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公开(公告)号：US11353668B2
公开(公告)日：2022-06-07
申请号：US17070763
申请日：2020-10-14
Applicant: Cisco Technology, Inc.
Inventor： Ashley J. M. Erickson , Vipulkumar K. Patel , Aparna R. Prasad
Abstract: An integrated circuit (IC) package having multiple ICs is provided. The IC package includes a printed circuit board (PCB) having a cutout region and a substrate disposed above the PCB. The substrate includes a first cavity on a first surface of the substrate. The IC package also includes a first IC disposed on a second surface of the substrate and in the cutout region of the PCB, The IC package further includes a second IC disposed above the substrate, and a first device disposed on the second IC and in the first cavity on the first surface of the substrate.
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公开(公告)号：US11067750B2
公开(公告)日：2021-07-20
申请号：US16259998
申请日：2019-01-28
Applicant: Cisco Technology, Inc.
Inventor： Alexey V. Vert , Vipulkumar K. Patel , Mark A. Webster
Abstract: Embodiments disclosed herein generally relate to optical coupling between a highly-confined waveguide region and a low confined waveguide region in an optical device. The low confined waveguide region includes a trench in a substrate of the optical device in order to provide additional dielectric layer thickness for insulation between the substrate of the optical device and waveguides for light signals having a low optical mode. The low confined waveguide region is coupled to the highly-confined waveguide region via a waveguide overlap and in some embodiments via an intermediary coupling waveguide.
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公开(公告)号：US11036069B2
公开(公告)日：2021-06-15
申请号：US16356982
申请日：2019-03-18
Applicant: Cisco Technology, Inc.
Inventor： Xunyuan Zhang , Vipulkumar K. Patel , Prakash B. Gothoskar , Ming Gai Stanley Lo
IPC: G02F1/025
Abstract: Embodiments provide for an optical modulator, comprising: a lower guide, comprising: a lower hub, made of monocrystalline silicon; and a lower ridge, made of monocrystalline silicon that extends in a first direction from the lower hub; an upper guide, including: an upper hub; and an upper ridge, made of monocrystalline silicon that extends in a second direction, opposite of the first direction, from the upper hub and is aligned with the lower ridge; and a gate oxide layer separating the lower ridge from the upper ridge and defining a waveguide region with the lower guide and the upper guide.
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公开(公告)号：US20230073957A1
公开(公告)日：2023-03-09
申请号：US17447145
申请日：2021-09-08
Applicant: Cisco Technology, Inc.
Inventor： Norbert Schlepple , Vipulkumar K. Patel
Abstract: Techniques for aligning each of a plurality of optical fibers for coupling to a photonic integrated circuit (PIC). Transmission is detected from each respective optical fiber to the PIC using a probe, and the respective optical fiber is aligned based on the detected transmission. Each of the plurality of optical fibers is coupled to the PIC using at least one of: (i) laser splicing, (ii) laser spot welding, or (iii) arc welding,
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公开(公告)号：US11245250B2
公开(公告)日：2022-02-08
申请号：US16853457
申请日：2020-04-20
Applicant: Cisco Technology, Inc.
Inventor： Dominic F. Siriani , Vipulkumar K. Patel
Abstract: A quantum dot comb laser, is provided that comprises a first waveguide having a first width; and a second waveguide running above the first waveguide that includes: a quantum dot layer; a first region of a second width less than the first width; a second region connected to the first region and comprising a reflective grating; and a third region connected at a first end to the second region and at a second end to an output surface wherein the third region tapers from the second width at the first end to a third width, less than the second width, at the second end.
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Patent Agency Ranking
公开(公告)号：US11227847B2
公开(公告)日：2022-01-18
申请号：US16809446
申请日：2020-03-04
Applicant: Cisco Technology, Inc.
Inventor： Vipulkumar K. Patel , Mark A. Webster , Craig S. Appel
Abstract: Embodiments herein describe providing a decoupling capacitor on a first wafer (or substrate) that is then bonded to a second wafer to form an integrated decoupling capacitor. Using wafer bonding means that the decoupling capacitor can be added to the second wafer without having to take up space in the second wafer. In one embodiment, after bonding the first and second wafers, one or more vias are formed through the second wafer to establish an electrical connection between the decoupling capacitor and bond pads on a first surface of the second wafer. An electrical IC can then be flip chipped bonded to the first surface. As part of coupling the decoupling capacitor to the electrical IC, the decoupling capacitor is connected between the rails of a power source (e.g., VDD and VSS) that provides power to the electrical IC.
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公开(公告)号：US11081856B2
公开(公告)日：2021-08-03
申请号：US16234105
申请日：2018-12-27
Applicant: Cisco Technology, Inc.
Inventor： Jock T. Bovington , Vipulkumar K. Patel , Dominic F. Siriani
Abstract: A laser integrated photonic platform to allow for independent fabrication and development of laser systems in silicon photonics. The photonic platform includes a silicon substrate with an upper surface, one or more through silicon vias (TSVs) defined through the silicon substrate, and passive alignment features in the substrate. The photonic platform includes a silicon substrate wafer with through silicon vias (TSVs) defined through the silicon substrate, and passive alignment features in the substrate for mating the photonic platform to a photonics integrated circuit. The photonic platform also includes a III-V semiconductor material structure wafer, where the III-V wafer is bonded to the upper surface of the silicon substrate and includes at least one active layer forming a light source for the photonic platform.
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公开(公告)号：US11073661B1
公开(公告)日：2021-07-27
申请号：US16751994
申请日：2020-01-24
Applicant: Cisco Technology, Inc.
Inventor： Dominic F. Siriani , Vipulkumar K. Patel , Matthew J. Traverso , Mark A. Webster
IPC: G02B6/293
Abstract: Aspects described herein include an optical waveguide emitter that includes a first optical waveguide and a second optical waveguide that are evanescently coupled and collectively configured to selectively propagate only a first mode of a plurality of optical modes. Each of the first optical waveguide and the second optical waveguide extend through an input waveguide section, a turning waveguide section, and an output waveguide section. One or more of the input waveguide section, the turning waveguide section, and the output waveguide section includes an optically active region. The optical waveguide emitter further includes a refractive index-increasing feature in the turning waveguide section.
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公开(公告)号：US10969546B2
公开(公告)日：2021-04-06
申请号：US16198251
申请日：2018-11-21
Applicant: Cisco Technology, Inc.
Inventor： Xunyuan Zhang , Vipulkumar K. Patel , Prakash B. Gothoskar
Abstract: A method of fabricating an optical apparatus comprises forming a first waveguide on a dielectric substrate. The first waveguide extends in a direction of an optical path. The first waveguide comprises a monocrystalline semiconductor material and is doped with a first conductivity type. The method further comprises depositing a first dielectric layer on the first waveguide, etching a first opening that extends at least partly through the first dielectric layer, and forming a second waveguide at least partly overlapping the first waveguide along the direction. The second waveguide is doped with a different, second conductivity type. Forming the second waveguide comprises depositing a monocrystalline semiconductor material on the first dielectric layer, whereby the first opening is filled with the deposited monocrystalline semiconductor material.
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公开(公告)号：US12066663B2
公开(公告)日：2024-08-20
申请号：US17650601
申请日：2022-02-10
Applicant: Cisco Technology, Inc.
Inventor： Norbert Schlepple , Vipulkumar K. Patel , Weizhuo Li
CPC classification number: G02B6/30 , G02B6/3608 , G02B6/3885 , G02B6/43
Abstract: An apparatus includes a ribbon, an optical waveguide, and an IC. The ribbon includes a first end. The optical waveguide is disposed within the ribbon and terminates at the first end. The IC includes a curved surface. The first end of the ribbon bends to mate with the curved surface such that the optical waveguide is optically coupled to a corresponding waveguide in the IC.
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