and a displaying device, and relates to the technical field of displaying. The displaying backplane includes: a substrate base plate; a first active layer and a second active layer that are provided on the substrate base plate, wherein the material of the first active layer and the second active layer is an oxide semiconductor, the first active layer has a first channel region and first no-channel regions, and the second active layer has a second channel region and second no-channel regions; a first grid insulating layer covering the first active layer and the second active layer; and a first grid and a second grid that are provided on the first grid insulating layer; wherein the oxygen-vacancy concentration of the first channel region is greater than the oxygen-vacancy concentrations of the first no-channel regions, the second no-channel regions and the second channel region.