公开(公告)号：US20110223705A1

公开(公告)日：2011-09-15

申请号：US12848700

申请日：2010-08-02

Applicant: Chien-Nan Yu ,  Chung-Feng Tsao ,  Ying-Chieh Chen ,  Szu-Hao Lyu ,  Ching-Lung Jao ,  Hang-Kau Khor

Inventor： Chien-Nan Yu ,  Chung-Feng Tsao ,  Ying-Chieh Chen ,  Szu-Hao Lyu ,  Ching-Lung Jao ,  Hang-Kau Khor

IPC: H01L31/18

CPC classification number: H01L27/14618 ,  H01L27/14683 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A process for assembling a camera module is provided. Firstly, a first conductive bump and a second conductive bump are placed on a signal terminal of a substrate and a contact pad of an image sensing chip, respectively. Then, the substrate and the image sensing chip are laminated, so that the first conductive bump and the second conductive bump are combined together and the signal terminal of the substrate and the contact pad of the image sensing chip are electrically connected with each other. Then, an underfill is applied to a region between the substrate and the image sensing chip. Since the two conductive bumps are connected with each other by the assembling process, the quality of the camera module of the present invention is enhanced.

Abstract translation: 提供了组装相机模块的过程。 首先，将第一导电凸块和第二导电凸块分别放置在基板的信号端子和图像感测芯片的接触焊盘上。 然后，层叠基板和图像感测芯片，使得第一导电凸块和第二导电凸块组合在一起，并且基板的信号端子和图像感测芯片的接触焊盘彼此电连接。 然后，将底部填充物施加到基板和图像感测芯片之间的区域。 由于两个导电凸块通过组装工艺彼此连接，因此本发明的相机模块的质量得到提高。

公开(公告)号：US07515254B2

公开(公告)日：2009-04-07

申请号：US11644256

申请日：2006-12-21

Applicant: Ching-Lung Jao

Inventor： Ching-Lung Jao

IPC: G01B9/00

CPC classification number: G01M11/0257

Abstract: A reflection-testing device for testing for unwanted reflections in a lens module (12) includes a plurality of light sources (18) and an image capturer (16). The plurality of light sources is provided around the top end of the lens module, and the image capturer is provided near the other end of the lens module for receiving optical signals through the lens module. A lens reflection testing method is also disclosed.

Abstract translation: 用于测试透镜模块（12）中的不需要的反射的反射测试装置包括多个光源（18）和图像捕获器（16）。 多个光源设置在透镜模块的顶端周围，并且图像捕获器设置在透镜模块的另一端附近，用于通过透镜模块接收光信号。 还公开了透镜反射测试方法。

公开(公告)号：US07928526B2

公开(公告)日：2011-04-19

申请号：US11972511

申请日：2008-01-10

Applicant: Ching-Lung Jao ,  Yu-Te Chou

Inventor： Ching-Lung Jao ,  Yu-Te Chou

IPC: H01L31/0232

CPC classification number: H01L27/14618 ,  H01L27/14625 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: An exemplary imaging module package includes a substrate, an imaging sensor chip set on the substrate, a housing positioned on the substrate, and a lens module. The housing includes a first chamber enclosing the imaging sensor chip therein, a second chamber coaxially extending from the first chamber for receiving the lens module therein, and a shoulder between the first and second chambers. The shoulder abuts against a top surface of the imaging sensor chip.

Abstract translation: 示例性成像模块封装包括基板，设置在基板上的成像传感器芯片，位于基板上的壳体和透镜模块。 壳体包括在其中包围成像传感器芯片的第一腔室，从第一腔室同轴延伸以用于在其中接收透镜模块的第二腔室，以及在第一腔室和第二腔室之间的肩部。 肩部抵靠成像传感器芯片的顶面。

公开(公告)号：US07638865B2

公开(公告)日：2009-12-29

申请号：US11964791

申请日：2007-12-27

Applicant: Ching-Lung Jao ,  Yu-Te Chou

Inventor： Ching-Lung Jao ,  Yu-Te Chou

IPC: H01L23/08

CPC classification number: H05K1/147 ,  H01L27/14618 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0306 ,  H05K2201/0326 ,  H05K2201/10121 ,  H01L2924/00014

Abstract: A sensor package includes an image sensing chip having a front surface, a plurality of bumps, a glass cover plate, and a connector. The plurality of bumps are formed on the front surface, and are electrically connected to the image sensing chip. The glass cover plate has a bottom surface facing the front surface, and the glass cover plate has a plurality of transparent conductive wires formed on the bottom surface. A terminal of each of the transparent conductive wires is electrically connected to a respective bump, and another terminal of each of the transparent conductive wires extends out of an orthogonal projection area of the image sensing chip on the bottom surface. The connector is electrically connected to the another terminal of each of the transparent conductive wires.

Abstract translation: 传感器封装包括具有前表面，多个凸块，玻璃盖板和连接器的图像感测芯片。 多个凸块形成在前表面上，并且电连接到图像感测芯片。 玻璃盖板具有面向前表面的底面，并且玻璃盖板具有形成在底面上的多个透明导电线。 每个透明导线的端子电连接到相应的凸块，并且每个透明导线的另一个端子从底表面上的图像感测芯片的正交投影区域延伸出来。 连接器电连接到每个透明导线的另一个端子。

公开(公告)号：US07460317B2

公开(公告)日：2008-12-02

申请号：US11450649

申请日：2006-06-09

Applicant: Steven Webster ,  Ying-Cheng Wu ,  Ching-Lung Jao

Inventor： Steven Webster ,  Ying-Cheng Wu ,  Ching-Lung Jao

IPC: G02B7/02

CPC classification number: G02B7/02

Abstract: A digital camera module (100) includes a lens barrel (20), a lens holder (22), an image pick-up module (26), and a protective member. The lens barrel defines a central hollow, and has at least one lens (202) received therein. The lens holder defines a central hollow. The lens barrel is movably received in the lens holder along an axis of the lens holder. The image pick-up module is arranged to receive light from the lenses. The protective member is configured for preventing dust and/or particle contamination associated with a relative movement of the lens barrel and the lens holder falling onto the image pick-up module.

Abstract translation: 数码相机模块（100）包括镜筒（20），透镜保持架（22），图像拾取模块（26）和保护构件。 透镜筒限定中心空腔，并且其中容纳有至少一个透镜（202）。 透镜架定义中心空心。 透镜镜筒沿透镜保持器的轴线可移动地容纳在透镜保持器中。 图像拾取模块被布置成接收来自透镜的光。 保护构件被配置为防止与透镜镜筒和透镜保持器落在图像拾取模块上的相对运动相关联的灰尘和/或颗粒污染。

公开(公告)号：US20070008631A1

公开(公告)日：2007-01-11

申请号：US11450649

申请日：2006-06-09

Applicant: Steven Webster ,  Ying-Cheng Wu ,  Ching-Lung Jao

Inventor： Steven Webster ,  Ying-Cheng Wu ,  Ching-Lung Jao

IPC: G02B7/02

CPC classification number: G02B7/02

Abstract: A digital camera module (100) includes a lens barrel (20), a lens holder (22), an image pick-up module (26), and a protective member. The lens barrel defines a central hollow, and has at least one lens (202) received therein. The lens holder defines a central hollow. The lens barrel is movably received in the lens holder along an axis of the lens holder. The image pick-up module is arranged to receive light from the lenses. The protective member is configured for preventing dust and/or particle contamination associated with a relative movement of the lens barrel and the lens holder falling onto the image pick-up module.

Abstract translation: 数码相机模块（100）包括镜筒（20），透镜保持架（22），图像拾取模块（26）和保护构件。 透镜筒限定中心空腔，并且其中容纳有至少一个透镜（202）。 透镜架定义中心空心。 透镜镜筒沿透镜保持器的轴线可移动地容纳在透镜保持器中。 图像拾取模块被布置成接收来自透镜的光。 保护构件被配置为防止与透镜镜筒和透镜保持器落在图像拾取模块上的相对运动相关联的灰尘和/或颗粒污染。

公开(公告)号：US08059155B2

公开(公告)日：2011-11-15

申请号：US11626723

申请日：2007-01-24

Applicant: Ching-Lung Jao ,  Kuo-Liang Tai

Inventor： Ching-Lung Jao ,  Kuo-Liang Tai

IPC: H04N17/00

CPC classification number: H04N17/002

Abstract: A measuring system (200) for measuring a FOV of a digital camera module (52) includes a measuring chart (22), a parameter inputting module (32), and a processing module (42). The measuring chart defines a colored portion. The parameter inputting module is used to input relative parameters. The processing module is connected to the parameter inputting module and receives electronic image signals converted from images of the colored portion and of the measuring chart screened by the lens module. The processing module is configured for calculating the FOV θ of the digital camera module. A measuring method for measuring the FOV θ of the digital camera module is also provided.

Abstract translation: 用于测量数字照相机模块（52）的FOV的测量系统（200）包括测量图（22），参数输入模块（32）和处理模块（42）。 测量图定义了彩色部分。 参数输入模块用于输入相关参数。 处理模块连接到参数输入模块，并接收从彩色部分和由镜头模块屏蔽的测量图的图像转换的电子图像信号。 处理模块被配置为用于计算FOV＆amp; 的数码相机模块。 测量FOV和测量的测量方法; 还提供了数码相机模块。

公开(公告)号：US20070236683A1

公开(公告)日：2007-10-11

申请号：US11644256

申请日：2006-12-21

Applicant: Ching-Lung Jao

Inventor： Ching-Lung Jao

IPC: G01B9/00 ,  G01N21/55 ,  G01N21/88

CPC classification number: G01M11/0257

Abstract: A reflection-testing device for testing for unwanted reflections in a lens module (12) includes a plurality of light sources (18) and an image capturer (16). The plurality of light sources is provided around the top end of the lens module, and the image capturer is provided near the other end of the lens module for receiving optical signals through the lens module. A lens reflection testing method is also disclosed.

Abstract translation: 用于测试透镜模块（12）中的不需要的反射的反射测试装置包括多个光源（18）和图像捕获器（16）。 多个光源设置在透镜模块的顶端周围，并且图像捕获器设置在透镜模块的另一端附近，用于通过透镜模块接收光信号。 还公开了透镜反射测试方法。

公开(公告)号：US20060290801A1

公开(公告)日：2006-12-28

申请号：US11441485

申请日：2006-05-26

Applicant: Ching-Lung Jao

Inventor： Ching-Lung Jao

IPC: G02B13/16

CPC classification number: H04N5/2253 ,  G02B7/022 ,  G02B7/023 ,  H04N5/2254 ,  H04N5/2257

Abstract: A digital camera module (100) includes a lens holder (20), a lens mount (22), and an image pick-up module (24). The lens holder defining a central hollow, and has at least one lens (206[check number]) received therein. The lens mount defining a central hollow, and an inner diameter of the lens holder being slightly greater than or equal to an outer diameter of the lens mount such that the lens holder capable of locating around the lens mount and movable along an axis of the lens mount. The image pick-up module is arranged so as to receive the light from the lenses.

Abstract translation: 数码相机模块（100）包括透镜架（20），透镜座（22）和图像拾取模块（24）。 所述透镜保持件限定中心空腔，并且具有容纳在其中的至少一个透镜（206 [检查编号]）。 镜头支架限定了一个中心的中空部分，透镜支架的内径略大于或等于透镜支架的外径，使透镜支架能够定位在透镜支架周围并沿着透镜的轴线移动 安装。 图像拾取模块被布置成接收来自透镜的光。

公开(公告)号：US07614807B2

公开(公告)日：2009-11-10

申请号：US11669373

申请日：2007-01-31

Applicant: Ching-Lung Jao

Inventor： Ching-Lung Jao

IPC: G03B17/00 ,  G03B17/02

CPC classification number: G03B17/28 ,  G02B7/02 ,  G02B13/001 ,  H04N5/2251 ,  H04N5/2257

Abstract: An exemplary camera mechanism (8) includes a lens module (10), an image sensor module (20), an electronic module (30), and a transmission module (40). The image sensor module is mounted under the lens module. The electronic module is mounted to at least one of the lens module and the image sensor module. The transmission module has a main body (41), a first electronic connection end (43) and a second electronic connection end (45). The lens module and the image sensor module are mounted on the main body. The first electronic connection end is formed at a top end of the main body. The second electronic connection end is formed at a bottom end of the main body. The first electronic connection end is electrically connected to the electronic module and to the second electronic connection end, and the second electronic connection end is capable of being electrically connected to a mother board (50).

Abstract translation: 示例性相机机构（8）包括透镜模块（10），图像传感器模块（20），电子模块（30）和传输模块（40）。 图像传感器模块安装在镜头模块下方。 电子模块安装在透镜模块和图像传感器模块中的至少一个上。 传动模块具有主体（41），第一电子连接端（43）和第二电子连接端（45）。 镜头模块和图像传感器模块安装在主体上。 第一电子连接端形成在主体的顶端。 第二电子连接端形成在主体的底端。 第一电子连接端电连接到电子模块和第二电子连接端，并且第二电子连接端能够电连接到母板（50）。