公开(公告)号：US08659160B2

公开(公告)日：2014-02-25

申请号：US13186411

申请日：2011-07-19

申请人： Meng-Chi Huang ,  Han-Ping Yang ,  Min-Chieh Chou ,  Tune-Hune Kao ,  Jung-Kang Peng ,  Cheng-Hsuan Lin ,  Jian-Shian Lin

发明人： Meng-Chi Huang ,  Han-Ping Yang ,  Min-Chieh Chou ,  Tune-Hune Kao ,  Jung-Kang Peng ,  Cheng-Hsuan Lin ,  Jian-Shian Lin

IPC分类号： H01L23/48

CPC分类号： H01L33/0079 ,  H01L33/641 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2933/0041 ,  H01L2933/0075 ,  H01L2924/00014

摘要： A die structure, a manufacturing method and a substrate, wherein the die structure is constituted by a chip on wafer (COW) and the substrate, and the substrate is formed by stacking and then cutting a plurality of thermal and electrical conductive poles and a plurality of insulating material layers. Moreover, the fabricating of the die structure comprises a plurality of COWs carried on a carrier board is bonded on the substrate, the plurality of COWs are in contact with the plurality of thermal and electrical conductive poles on the substrate, and then the carrier board is removed. After that, a phosphor plate is adhered on the plurality of COWs so as to form a stacked structure. Thereafter, the stacked structure is cut, thus forming a plurality of die structures having at least one COW.

摘要翻译： 模具结构，制造方法和基板，其中，所述模具结构由晶片上的芯片（COW）和所述基板构成，所述基板通过层叠形成，然后切割多个导热极和多个导电极 的绝缘材料层。 此外，模具结构的制造包括承载在载体板上的多个COW结合在基板上，多个COW与基板上的多个热导电极接触，然后载板是 删除。 之后，在多个COW上粘接荧光体板，形成层叠结构。 此后，切割堆叠结构，从而形成具有至少一个COW的多个模具结构。

公开(公告)号：US20130170203A1

公开(公告)日：2013-07-04

申请号：US13602339

申请日：2012-09-04

申请人： Kuei-Yuan Cheng ,  Chia-Jen Ting ,  Meng-Chi Huang ,  Hui-Hsiung Lin ,  Ta-Hsin Chou

发明人： Kuei-Yuan Cheng ,  Chia-Jen Ting ,  Meng-Chi Huang ,  Hui-Hsiung Lin ,  Ta-Hsin Chou

IPC分类号： F21V5/04

CPC分类号： F21V5/007 ,  F21V11/06 ,  F21V13/10 ,  F21Y2105/10 ,  F21Y2115/10

摘要： A light-emitting diode (LED) array light source includes a substrate, a meshed light-shielding layer, LED chips, and a micro-lens array. The meshed light-shielding layer includes bar-shaped light-shielding patterns intersected with one another to define openings. Each bar-shaped light-shielding pattern has a bottom surface, a top surface, and two side surfaces. A width of the top surface is smaller than that of the bottom surface. A thickness of the meshed light-shielding layer is T1. Each LED chip is exclusively located in one of the openings. The micro-lens array covers the substrate, the meshed light-shielding layer, and the LED chips and includes micro-lenses arranged in array. Each micro-lens includes a base portion and a lens portion, and is disposed corresponding to one of the openings, respectively. A vertical distance from a top portion of each micro-lens to the bottom surface is T2, and 0.278≦T1/T2≦0.833.

摘要翻译： 发光二极管（LED）阵列光源包括基板，网状遮光层，LED芯片和微透镜阵列。 网状遮光层包括彼此相交的条形遮光图案，以限定开口。 每个条形遮光图案具有底表面，顶表面和两个侧表面。 上表面的宽度小于底面的宽度。 网状遮光层的厚度为T1。 每个LED芯片都位于其中一个开口中。 微透镜阵列覆盖基板，网状遮光层和LED芯片，并且包括排列成阵列的微透镜。 每个微透镜包括基部和透镜部分，并且分别对应于一个开口设置。 从每个微透镜的顶部到底面的垂直距离为T2，0.278 @ T1 / T2 @ 0.833。

公开(公告)号：US20080094084A1

公开(公告)日：2008-04-24

申请号：US11616892

申请日：2006-12-28

申请人： Meng-Chi Huang ,  Min-Chieh Chou ,  Fuh-Yu Chang ,  Ching-Ping Wu

发明人： Meng-Chi Huang ,  Min-Chieh Chou ,  Fuh-Yu Chang ,  Ching-Ping Wu

IPC分类号： G01R31/02 ,  H01R43/00

CPC分类号： G01R1/06711 ,  G01R1/06761 ,  G01R3/00 ,  Y10T29/49002 ,  Y10T29/49117

摘要： A multi-layer electric probe, suitable for testing a to-be-tested device, includes a first strip layer and a second strip layer. The first strip layer has a first conductivity and a first mechanical strength. The second strip layer has a second conductivity and a second mechanical strength. The first strip layer and the second strip layer are solidly adhered together as a structural body so as to produce at least one of the desired capabilities of enduring current and mechanical strength. The multi-layer electric probe can further include at least a third strip layer having the capability of enduring current and the desired mechanical strength.

摘要翻译： 适用于测试待测试装置的多层电探针包括第一条带层和第二条带层。 第一带状层具有第一导电性和第一机械强度。 第二带状层具有第二导电性和第二机械强度。 第一带层和第二带层作为结构体牢固地粘合在一起，以便产生持久电流和机械强度的期望能力中的至少一个。 多层电探​​针还可以包括具有耐久电流和期望的机械强度的能力的至少第三带状层。

公开(公告)号：US20120168950A1

公开(公告)日：2012-07-05

申请号：US13186411

申请日：2011-07-19

申请人： Meng-Chi Huang ,  Han-Ping Yang ,  Min-Chieh Chou ,  Tune-Hune Kao ,  Jung-Kang Peng ,  Cheng-Hsuan Lin ,  Jian-Shian Lin

发明人： Meng-Chi Huang ,  Han-Ping Yang ,  Min-Chieh Chou ,  Tune-Hune Kao ,  Jung-Kang Peng ,  Cheng-Hsuan Lin ,  Jian-Shian Lin

IPC分类号： H01L23/48 ,  H01L21/50

CPC分类号： H01L33/0079 ,  H01L33/641 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2933/0041 ,  H01L2933/0075 ,  H01L2924/00014

摘要： A die structure, a manufacturing method and a substrate, wherein the die structure is constituted by a chip on wafer (COW) and the substrate, and the substrate is formed by stacking and then cutting a plurality of thermal and electrical conductive poles and a plurality of insulating material layers. Moreover, the fabricating of the die structure comprises a plurality of COWs carried on a carrier board is bonded on the substrate, the plurality of COWs are in contact with the plurality of thermal and electrical conductive poles on the substrate, and then the carrier board is removed. After that, a phosphor plate is adhered on the plurality of COWs so as to form a stacked structure. Thereafter, the stacked structure is cut, thus forming a plurality of die structures having at least one COW.

摘要翻译： 模具结构，制造方法和基板，其中，所述模具结构由晶片上的芯片（COW）和所述基板构成，所述基板通过层叠形成，然后切割多个导热极和多个导电极 的绝缘材料层。 此外，模具结构的制造包括承载在载体板上的多个COW结合在基板上，多个COW与基板上的多个热导电极接触，然后载板是 删除。 之后，在多个COW上粘接荧光体板，形成层叠结构。 此后，切割堆叠结构，从而形成具有至少一个COW的多个模具结构。

公开(公告)号：US20090246717A1

公开(公告)日：2009-10-01

申请号：US12187334

申请日：2008-08-06

申请人： Meng-Chi Huang ,  Cheng-Hsuan Lin ,  Fuh-Yu Chang

发明人： Meng-Chi Huang ,  Cheng-Hsuan Lin ,  Fuh-Yu Chang

IPC分类号： G03F7/20

CPC分类号： G03F7/7035

摘要： A photoresist layer is disclosed. Utilizing light diffraction properties, a transparent layer is disposed between a light-shielding layer and a photoresist layer during an exposure step, such that the patterned photoresist layer has non-vertical sidewalls. The method of the invention can be applied during front side exposure or back side exposure, and is also practical for positive type photoresists or negative photoresists.

摘要翻译： 公开了一种光致抗蚀剂层。 利用光衍射特性，在曝光步骤期间，在遮光层和光致抗蚀剂层之间设置透明层，使得图案化的光致抗蚀剂层具有非垂直侧壁。 本发明的方法可以在正面曝光或背面曝光中应用，并且对于正型光致抗蚀剂或负型光致抗蚀剂也是实用的。

公开(公告)号：US20100281679A1

公开(公告)日：2010-11-11

申请号：US12841176

申请日：2010-07-22

申请人： Meng-Chi Huang ,  Min-Chieh Chou ,  Fuh-Yu Chang ,  Ching-Ping Wu

发明人： Meng-Chi Huang ,  Min-Chieh Chou ,  Fuh-Yu Chang ,  Ching-Ping Wu

IPC分类号： H05K13/00

CPC分类号： G01R1/06711 ,  G01R1/06761 ,  G01R3/00 ,  Y10T29/49002 ,  Y10T29/49117

摘要： A method of fabricating a multi-layer electric probe. The method includes forming a first strip layer. The first strip layer has a first conductivity and a first mechanical strength. Then, a second strip layer is solidly adhered to a surface of the first strip layer to form a structural body, wherein the second strip layer has a second conductivity and a second mechanical strength. The combination of the second conductivity and the second mechanical strength with the first conductivity and the first mechanical strength produces the desired capabilities of enduring current and mechanical strength.

摘要翻译： 一种制造多层电探针的方法。 该方法包括形成第一带状层。 第一带状层具有第一导电性和第一机械强度。 然后，第二带状层牢固地附着到第一带状层的表面，形成结构体，其中第二带状层具有第二导电性和第二机械强度。 第二导电性和第二机械强度与第一导电性和第一机械强度的组合产生持久电流和机械强度的期望能力。