公开(公告)号：US20200010316A1

公开(公告)日：2020-01-09

申请号：US16305119

申请日：2017-05-26

Applicant: CSMC TECHNOLOGIES FAB2 CO., LTD.

Inventor： Yonggang HU

IPC: B81C1/00 ,  B81B7/02 ,  H04R7/06 ,  H04R19/04

Abstract: A MEMS microphone comprises a substrate (110), a lower electrode layer (120), a sacrificial layer (130), a stress layer (140), and an upper electrode layer (150). The substrate (110) is centrally provided with a first opening (111), and the lower electrode layer (120) stretches across the substrate (110). The sacrificial layer (130), the stress layer (140), and the upper electrode layer (150) are sequentially laminated on the lower electrode layer (120), and a second opening (160) is provided on the sacrificial layer (130) and the stress layer (140). The second opening (160) is provided in correspondence with the first opening (111). A stress direction of the stress layer (140) is reverse to a warpage direction of the substrate (110).

公开(公告)号：US20180139544A1

公开(公告)日：2018-05-17

申请号：US15573235

申请日：2016-05-05

Applicant: CSMC TECHNOLOGIES FAB2 CO., LTD.

Inventor： Yonggang HU

IPC: H04R19/04 ,  H04R19/00 ,  H04R7/06 ,  H04R7/18 ,  B81B3/00

CPC classification number: H04R19/04 ,  B81B3/0086 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81B2203/04 ,  H04R7/06 ,  H04R7/18 ,  H04R19/005 ,  H04R2201/003

Abstract: An MEMS microphone comprises a substrate (100), a support portion (200), a superimposed layer (600), an upper plate (300) and a lower plate (400). The substrate (100) is provided with an opening (120) penetrating the middle thereof; the lower plate (400) is arranged above and spanning the substrate (100); the support portion (200) is fixed on the lower plate (400); the upper plate (300) is attached on the support portion (200); an accommodation cavity (500) is formed from the support portion (200), the upper plate (300) and the lower plate (400); the superimposed layer (600) is attached on an central region of the upper plate (300) or the lower plate (400), and insulation is achieved between the upper plate (300) and a lower plate (400).

公开(公告)号：US20220086571A1

公开(公告)日：2022-03-17

申请号：US17422300

申请日：2020-04-30

Applicant: CSMC TECHNOLOGIES FAB2 CO., LTD.

Inventor： Yonggang HU ,  Guoping ZHOU ,  Changfeng XIA

IPC: H04R19/04 ,  H04R19/00 ,  B81B7/02

Abstract: A Micro-Electro-Mechanical System (MEMS) device includes a substrate, and a first sacrificial layer, a first conductive film, a second sacrificial layer, and a second conductive film successively laminated on the substrate, the second sacrificial layer being provided with a cavity; and further includes an amplitude-limiting layer provided with a first through hole and an isolation layer provided with a second through hole. The amplitude-limiting layer is located between the first conductive film and the first sacrificial layer and the isolation layer is located between the amplitude-limiting layer and the first conductive film, and/or the amplitude-limiting layer is located on the second conductive film and the isolation layer is located between the amplitude-limiting layer and the second conductive film. The amplitude-limiting layer extends to a projection region of an opening of the cavity and is in a suspended state.