公开(公告)号：US20190217059A1

公开(公告)日：2019-07-18

申请号：US16248352

申请日：2019-01-15

Applicant: Boston Scientific Scimed Inc.

Inventor： Steven J. Meyer ,  James E. Blood ,  David A. Chizek ,  Matthew Hein ,  Daniel J. Foster

IPC: A61M25/01 ,  H05K1/11 ,  H05K1/02 ,  H05K1/18 ,  H05K7/14 ,  H05K3/30 ,  H05K3/28 ,  G01B7/004 ,  A61M25/00

CPC classification number: A61M25/0127 ,  A61B5/062 ,  A61B5/6851 ,  A61B5/6852 ,  A61B5/686 ,  A61B2562/0223 ,  A61B2562/043 ,  A61B2562/164 ,  A61M25/0012 ,  A61M2025/0166 ,  G01B7/004 ,  H05K1/028 ,  H05K1/111 ,  H05K1/181 ,  H05K3/284 ,  H05K3/303 ,  H05K7/1427 ,  H05K2201/056 ,  H05K2201/10151

Abstract: A sensor assembly includes a multilayer circuit, a first magnetic field sensor, and a second magnetic field sensor. The multilayer circuit extends between a proximal end and a distal end along a longitudinal axis. The multilayer circuit includes a plurality of electrical pads positioned at the proximal end. The first magnetic field sensor is coupled to the multilayer circuit and has a primary sensing direction aligned with the longitudinal axis. The second magnetic field sensor is coupled to the multilayer circuit and oriented with respect to the first magnetic field sensor such that the second magnetic field sensor has a primary sensing direction aligned with an axis orthogonal to the longitudinal axis.

公开(公告)号：US11980724B2

公开(公告)日：2024-05-14

申请号：US17480086

申请日：2021-09-20

Applicant: Boston Scientific Scimed Inc.

Inventor： Steven J. Meyer ,  James E. Blood ,  David A. Chizek ,  Matthew Hein ,  Daniel J. Foster

IPC: A61M25/01 ,  A61B5/00 ,  A61B5/06 ,  A61M25/00 ,  G01B7/004 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/28 ,  H05K3/30 ,  H05K7/14

CPC classification number: A61M25/0127 ,  A61B5/062 ,  A61B5/6852 ,  A61M25/0012 ,  G01B7/004 ,  H05K1/028 ,  H05K1/111 ,  H05K1/181 ,  H05K3/284 ,  H05K3/303 ,  H05K7/1427 ,  A61B5/6851 ,  A61B5/686 ,  A61B2562/0223 ,  A61B2562/043 ,  A61B2562/164 ,  A61M2025/0166 ,  H05K2201/056 ,  H05K2201/10151

Abstract: A sensor assembly includes a multilayer circuit, a first magnetic field sensor, and a second magnetic field sensor. The multilayer circuit extends between a proximal end and a distal end along a longitudinal axis. The multilayer circuit includes a plurality of electrical pads positioned at the proximal end. The first magnetic field sensor is coupled to the multilayer circuit and has a primary sensing direction aligned with the longitudinal axis. The second magnetic field sensor is coupled to the multilayer circuit and oriented with respect to the first magnetic field sensor such that the second magnetic field sensor has a primary sensing direction aligned with an axis orthogonal to the longitudinal axis.

公开(公告)号：US11141567B2

公开(公告)日：2021-10-12

申请号：US16248352

申请日：2019-01-15

Applicant: Boston Scientific Scimed Inc.

Inventor： Steven J. Meyer ,  James E. Blood ,  David A. Chizek ,  Matthew Hein ,  Daniel J. Foster

IPC: H05K1/11 ,  A61M25/01 ,  H05K1/02 ,  H05K1/18 ,  H05K7/14 ,  H05K3/28 ,  G01B7/004 ,  A61M25/00 ,  H05K3/30 ,  A61B5/06 ,  A61B5/00

Abstract: A sensor assembly includes a multilayer circuit, a first magnetic field sensor, and a second magnetic field sensor. The multilayer circuit extends between a proximal end and a distal end along a longitudinal axis. The multilayer circuit includes a plurality of electrical pads positioned at the proximal end. The first magnetic field sensor is coupled to the multilayer circuit and has a primary sensing direction aligned with the longitudinal axis. The second magnetic field sensor is coupled to the multilayer circuit and oriented with respect to the first magnetic field sensor such that the second magnetic field sensor has a primary sensing direction aligned with an axis orthogonal to the longitudinal axis.

公开(公告)号：US20220370149A1

公开(公告)日：2022-11-24

申请号：US17747269

申请日：2022-05-18

Applicant: Boston Scientific Scimed Inc.

Inventor： Kyle P. True ,  David A. Chizek ,  Daniel J. Foster

IPC: A61B34/20 ,  G01R33/032

Abstract: A magnetic field sensor for a medical device, the magnetic sensor assembly comprising a substrate having a plurality of planar sections, wherein adjacent planar sections are joined by a transition section, and wherein the planar sections are arranged in a substantially C-shaped arrangement such that an inner surface of the magnetic field sensor is concave, and wherein the plurality of planar sections includes a first planar section oriented in a first plane and a second planar section oriented in a second plane orthogonal to the first plane. A first magneto-resistive (MR) sensor is mounted to the first planar section and defining a first axis of sensitivity, and a second MR sensor is mounted to the second planar section and defining a second axis of sensitivity that is orthogonal to the first axis of sensitivity.

公开(公告)号：US20200007173A1

公开(公告)日：2020-01-02

申请号：US16460023

申请日：2019-07-02

Applicant: Boston Scientific Scimed Inc.

Inventor： Anton Plotkin ,  Daniel J. Foster ,  Eric Morris ,  David A. Chizek ,  Peter J. Musto ,  Peg Bernholt ,  Timothy Sullivan

IPC: H04B1/03 ,  A61B5/05

Abstract: A system includes a magnetic field transmitter assembly. The magnetic field transmitter assembly has a housing with a first layer comprising an electrically-conductive material, a second layer comprising an electrically-insulating material, and a third layer comprising an electrically-conductive material. The second layer is positioned between the first layer and the third layer. The magnetic field transmitter assembly also includes a plurality of magnetic field generator assemblies positioned within the housing.

公开(公告)号：US20220001140A1

公开(公告)日：2022-01-06

申请号：US17480086

申请日：2021-09-20

Applicant: Boston Scientific Scimed Inc.

Inventor： Steven J. Meyer ,  James E. Blood ,  David A. Chizek ,  Matthew Hein ,  Daniel J. Foster

IPC: A61M25/01 ,  H05K1/11 ,  H05K1/02 ,  H05K1/18 ,  H05K7/14 ,  H05K3/28 ,  G01B7/004 ,  A61M25/00 ,  H05K3/30 ,  A61B5/06 ,  A61B5/00

Abstract: A sensor assembly includes a multilayer circuit, a first magnetic field sensor, and a second magnetic field sensor. The multilayer circuit extends between a proximal end and a distal end along a longitudinal axis. The multilayer circuit includes a plurality of electrical pads positioned at the proximal end. The first magnetic field sensor is coupled to the multilayer circuit and has a primary sensing direction aligned with the longitudinal axis. The second magnetic field sensor is coupled to the multilayer circuit and oriented with respect to the first magnetic field sensor such that the second magnetic field sensor has a primary sensing direction aligned with an axis orthogonal to the longitudinal axis.

公开(公告)号：US20180220929A1

公开(公告)日：2018-08-09

申请号：US15888834

申请日：2018-02-05

Applicant: Boston Scientific Scimed Inc.

Inventor： James E. Blood ,  Daniel J. Foster ,  Steven J. Meyer ,  David A. Chizek

IPC: A61B5/06 ,  G01D5/16 ,  G01D5/20

CPC classification number: A61B5/062 ,  A61B2562/0223 ,  G01D5/16 ,  G01D5/20 ,  G01R33/0206 ,  G01R33/098

Abstract: A sensor assembly includes a substrate including a first portion, a second portion, and a rolled section positioned between the first portion and the second portion. The sensor assembly further includes a first magnetic field sensor coupled to the first portion. The first magnetic field sensor has a primary sensing direction aligned with a longitudinal axis of the sensor assembly. The sensor assembly further includes a second magnetic field sensor coupled to the second portion. The rolled section is shaped such that the second magnetic field sensor is oriented with respect to the first magnetic field sensor so that the second magnetic field sensor has a primary sensing direction aligned with an axis orthogonal to the longitudinal axis.