公开(公告)号：US11365486B2

公开(公告)日：2022-06-21

申请号：US16203700

申请日：2018-11-29

Applicant: CHANG CHUN PETROCHEMICAL CO., LTD.

Inventor： Yao-Sheng Lai ,  Jian-Ming Huang ,  Kuei-Sen Cheng ,  Jui-Chang Chou

IPC: H01M4/66 ,  C25C1/12 ,  H01M10/0525

Abstract: Provided are an electrolytic copper foil, an electrode comprising the same, and a lithium ion battery comprising the same. The electrolytic copper foil has a drum side and a deposited side opposing to the drum side, wherein a nanoindentation hardness of the drum side is equal to or larger than 0.5 GPa and equal to or smaller than 3.5 GPa; and a lightness of the drum side is equal to or larger than 25 and equal to or smaller than 75.

公开(公告)号：US20200253061A1

公开(公告)日：2020-08-06

申请号：US16694434

申请日：2019-11-25

Applicant: Chang Chun Petrochemical Co., Ltd

Inventor： Jian-Ming Huang ,  Yao-Sheng Lai ,  Jui-Chang Chou

IPC: H05K3/38 ,  B32B15/08

Abstract: Surface-treated copper foils that exhibit a material volume (Vm) in a range of 0.05 to 0.6 μm3/μm2 and a yellowness index (YI) in a range of 17 to 52 are reported. Where the surface-treated copper foil is treated on the deposited side and includes a treatment layer comprising a nodule layer. Such surface-treated copper foils can be used as a conductive material having low transmission loss, for example in circuit boards.

公开(公告)号：US12168834B2

公开(公告)日：2024-12-17

申请号：US17560283

申请日：2021-12-23

Applicant: CHANG CHUN PETROCHEMICAL CO., LTD.

Inventor： Jian-Ming Huang ,  Yao-Sheng Lai ,  Jui-Chang Chou

IPC: C25D1/00 ,  C25D1/04 ,  H05K1/02 ,  H05K3/02

Abstract: A surface-treated copper foil includes a bulk copper foil and a first surface treatment layer. The first surface treatment layer is disposed on a first surface of the bulk copper foil and includes a roughening layer, where the outermost surface of the first surface treatment layer is a treating surface of the surface-treated copper foil. The material volume (Vm) of the treating surface is 0.06 to 1.45 μm3/μm2, and the five-point peak height (S5p) of the treating surface is 0.15 to 2.00 μm.

公开(公告)号：US10826052B1

公开(公告)日：2020-11-03

申请号：US16745559

申请日：2020-01-17

Applicant: CHANG CHUN PETROCHEMICAL CO., LTD.

Inventor： Jian-Ming Huang ,  Yao-Sheng Lai ,  Jui-Chang Chou

IPC: H01M4/04 ,  H01M10/0525 ,  H01M4/02

Abstract: Provided are an electrolytic copper foil, an electrode comprising the same, and a lithium ion cell comprising the same. The electrolytic copper foil comprises first and second chromium layers each containing 15 μg/dm2 to 50 μg/dm2 of chromium, and has a resistivity of 1.72 μΩ*cm to 2.25 μΩ*cm. First and second surfaces thereof each have a contact angle of 15 to 50 degrees with oxalic acid, the first surface has a lightness of 17.5 to 40 and the second surface has a lightness of 38 to 60. With these characteristics, the electrolytic copper foil has good weatherability and good adhesion strength with the active materials, thereby improving the cycle life of the lithium ion cell comprising the same.

公开(公告)号：US10765010B2

公开(公告)日：2020-09-01

申请号：US16694434

申请日：2019-11-25

Applicant: Chang Chun Petrochemical Co., Ltd

Inventor： Jian-Ming Huang ,  Yao-Sheng Lai ,  Jui-Chang Chou

IPC: B21C37/00 ,  H05K3/38 ,  B32B15/08

Abstract: Surface-treated copper foils that exhibit a material volume (Vm) in a range of 0.05 to 0.6 μm3/μm2 and a yellowness index (YI) in a range of 17 to 52 are reported. Where the surface-treated copper foil is treated on the deposited side and includes a treatment layer comprising a nodule layer. Such surface-treated copper foils can be used as a conductive material having low transmission loss, for example in circuit boards.

公开(公告)号：US20230144190A1

公开(公告)日：2023-05-11

申请号：US17560283

申请日：2021-12-23

Applicant: CHANG CHUN PETROCHEMICAL CO., LTD.

Inventor： Jian-Ming Huang ,  Yao-Sheng Lai ,  Jui-Chang Chou

IPC: C25D1/04 ,  H05K3/02 ,  H05K1/02

CPC classification number: C25D1/04 ,  H05K3/022 ,  H05K1/0298

Abstract: A surface-treated copper foil includes a bulk copper foil and a first surface treatment layer. The first surface treatment layer is disposed on a first surface of the bulk copper foil and includes a roughening layer, where the outermost surface of the first surface treatment layer is a treating surface of the surface-treated copper foil. The material volume (Vm) of the treating surface is 0.06 to 1.45 μm3/μm2, and the five-point peak height (S5p) of the treating surface is 0.15 to 2.00 μm.

公开(公告)号：US10787751B2

公开(公告)日：2020-09-29

申请号：US16694412

申请日：2019-11-25

Applicant: CHANG CHUN PETROCHEMICAL CO., LTD.

Inventor： Jian-Ming Huang ,  Yao-Sheng Lai ,  Jui-Chang Chou

IPC: B21C37/00 ,  C25D1/04 ,  B32B15/08 ,  B32B15/20 ,  C25D3/38 ,  C25D5/10 ,  H05K1/18 ,  H05K1/02 ,  H05K1/09

Abstract: Surface-treated copper foils comprising an electrodeposited copper foil including a drum side and a deposited side are reported. The treatment layer is disposed on one of the drum side and the deposited side and provides a surface-treated side. The treatment layer comprises a nodule layer and the surface-treated side exhibits a void volume (Vv) in a range of 0.1 to 0.9 μm3/μm2. The surface-treated copper foil also has a combined hydrogen and oxygen content of less than or equal to 300 ppm.

公开(公告)号：US10190225B2

公开(公告)日：2019-01-29

申请号：US15490608

申请日：2017-04-18

Applicant: CHANG CHUN PETROCHEMICAL CO., LTD.

Inventor： Yao-Sheng Lai ,  Kuei-Seng Cheng ,  Jian-Ming Huang

IPC: C25D1/04 ,  C25D1/20 ,  C25D5/48 ,  C25D3/38 ,  H01M4/04

Abstract: The present disclosure relates to a copper foil that exhibits surprising low repulsive force characteristics; and to methods for manufacturing such copper foils. Typically, the copper foil has (a) a lightness L* value of the nodule untreated side, based on the L*a*b color system, in the range of 75 to 90 and (b) a normal tensile strength in the range of 40 kgf/mm2 to 55 kgf/mm2. The disclosure further relates to flexible printed circuit boards and electronic devices using the above-mentioned copper foils for forming conductive lines therein.

公开(公告)号：US20180298508A1

公开(公告)日：2018-10-18

申请号：US15490608

申请日：2017-04-18

Applicant: CHANG CHUN PETROCHEMICAL CO., LTD.

Inventor： Yao-Sheng LAI ,  Kuei-Seng Cheng ,  Jian-Ming Huang

IPC: C25D1/04 ,  C25D3/38 ,  C25D1/20

CPC classification number: C25D1/04 ,  C25D1/20 ,  C25D3/38 ,  C25D5/38 ,  C25D5/48 ,  H01M4/0438 ,  H01M4/045 ,  H01M4/0469

Abstract: The present disclosure relates to a copper foil that exhibits surprising low repulsive force characteristics; and to methods for manufacturing such copper foils. Typically, the copper foil has (a) a lightness L* value of the nodule untreated side, based on the L*a*b color system, in the range of 75 to 90 and (b) a normal tensile strength in the range of 40 kgf/mm2 to 55 kgf/mm2. The disclosure further relates to flexible printed circuit boards and electronic devices using the above-mentioned copper foils for forming conductive lines therein.

公开(公告)号：US10081875B1

公开(公告)日：2018-09-25

申请号：US15626877

申请日：2017-06-19

Applicant: CHANG CHUN PETROCHEMICAL CO., LTD.

Inventor： Yao-Sheng Lai ,  Kuei-Seng Cheng ,  Jian-Ming Huang

IPC: B21C37/00 ,  C25D1/04 ,  C25D1/20 ,  C25D3/38

Abstract: The present disclosure relates to a copper foil that exhibits surprising low repulsive force characteristics; and to methods for manufacturing such copper foils. Typically, the copper foil has (a) a lightness L* value of the nodule untreated side, based on the L*a*b color system, in the range of 75 to 90 and (b) a normal tensile strength in the range of 40 kgf/mm2 to 55 kgf/mm2. The disclosure further relates to flexible printed circuit boards and electronic devices using the above-mentioned copper foils for forming conductive lines therein.