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公开(公告)号：US11906781B2
公开(公告)日：2024-02-20
申请号：US18064506
申请日：2022-12-12
Applicant: Cisco Technology, Inc.
Inventor： Roman Bruck , Gianlorenzo Masini
Abstract: A method includes providing a photonic wafer that includes an electrical layer and a layer disposed on a substrate. The layer includes at least one optical waveguide that is disposed between the electrical layer and the substrate. The method also includes removing a portion of the substrate underneath the at least one optical waveguide and forming an end-face coupler. A portion of the end-face coupler is within the removed portion of the substrate. The end-face coupler transmits an optical signal to, or receives an optical signal from, an external optical device.
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公开(公告)号：US11860412B2
公开(公告)日：2024-01-02
申请号：US17081852
申请日：2020-10-27
Applicant: Cisco Technology, Inc.
Inventor： Subal Sahni , Kamal V. Karimanal , Gianlorenzo Masini , Attila Mekis , Roman Bruck
CPC classification number: G02B6/1225 , G02B6/12014 , G02B2006/12061 , G02B2006/12107 , G02B2006/12135
Abstract: Embodiments include a photonic device with a compensation structure. The photonic device includes a waveguide with a refractive index which changes according to the thermo-optic effect as a temperature of the photonic device fluctuates. The compensation structure is positioned on the photonic device to counteract or otherwise alter the thermo-optic effect on the refractive index of the waveguide in order to prevent malfunctions of the photonic device.
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公开(公告)号：US11567262B2
公开(公告)日：2023-01-31
申请号：US17248579
申请日：2021-01-29
Applicant: Cisco Technology, Inc.
Inventor： Roman Bruck , Gianlorenzo Masini
Abstract: A method includes providing a photonic wafer that includes an electrical layer and a layer disposed on a substrate. The layer includes at least one optical waveguide that is disposed between the electrical layer and the substrate. The method also includes removing a portion of the substrate underneath the at least one optical waveguide and forming an end-face coupler. A portion of the end-face coupler is within the removed portion of the substrate. The end-face coupler transmits an optical signal to, or receives an optical signal from, an external optical device.
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公开(公告)号：US20240361523A1
公开(公告)日：2024-10-31
申请号：US18140826
申请日：2023-04-28
Applicant: Cisco Technology, Inc.
Inventor： Long Chen , Gianlorenzo Masini
IPC: G02B6/122 , H01L31/105 , H01L31/18
CPC classification number: G02B6/122 , H01L31/105 , H01L31/1804 , G02B2006/12061 , G02B2006/12123
Abstract: In part, in one aspect, the disclosure relates to a photodiode. The photodiode may include a substrate; a semiconductor layer comprising an semiconductor material, the semiconductor layer disposed on the substrate and in communication with at least a region of the substrate, the semiconductor layer having a first side, a second side, and an upper surface, the semiconductor layer having a height; a semiconductor structure partially disposed on the upper surface, the semiconductor structure comprising at least one elongate portion that extends beyond the first side and along a portion of the upper surface of the semiconductor layer; and a metal contact that is in electrical connection with the elongate portion of the semiconductor structure.
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