公开(公告)号：US20190144264A1

公开(公告)日：2019-05-16

申请号：US15811471

申请日：2017-11-13

申请人： InvenSense, Inc.

发明人： Ilya Gurin ,  Joseph Seeger ,  Matthew Thompson

IPC分类号： B81B3/00 ,  B81C99/00

CPC分类号： B81B3/0013 ,  B81B3/0008 ,  B81B3/0027 ,  B81B3/0086 ,  B81B2201/0235 ,  B81B2203/04 ,  B81B2203/055 ,  B81C99/003 ,  G01C19/5719 ,  G01P15/0802 ,  G01P15/125 ,  G01P15/131 ,  G01P21/00 ,  G01P2015/0808

摘要： A microelectromechanical system (MEMS) sensor includes a MEMS layer that includes fixed and movable electrodes. In response to an in-plane linear acceleration, the movable electrodes move with respect to the fixed electrodes, and acceleration is determined based on the resulting change in capacitance. A plurality of auxiliary electrodes are located on a substrate of the MEMS sensor and below the MEMS layer, such that a capacitance between the MEMS layer and the auxiliary loads changes in response to an out-of-plane movement of the MEMS layer or a portion thereof. The MEMS sensor compensates for the acceleration value based on the capacitance sensed by the auxiliary electrodes.

公开(公告)号：US20180265349A1

公开(公告)日：2018-09-20

申请号：US15914979

申请日：2018-03-07

申请人： SEIKO EPSON CORPORATION

发明人： Hisahiro ITO

IPC分类号： B81B7/00 ,  B81B3/00 ,  H03H9/19 ,  H03B5/32

CPC分类号： B81B7/0058 ,  B81B3/0024 ,  B81B3/0086 ,  B81B7/007 ,  H03B5/32 ,  H03H9/0519 ,  H03H9/0533 ,  H03H9/0547 ,  H03H9/1021 ,  H03H9/19

摘要： A vibrator device includes a base, a vibrator that includes a vibrator element and a vibrator element package, which accommodates the vibrator element and has a first terminal on a surface on a base side, a circuit element that is disposed between the base and the vibrator and has a first connection pad on a surface on a vibrator side, and a conductive connecting member that is disposed between the circuit element and the vibrator, bonds the circuit element and the vibrator together, and electrically connects the first connection pad and the first terminal together.

公开(公告)号：US20180243792A1

公开(公告)日：2018-08-30

申请号：US15905289

申请日：2018-02-26

申请人： Butterfly Network, Inc.

发明人： Jonathan M. Rothberg ,  Keith G. Fife ,  Susan A. Alie ,  Joseph Lutsky ,  David Grosjean

IPC分类号： B06B1/02 ,  B81B3/00 ,  B81C1/00 ,  G01N29/24

CPC分类号： B06B1/0292 ,  B81B3/0086 ,  B81C1/00698 ,  B81C2201/0173 ,  B81C2201/115 ,  B81C2203/038 ,  G01N29/2406

摘要： Processes for fabricating capacitive micromachined ultrasonic transducers (CMUTs) are described, as are CMUTs of various doping configurations. An insulating layer separating conductive layers of a CMUT may be formed by forming the layer on a lightly doped epitaxial semiconductor layer. Dopants may be diffused from a semiconductor substrate into the epitaxial semiconductor layer, without diffusing into the insulating layer. CMUTs with different configurations of N-type and P-type doping are also described.

公开(公告)号：US10000374B2

公开(公告)日：2018-06-19

申请号：US15506068

申请日：2015-06-23

申请人： Robert Bosch GmbH

发明人： Christoph Schelling ,  Benedikt Stein ,  Michael Stumber

IPC分类号： H01L29/84 ,  B81B3/00

CPC分类号： B81B3/0086 ,  B81B2201/01 ,  B81B2201/0228 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2203/0136 ,  B81C1/00801

摘要： A layer material which is particularly suitable for the realization of self-supporting structural elements having an electrode in the layer structure of a MEMS component. The self-supporting structural element is at least partially made up of a silicon carbonitride (Si1-x-yCxNy)-based layer.

公开(公告)号：US20180152792A1

公开(公告)日：2018-05-31

申请号：US15826255

申请日：2017-11-29

申请人： Cirrus Logic International Semiconductor Ltd.

发明人： Tsjerk Hans HOEKSTRA ,  Axel THOMSEN ,  Colin Robert JENKINS ,  Aleksey Sergeyevich KHENKIN

IPC分类号： H04R9/08 ,  H04R29/00 ,  B81B3/00

CPC分类号： H04R9/08 ,  B81B3/0086 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/04 ,  H04R19/005 ,  H04R19/04 ,  H04R29/004 ,  H04R2201/003

摘要： A MEMS transducer comprising: a flexible membrane, the flexible membrane comprising a first membrane electrode; a back plate, the back plate comprising a first back plate electrode; wherein the back plate is supported in a spaced relation with respect to the flexible membrane. The MEMS transducer is configured to provide electrical connections to the first membrane electrode and the first back plate electrode. The flexible membrane further comprises a second membrane electrode, the second membrane electrode being electrically isolated from the first membrane electrode, wherein the first membrane electrode and the second membrane electrode are arranged to reduce variation in electrostatic forces across the flexible membrane.

公开(公告)号：US20180079640A1

公开(公告)日：2018-03-22

申请号：US15700179

申请日：2017-09-11

申请人： Innovative Micro Technology

发明人： Christopher S. GUDEMAN ,  Marin Sigurdson

IPC分类号： B81B3/00 ,  B81B7/00 ,  B81C1/00

CPC分类号： B81B3/0013 ,  B81B3/0086 ,  B81B7/0006 ,  B81B7/008 ,  B81C1/00206 ,  B81C1/00936 ,  H01H1/0036 ,  H01H59/0009 ,  H01H2001/0078

摘要： Systems and methods for forming an electrostatic MEMS switch that is used to switch a source of current or voltage. At least one surface of the MEMS switch may be rotated on approach to another substrate, such that when the surfaces are separated, the forces are shearing forces rather than static frictional forces.

公开(公告)号：US09921238B2

公开(公告)日：2018-03-20

申请号：US14836558

申请日：2015-08-26

申请人： KABUSHIKI KAISHA TOSHIBA

发明人： Tamio Ikehashi

IPC分类号： G01P15/125 ,  B81B3/00 ,  B81C1/00 ,  G01P15/18 ,  G01P15/08

CPC分类号： G01P15/125 ,  B81B3/0086 ,  B81B2201/0235 ,  B81B2201/0264 ,  B81B2203/0136 ,  B81C1/00166 ,  G01L9/0048 ,  G01L9/0073 ,  G01L19/0618 ,  G01L19/146 ,  G01P15/18 ,  G01P2015/084 ,  G01P2015/0865

摘要： According to one embodiment, a sensor is disclosed. The sensor includes a substrate, a first fixed electrode arranged on the substrate, a movable electrode arranged above the first fixed electrode and being movable non-parallely, a second fixed electrode arranged above the movable electrode. The sensor further includes a detector to detect a difference between a first capacitance between the first fixed electrode and the movable electrode and a second capacitance between the movable electrode and the second fixed electrode.

公开(公告)号：US09793080B2

公开(公告)日：2017-10-17

申请号：US15240799

申请日：2016-08-18

申请人： INOSO, LLC

发明人： Kiyoshi Mori ,  Ziep Tran ,  Giang Trung Dao ,  Michael Edward Ramon

IPC分类号： B81B3/00 ,  H01H59/00 ,  H01L27/10 ,  H01H49/00 ,  H01H1/00

CPC分类号： H01H59/0009 ,  B81B3/0086 ,  H01H1/0094 ,  H01H49/00

摘要： An electromechanical power switch device and methods thereof. At least some of the illustrative embodiments are devices including a semiconductor substrate, at least one integrated circuit device on a front surface of the semiconductor substrate, an insulating layer on the at least one integrated circuit device, and an electromechanical power switch on the insulating layer. By way of example, the electromechanical power switch may include a source and a drain, a body region disposed between the source and the drain, and a gate including a switching metal layer. In some embodiments, the body region includes a first body portion and a second body portion spaced a distance from the first body portion and defining a body discontinuity therebetween. Additionally, in various examples, the switching metal layer may be disposed over the body discontinuity.

公开(公告)号：US09783411B1

公开(公告)日：2017-10-10

申请号：US15349607

申请日：2016-11-11

申请人： Rosemount Aerospace Inc.

发明人： David P. Potasek ,  Sean Houlihan

IPC分类号： H01L29/49 ,  B81B3/00 ,  B81C1/00

CPC分类号： B81B3/0086 ,  B81B2201/0264 ,  B81B2207/07 ,  B81C1/00269 ,  B81C2201/013 ,  G01L9/0073

摘要： A configuration for a capacitive pressure sensor uses a silicon on insulator wafer to create an electrically isolated sensing node across a gap from a pressure sensing wafer. The electrical isolation, small area of the gap, and silicon material throughout the capacitive pressure sensor allow for minimal parasitic capacitance and avoid problems associated with thermal mismatch.

公开(公告)号：US09783409B2

公开(公告)日：2017-10-10

申请号：US14499200

申请日：2014-09-28

申请人： Ming-Han Tsai ,  Chih-Ming Sun ,  Hsin-Hui Hsu

发明人： Ming-Han Tsai ,  Chih-Ming Sun ,  Hsin-Hui Hsu

IPC分类号： G01R27/26 ,  B81B3/00

CPC分类号： B81B3/0086

摘要： This invention provides a MEMS device, including: a mass structure having at least one anchor; at least one flexible structure connected with the mass structure at the at least one anchor; a plurality of top electrodes located above the mass structure and forming a top capacitor circuit with the mass structure; and a plurality of bottom electrodes located under the mass structure and forming a bottom capacitor circuit with the mass structure. The projections of the plural top electrodes on the mass structure along a normal direction of the mass structure are located at opposite sides of the anchor, and the projections of the plural bottom electrodes on the mass structure along a normal direction of the mass structure are located at opposite sides of the anchor. This invention also provides a MEMS compensation structure.