公开(公告)号：US20140034374A1

公开(公告)日：2014-02-06

申请号：US14054217

申请日：2013-10-15

Applicant: CORNING INCORPORATED

Inventor： Ivan A. Cornejo ,  Sinue Gomez ,  James Micheal Harris ,  Lisa Anne Moore ,  Sergio Tsuda

IPC: H05K1/11 ,  H05K1/03

CPC classification number: H05K1/115 ,  C03C15/00 ,  C03C21/002 ,  H01L23/15 ,  H01L23/49827 ,  H05K1/0306 ,  H05K3/4038 ,  H05K2201/0769 ,  H05K2201/09563 ,  H05K2201/10378

Abstract: Glass interposer panels and methods for forming the same are described herein. The interposer panels include a glass substrate core formed from an ion-exchangeable glass. A first layer of compressive stress may extend from a first surface of the glass substrate into the thickness T of the glass substrate core to a first depth of layer D1. A second layer of compressive stress may be spaced apart from the first layer of compressive stress and extending from a second surface of the glass substrate core into the thickness T of the glass substrate core to a second depth of layer D2. A plurality of through-vias may extend through the thickness T of the glass substrate core. Each through-via is surrounded by an intermediate zone of compressive stress that extends from the first layer of compressive stress to the second layer of compressive stress adjacent to a sidewall of each through-via.

Abstract translation: 玻璃插入物面板及其形成方法在此描述。 插入面板包括由可离子交换的玻璃形成的玻璃基底芯。 第一压缩应力层可以从玻璃基板的第一表面延伸到玻璃基板芯的厚度T到层D1的第一深度。 第二压缩应力层可以与第一压缩应力层隔开并且从玻璃基底芯的第二表面延伸到玻璃基底芯的厚度T到层D2的第二深度。 多个通孔可以延伸穿过玻璃衬底芯的厚度T. 每个通孔被压缩应力的中间区域包围，该中间区域从第一压缩应力层延伸到邻近每个通孔的侧壁的第二压缩应力层。