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    HIGH SPEED SOLDER DEPOSITION AND REFLOW FOR A PRINTED FLEXIBLE ELECTRONIC MEDIUM
    1.
    发明申请
    HIGH SPEED SOLDER DEPOSITION AND REFLOW FOR A PRINTED FLEXIBLE ELECTRONIC MEDIUM 审中-公开

    公开(公告)号：US20180332716A1

    公开(公告)日：2018-11-15

    申请号：US16045986

    申请日：2018-07-26

    Applicant: CCL Label, Inc.

    Inventor： Jamie Rieg ,  Randal Taylor ,  Willie Fowlkes ,  John Walsh ,  Paul Janousek

    IPC: H05K3/34 ,  H05K1/02 ,  H05K13/04 ,  H05K1/03

    CPC classification number: H05K3/3494 ,  H05K1/028 ,  H05K1/0393 ,  H05K3/3484 ,  H05K13/0465 ,  H05K2203/1545

    Abstract: The present disclosure related to a flexible electronic substrate assembly and a method and system of processing solder paste onto an electrical substrate. The assembly includes a flexible substrate having a solderable medium provided along the flexible substrate. A pattern of solder paste may be cured to a portion of the solderable medium. The solderable medium may be a generally continuous construction or a patterned construction relative to the flexible substrate. The substrate may be unwound from a roll of substrate material before solder paste is deposited thereon. The flexible electric substrate assembly may be formed though a roll to roll process. Infrared heat may be applied to the substrate with the solder paste deposit as the substrate is traveling along the process direction to reflow the solder paste as the substrate is traveling along the process direction at a high rate of speed.

    APPARATUS, METHODS OF MANUFACTURE, AND METHODS FOR TESTING AMOUNT OF ENERGY STORED IN ELECTROCHEMICAL CELL
    2.
    发明申请
    APPARATUS, METHODS OF MANUFACTURE, AND METHODS FOR TESTING AMOUNT OF ENERGY STORED IN ELECTROCHEMICAL CELL 审中-公开
    装置，制造方法以及测试存储在电化学电池中的能量的方法

    公开(公告)号：US20150180094A1

    公开(公告)日：2015-06-25

    申请号：US14415284

    申请日：2013-07-18

    Applicant: CCL LABEL, INC.

    Inventor： Jamie Rieg ,  Anne Shim ,  John Walsh ,  Peikang Liu ,  Paul Janousek

    IPC: H01M10/48 ,  H01M2/02

    CPC classification number: H01M10/488 ,  G01R31/387 ,  H01M2/0267 ,  H01M6/505 ,  H01M10/48 ,  H01M2220/30 ,  Y10T83/04

    Abstract: A battery assembly includes a battery, an outer layer, and a power indicator apparatus. The battery includes a first terminal and a second terminal. The power indicator apparatus comprises an electrical conductor and a mechanical switch. The electrical conductor is configured to be in continuous electrical communication with the first terminal. The mechanical switch is configured to be actuated by an application of pressure at a single location, and upon actuation, to place the electrical conductor in electrical communication with the second terminal such that the power indicator apparatus can facilitate a reading of a potential energy stored in the battery. Methods of assembly and methods of determining a potential energy stored in the battery are also provided herein.

    Abstract translation: 电池组件包括电池，外层和电源指示装置。 电池包括第一端子和第二端子。 电源指示器装置包括电导体和机械开关。 电导体被配置为与第一端子连续电连通。 机械开关被配置为通过在单个位置处施加压力来致动，并且在致动时，将电导体与第二端子电连通，使得电力指示器装置可以便于读取存储在 电池。 本文还提供了组装方法和确定存储在电池中的势能的方法。

    HIGH SPEED SOLDER DEPOSITION AND REFLOW FOR A PRINTED FLEXIBLE ELECTRONIC MEDIUM
    3.
    发明申请
    HIGH SPEED SOLDER DEPOSITION AND REFLOW FOR A PRINTED FLEXIBLE ELECTRONIC MEDIUM 审中-公开

    公开(公告)号：US20170311454A1

    公开(公告)日：2017-10-26

    申请号：US15497309

    申请日：2017-04-26

    Applicant: CCL Label, Inc.

    Inventor： Jamie Rieg ,  Randal Taylor ,  Willie Fowlkes ,  John Walsh ,  Paul Janousek

    IPC: H05K3/34 ,  H05K13/04 ,  H05K1/02

    CPC classification number: H05K3/3494 ,  H05K1/028 ,  H05K1/0393 ,  H05K3/3484 ,  H05K13/0465 ,  H05K2203/1545

    Abstract: The present disclosure related to a flexible electronic substrate assembly and a method and system of processing solder paste onto an electrical substrate. The assembly includes a flexible substrate having a solderable medium provided along the flexible substrate. A pattern of solder paste may be cured to a portion of the solderable medium. The solderable medium may be a generally continuous construction or a patterned construction relative to the flexible substrate. The substrate may be unwound from a roll of substrate material before solder paste is deposited thereon. The flexible electric substrate assembly may be formed though a roll to roll process. Infrared heat may be applied to the substrate with the solder paste deposit as the substrate is traveling along the process direction to reflow the solder paste as the substrate is traveling along the process direction at a high rate of speed.

    High speed solder deposition and reflow for a printed flexible electronic medium
    4.
    发明授权
    High speed solder deposition and reflow for a printed flexible electronic medium 有权

    公开(公告)号：US10356913B2

    公开(公告)日：2019-07-16

    申请号：US16045986

    申请日：2018-07-26

    Applicant: CCL Label, Inc.

    Inventor： Jamie Rieg ,  Randal Taylor ,  Willie Fowlkes ,  John Walsh ,  Paul Janousek

    IPC: H05K3/34 ,  H05K13/04 ,  H05K1/02 ,  H05K1/03

    Abstract: The present disclosure related to a flexible electronic substrate assembly and a method and system of processing solder paste onto an electrical substrate. The assembly includes a flexible substrate having a solderable medium provided along the flexible substrate. A pattern of solder paste may be cured to a portion of the solderable medium. The solderable medium may be a generally continuous construction or a patterned construction relative to the flexible substrate. The substrate may be unwound from a roll of substrate material before solder paste is deposited thereon. The flexible electric substrate assembly may be formed though a roll to roll process. Infrared heat may be applied to the substrate with the solder paste deposit as the substrate is traveling along the process direction to reflow the solder paste as the substrate is traveling along the process direction at a high rate of speed.

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