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公开(公告)号：US20210405811A1
公开(公告)日：2021-12-30
申请号：US16761861
申请日：2019-12-16
Applicant: BOE Technology Group Co., Ltd.
Inventor： Ming Liu , Yueping Zuo , Qiuhua Meng
Abstract: A touch control structure is provided. The touch control structure includes a first touch electrode including a plurality of first touch control blocks; a second touch electrode including a plurality of second touch control blocks; and one or more reversibly deformable elastic supports between and in direct contact with a respective one of the plurality of first touch control blocks and a respective one of the plurality of second touch control blocks. When the touch control structure is in a first state without a touch, the respective one of the plurality of first touch control blocks includes a first overlapping portion and a first margin portion abutting the first overlapping portion, and the respective one of the plurality of second touch control blocks includes a second overlapping portion and a second margin portion abutting the second overlapping portion.
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公开(公告)号：US10468613B2
公开(公告)日：2019-11-05
申请号：US16039429
申请日：2018-07-19
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Hongwei Tian , Yanan Niu , Yueping Zuo
Abstract: Embodiment of the present disclosure provides a motherboard of flexible display panel, a cutting method thereof, a flexible display panel and a display device. The motherboard of flexible display panel includes: a plurality of display units; a space region, disposed to at least separate adjacent ones of the display unis; and a barrier strip, disposed in the space region and configured to stop a crack from extending towards the display units across the barrier strip.
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公开(公告)号：US10249763B2
公开(公告)日：2019-04-02
申请号：US15528215
申请日：2016-12-12
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Zheng Liu , Xiaolong Li , Yueping Zuo , Lujiang Huangfu
IPC: H01L29/786 , H01L29/66
Abstract: A semiconductor device, an array substrate, and a display device, and their fabrication methods are provided. An exemplary semiconductor device includes a first electrode, an insulating layer, and a second electrode, over a substrate. A conductive layer is on the insulating layer. A semiconductor layer is on the first electrode, on a first sidewall of the insulating layer, on the conductive layer, on the second sidewall of the insulating layer, and on the second electrode. A first gate electrode is over a portion of the semiconductor layer that is on the first sidewall of the insulating layer. A second gate electrode is over a portion of the semiconductor layer that is on the second sidewall of the insulating layer.
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公开(公告)号：US09837502B2
公开(公告)日：2017-12-05
申请号：US14907778
申请日：2015-08-24
Applicant: BOE Technology Group Co., Ltd.
Inventor： Hongwei Tian , Kaihong Ma , Wenqing Xu , Yueping Zuo , Xiaowei Xu
IPC: H01L29/423 , H01L23/50 , H01L29/41 , H01L21/28 , H01L27/12 , H01L29/417 , H01L29/49 , H01L29/786
CPC classification number: H01L29/42384 , H01L21/28008 , H01L23/50 , H01L27/124 , H01L27/3276 , H01L29/41 , H01L29/41733 , H01L29/4908 , H01L29/786
Abstract: A conductive structure and a manufacturing method thereof, an array substrate and a display device. The conductive structure includes a plurality of first metal layers made of aluminum, and between every two first metal layers that are adjacent, there is also provided a second metal layer, which is made of a metal other than aluminum. With the conductive structure, the hillock phenomenon that happens to the conductive structure when it is heated can be decreased without reducing the overall thickness of the conductive structure.
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公开(公告)号：US11854290B2
公开(公告)日：2023-12-26
申请号：US17425482
申请日：2020-09-18
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Hao Liu , Yueping Zuo , Huijuan Zhang , Ming Liu , Zheng Liu
IPC: G06K9/28 , G06V40/13 , G11C19/28 , H10K59/131 , H10K59/122
CPC classification number: G06V40/1306 , G11C19/287 , H10K59/131 , H10K59/122
Abstract: The present disclosure provides a display substrate and a display device, and belongs to the field of display technology. The display substrate of the present disclosure includes: a base substrate having a display region; a plurality of fingerprint identification circuits in the display region of the base substrate, wherein each fingerprint identification circuit includes a control sub-circuit and a detection electrode; wherein in a fingerprint identification phase, the control sub-circuit is configured to read a capacitance between the detection electrode and a valley and a ridge of a fingerprint in response to a fingerprint scanning signal, so as to perform fingerprint identification.
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Patent Agency Ranking
公开(公告)号：US20200098847A1
公开(公告)日：2020-03-26
申请号：US16419234
申请日：2019-05-22
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Shuai Zhang , Libin Liu , Yueping Zuo , Qiuhua Meng
Abstract: The present disclosure provides a display substrate, a method for manufacturing the same, and a display device. The display substrate comprises a display region, and a peripheral circuit located on a periphery of the display region and provided with a signal line. The display substrate further comprises at least one conductive pattern located on a thin film encapsulation layer of the display substrate and connected in substantially parallel to the signal line.
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公开(公告)号：US10468266B2
公开(公告)日：2019-11-05
申请号：US15546475
申请日：2016-04-07
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Yinghai Ma , Liangjian Li , Yueping Zuo
IPC: H01L21/311 , H01L21/768 , H01J37/32 , G02F1/1368 , H01L27/12
Abstract: A dry etching method includes performing at least two etching steps, and further includes injecting protective gas into an etch chamber for processing between any two successive etching steps, wherein the protective gas generates plasma to neutralize electrons accumulated on a side wall of an etching trench. According to the present disclosure, hydrogen plasma is added in an etching process to remove the electrons accumulated on the side wall of the etching trench so as to reduce the microetching effect in multiple etching. In this way, process stability and reliability of a display substrate are improved.
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8.发明申请公开(公告)号：US20190181362A1
公开(公告)日：2019-06-13
申请号：US16039429
申请日：2018-07-19
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Hongwei Tian , Yanan Niu , Yueping Zuo
CPC classification number: H01L51/0097 , B32B3/266 , B32B2457/20 , G02F1/13458 , H01L27/3244 , H01L51/5253 , H01L51/5256 , H01L51/56 , H01L2251/5338 , H01L2251/566
Abstract: Embodiment of the present disclosure provides a motherboard of flexible display panel, a cutting method thereof, a flexible display panel and a display device. The motherboard of flexible display panel includes: a plurality of display units; a space region, disposed to at least separate adjacent ones of the display unis; and a barrier strip, disposed in the space region and configured to stop a crack from extending towards the display units across the barrier strip.
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公开(公告)号：US20170294345A1
公开(公告)日：2017-10-12
申请号：US15512372
申请日：2016-03-03
Applicant: BOE Technology Group Co., Ltd.
Inventor： Xiaoyong Lu , Hongwei Tian , Yueping Zuo , Xiaowei Xu , Wenqing Xu , Chunping Long
IPC: H01L21/768
CPC classification number: H01L21/76877 , H01L21/02063 , H01L21/0228 , H01L21/02315 , H01L21/67 , H01L21/76814
Abstract: Provided are a method and an apparatus for manufacturing a semiconductor device. The method comprises: forming a first wiring layer on a base substrate; forming an interlayer dielectric layer on the first wiring layer, with contact holes being provided in the interlayer dielectric layer; subjecting bottoms of the contact holes to a dry cleaning process; and forming a second wiring layer on the interlayer dielectric layer, wherein the second wiring layer is electrically connected to the first wiring layer via the contact holes.
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公开(公告)号：US11281342B2
公开(公告)日：2022-03-22
申请号：US16761861
申请日：2019-12-16
Applicant: BOE Technology Group Co., Ltd.
Inventor： Ming Liu , Yueping Zuo , Qiuhua Meng
IPC: G06F3/044 , G06F3/041 , H01L27/32 , G02F1/1333
Abstract: A touch control structure is provided. The touch control structure includes a first touch electrode including a plurality of first touch control blocks; a second touch electrode including a plurality of second touch control blocks; and one or more reversibly deformable elastic supports between and in direct contact with a respective one of the plurality of first touch control blocks and a respective one of the plurality of second touch control blocks. When the touch control structure is in a first state without a touch, the respective one of the plurality of first touch control blocks includes a first overlapping portion and a first margin portion abutting the first overlapping portion, and the respective one of the plurality of second touch control blocks includes a second overlapping portion and a second margin portion abutting the second overlapping portion.
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