公开(公告)号：US20080217798A1

公开(公告)日：2008-09-11

申请号：US11737742

申请日：2007-04-19

申请人： Chao-Chun Huang ,  Fuh-Yu Chang ,  Cheng-Hsuan Lin ,  Tune-Hune Kao

发明人： Chao-Chun Huang ,  Fuh-Yu Chang ,  Cheng-Hsuan Lin ,  Tune-Hune Kao

IPC分类号： B29D7/01

CPC分类号： B29C59/04 ,  B29C2059/028

摘要： A mold structure and the manufacturing method thereof are disclosed. The mold structure is comprised of: an axle; a roller, axially ensheathing the axle; and a mold having a specific imprint pattern of microstructures formed thereon, being arranged to mount on the periphery of the roller while connecting to the axle; wherein a pulling force is exerted on the mold by the axle for stretching the mold while enabling the same to tensely adhere upon the periphery of the roller.

摘要翻译： 公开了一种模具结构及其制造方法。 模具结构包括：轴; 一个轴，轴向固定轴; 以及具有形成在其上的微结构的特定刻印图案的模具，被布置成在连接到所述轴的同时安装在所述辊的周边上; 其中通过所述车轴在所述模具上施加拉力以拉伸所述模具，同时使得所述拉伸力能够紧密地粘附在所述辊的周边上。

公开(公告)号：US08659160B2

公开(公告)日：2014-02-25

申请号：US13186411

申请日：2011-07-19

申请人： Meng-Chi Huang ,  Han-Ping Yang ,  Min-Chieh Chou ,  Tune-Hune Kao ,  Jung-Kang Peng ,  Cheng-Hsuan Lin ,  Jian-Shian Lin

发明人： Meng-Chi Huang ,  Han-Ping Yang ,  Min-Chieh Chou ,  Tune-Hune Kao ,  Jung-Kang Peng ,  Cheng-Hsuan Lin ,  Jian-Shian Lin

IPC分类号： H01L23/48

CPC分类号： H01L33/0079 ,  H01L33/641 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2933/0041 ,  H01L2933/0075 ,  H01L2924/00014

摘要： A die structure, a manufacturing method and a substrate, wherein the die structure is constituted by a chip on wafer (COW) and the substrate, and the substrate is formed by stacking and then cutting a plurality of thermal and electrical conductive poles and a plurality of insulating material layers. Moreover, the fabricating of the die structure comprises a plurality of COWs carried on a carrier board is bonded on the substrate, the plurality of COWs are in contact with the plurality of thermal and electrical conductive poles on the substrate, and then the carrier board is removed. After that, a phosphor plate is adhered on the plurality of COWs so as to form a stacked structure. Thereafter, the stacked structure is cut, thus forming a plurality of die structures having at least one COW.

摘要翻译： 模具结构，制造方法和基板，其中，所述模具结构由晶片上的芯片（COW）和所述基板构成，所述基板通过层叠形成，然后切割多个导热极和多个导电极 的绝缘材料层。 此外，模具结构的制造包括承载在载体板上的多个COW结合在基板上，多个COW与基板上的多个热导电极接触，然后载板是 删除。 之后，在多个COW上粘接荧光体板，形成层叠结构。 此后，切割堆叠结构，从而形成具有至少一个COW的多个模具结构。

公开(公告)号：US20120168950A1

公开(公告)日：2012-07-05

申请号：US13186411

申请日：2011-07-19

申请人： Meng-Chi Huang ,  Han-Ping Yang ,  Min-Chieh Chou ,  Tune-Hune Kao ,  Jung-Kang Peng ,  Cheng-Hsuan Lin ,  Jian-Shian Lin

发明人： Meng-Chi Huang ,  Han-Ping Yang ,  Min-Chieh Chou ,  Tune-Hune Kao ,  Jung-Kang Peng ,  Cheng-Hsuan Lin ,  Jian-Shian Lin

IPC分类号： H01L23/48 ,  H01L21/50

CPC分类号： H01L33/0079 ,  H01L33/641 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2933/0041 ,  H01L2933/0075 ,  H01L2924/00014

摘要： A die structure, a manufacturing method and a substrate, wherein the die structure is constituted by a chip on wafer (COW) and the substrate, and the substrate is formed by stacking and then cutting a plurality of thermal and electrical conductive poles and a plurality of insulating material layers. Moreover, the fabricating of the die structure comprises a plurality of COWs carried on a carrier board is bonded on the substrate, the plurality of COWs are in contact with the plurality of thermal and electrical conductive poles on the substrate, and then the carrier board is removed. After that, a phosphor plate is adhered on the plurality of COWs so as to form a stacked structure. Thereafter, the stacked structure is cut, thus forming a plurality of die structures having at least one COW.

摘要翻译： 模具结构，制造方法和基板，其中，所述模具结构由晶片上的芯片（COW）和所述基板构成，所述基板通过层叠形成，然后切割多个导热极和多个导电极 的绝缘材料层。 此外，模具结构的制造包括承载在载体板上的多个COW结合在基板上，多个COW与基板上的多个热导电极接触，然后载板是 删除。 之后，在多个COW上粘接荧光体板，形成层叠结构。 此后，切割堆叠结构，从而形成具有至少一个COW的多个模具结构。