公开(公告)号：US3437736A

公开(公告)日：1969-04-08

申请号：US3437736D

申请日：1967-09-01

Applicant: CORNING GLASS WORKS

Inventor： ASHER JOHN W ,  CLAYPOOLE STEWART A

IPC: H01G2/08 ,  H01G4/228 ,  H05K5/06

CPC classification number: H01G4/228 ,  H01G2/08

公开(公告)号：US3699620A

公开(公告)日：1972-10-24

申请号：US3699620D

申请日：1968-05-16

Applicant: CORNING GLASS WORKS

Inventor： ASHER JOHN W ,  HERCZOG ANDREW

IPC: H01B3/08 ,  H01G4/12 ,  H01G13/00

CPC classification number: H01G4/129 ,  H01B3/08 ,  Y10T29/435

Abstract: A frit capacitor of either the discrete or integrated microcircuit variety having a ferroelectric glass-ceramic dielectric whose dielectric constant is of intermediate value between about 20 and 400. The desired value of dielectric constant is accurately obtained in a readily reproducible manner by mixing a batch containing appropriate quantities of stable non-crystallizable glass particles and glass particles capable of forming a ferroelectric crystal phase. The desired dielectric constant is obtained by subjecting the batch to heat treatment. By controlling the weight ratio of the two glass components during the batch preparation, individual capacitor dielectrics having different dielectric constants can be provided utilizing the same firing schedule for each.

Abstract translation: 离散或集成的微电路品种的玻璃料电容器具有铁电玻璃 - 陶瓷电介质，其介电常数介于约20和400之间。介电常数的期望值通过混合含有 能够形成铁电晶相的稳定的不可结晶玻璃粒子和玻璃粒子。 通过对批次进行热处理获得所需的介电常数。 通过在批量制备期间控制两个玻璃组分的重量比，可以利用相同的每种烧制方案来提供具有不同介电常数的单个电容器电介质。

公开(公告)号：US3405441A

公开(公告)日：1968-10-15

申请号：US47869065

申请日：1965-08-10

Applicant: CORNING GLASS WORKS

Inventor： ASHER JOHN W ,  MARTIN FRANCIS W ,  TARCZA WALTER H

IPC: C03C3/072 ,  C03C3/074 ,  H01L21/50 ,  H01L23/10 ,  H01L25/16

CPC classification number: H01L23/10 ,  C03C3/072 ,  C03C3/0745 ,  H01L21/50 ,  H01L25/165 ,  H01L2924/0002 ,  H01L2924/09701 ,  Y10T29/49146 ,  H01L2924/00

Abstract: 1,160,732. Ceramic-metal seals. CORNING GLASS WORKS. 1 Aug., 1966 [10 Aug., 1965], No. 34393/66. Heading B3V. [Also in Divisions C1 and H1] A flat ceramic substrate 30 has an aluminium sheet 34 (or copper, nickel-iron or stainless steel) hermetically bonded thereto by vitreous material 36, especially a high-lead glass as disclosed in Specification 1,078,328, and having a co-efficient of thermal expansion matched to that of the substrate. The vitreous material is coated on the sheet and then the assembly subjected to heat and pressure by a stainless steel tool 60 forming coaxial seals and treated by induction. An electrical device is carried by the substrate.