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公开(公告)号:US10527234B2
公开(公告)日:2020-01-07
申请号:US15868839
申请日:2018-01-11
Applicant: Cooper Technologies Company
Inventor: Scott David Wegner
IPC: F21K9/62 , F21V19/00 , H01L33/62 , H01L25/075 , H01L33/58 , F21V8/00 , F21Y105/16 , F21Y115/10
Abstract: A lighting system includes a chip scale package light emitting diode mounted to a substrate and covered by an optic. The chip scale package light emitting diode has six faces with the top face and the four side faces operative to emit light and the bottom face oriented toward the substrate. The optic includes a lower face with a cavity in which the chip scale package light emitting diode is at least partially disposed.
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公开(公告)号:US09589487B1
公开(公告)日:2017-03-07
申请号:US14979167
申请日:2015-12-22
Applicant: Cooper Technologies Company
Inventor: Kraig Kasler , Westly Davis Hetrick , Scott Formel , Dylan Isaac James , Reed Alan Bradford , Scott David Wegner
CPC classification number: G09F13/18 , G09F13/22 , G09F2007/186 , G09F2013/0459 , G09F2013/222
Abstract: A system can combine edgelit signage and edgelit illumination. The system can comprise two edgelit lightguide sections, one supporting signage and another supporting illumination. The lightguide section that supports signage can comprise a backlit face inscribed with text or graphics conveying an emergency message. The lightguide section that supports illumination can comprise a face patterned with features that release light, for example for emergency illumination. The two lightguide sections can be two areas of a single edgelit lightguide. The two lightguide sections can alternatively formed from two separate lightguides. In some examples, one or more illumination lightguide sections can be configured as a trim plate.
Abstract translation: 系统可以组合edgelit标志和edgelit照明。 该系统可以包括两个镶边光导部分,一个辅助标牌和另一个支撑照明。 支持标牌的光导部分可以包括一个背光面,其中刻有表示紧急消息的文本或图形。 支持照明的光导部分可以包括具有图案的脸部,其具有释放光的特征,例如用于紧急照明。 两个光导部分可以是单个光刻胶的两个区域。 两个光导部分也可以由两个独立的光导形成。 在一些示例中,一个或多个照明光导部分可以被配置为装饰板。
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公开(公告)号:US20180180266A1
公开(公告)日:2018-06-28
申请号:US15646384
申请日:2017-07-11
Applicant: Cooper Technologies Company
Inventor: Jerold Tickner , Scott David Wegner , Evans Edward Thompson, III
IPC: F21V21/04 , F21V23/00 , F21S8/02 , F21V29/74 , F21V29/75 , F21V7/09 , F21V29/70 , F21V29/78 , F21Y115/10 , F21V15/01
CPC classification number: F21V21/04 , F21S8/02 , F21S8/026 , F21V7/09 , F21V15/01 , F21V21/048 , F21V23/009 , F21V29/70 , F21V29/74 , F21V29/75 , F21V29/78 , F21Y2115/10
Abstract: A recessed light fixture includes an LED module, which includes a single LED package that is configured to generate all light emitted by the recessed light fixture. For example, the LED package can include multiple LEDs mounted to a common substrate. The LED package can be coupled to a heat sink for dissipating heat from the LEDs. The heat sink can include a core member from which fins extend. Each fin can include one or more straight and/or curved portions. A reflector housing may be coupled to the heat sink and configured to receive a reflector. The reflector can have any geometry, such as a bell-shaped geometry including two radii of curvature that join together at an inflection point. An optic coupler can be coupled to the reflector housing and configured to cover electrical connections at the substrate and to guide light emitted by the LED package.
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公开(公告)号:US09835794B1
公开(公告)日:2017-12-05
申请号:US15151326
申请日:2016-05-10
Applicant: Cooper Technologies Company
Inventor: Timothy Glen Wright , Scott David Wegner
IPC: F21V7/04 , F21V8/00 , F21V31/00 , F21V17/10 , F21V29/74 , F21W131/10 , F21Y115/10
CPC classification number: G02B6/0093 , F16J15/00 , F21S8/06 , F21V17/10 , F21V29/74 , F21V31/00 , F21V31/005 , F21W2131/10 , F21Y2105/00 , F21Y2115/10 , G02B6/0031 , G02B6/0081 , G02B6/0085 , G02B6/0091 , G02F1/133615
Abstract: A gasket for an interface between a light emitting diode (LED) and a light emitting panel (LEP) includes a first segment and a second segment. The gasket also includes a first blade extending out from a surface of the first segment and a second blade extending out from a surface of the second segment. The surface of the first segment faces the surface of the second segment.
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公开(公告)号:US20180195674A1
公开(公告)日:2018-07-12
申请号:US15868839
申请日:2018-01-11
Applicant: Cooper Technologies Company
Inventor: Scott David Wegner
Abstract: A lighting system includes a chip scale package light emitting diode mounted to a substrate and covered by an optic. The chip scale package light emitting diode has six faces with the top face and the four side faces operative to emit light and the bottom face oriented toward the substrate. The optic includes a lower face with a cavity in which the chip scale package light emitting diode is at least partially disposed.
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公开(公告)号:US08911121B2
公开(公告)日:2014-12-16
申请号:US13965026
申请日:2013-08-12
Applicant: Cooper Technologies Company
Inventor: Jerold Tickner , Scott David Wegner , Evans Edward Thompson, III
CPC classification number: F21V21/04 , F21S8/02 , F21S8/026 , F21V7/09 , F21V15/01 , F21V21/048 , F21V23/009 , F21V29/004 , F21V29/2212 , F21V29/70 , F21V29/74 , F21V29/75 , F21V29/78 , F21Y2115/10
Abstract: A recessed light fixture includes an LED module, which includes a single LED package that is configured to generate all light emitted by the recessed light fixture. For example, the LED package can include multiple LEDs mounted to a common substrate. The LED package can be coupled to a heat sink for dissipating heat from the LEDs. The heat sink can include a core member from which fins extend. Each fin can include one or more straight and/or curved portions. A reflector housing may be coupled to the heat sink and configured to receive a reflector. The reflector can have any geometry, such as a bell-shaped geometry including two radii of curvature that join together at an inflection point. An optic coupler can be coupled to the reflector housing and configured to cover electrical connections at the substrate and to guide light emitted by the LED package.
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公开(公告)号:US20180210138A1
公开(公告)日:2018-07-26
申请号:US15879288
申请日:2018-01-24
Applicant: Cooper Technologies Company
Inventor: Scott David Wegner
CPC classification number: G02B6/0065 , G02B1/045 , G02B6/002 , G02B6/0068 , G02B6/0078 , G02B6/008 , G02B6/009 , G02B6/0093
Abstract: A lighting system includes a light source and a lightguide. The lightguide has a first edge disposed adjacent the light source to receive light from the light source and a second edge on a side opposite to the first edge, the second edge configured to emit at least a portion of the received light. The lightguide also has a first major surface and a second major surface that extend between the first edge and the second edge and that are on opposite sides of the lightguide. The first major surface and the second major surface internally reflect at least a portion of the received light. The lightguide consists of a first optical material and a second optical material, wherein the first optical material is disposed at the first edge adjacent to the light source and has a higher temperature rating than a second optical material.
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公开(公告)号:US09715056B1
公开(公告)日:2017-07-25
申请号:US14724384
申请日:2015-05-28
Applicant: Cooper Technologies Company
Inventor: Scott David Wegner , Jerold Alan Tickner
CPC classification number: G02B6/005 , F21K9/61 , F21S8/026 , F21V5/00 , F21V7/0091 , F21Y2103/00 , G02B3/0006 , G02B6/0063
Abstract: A lighting system can comprise an edgelit panel, for example a lightguide that may have a panel or slab shape with an edge that receives light from an array of light emitting diodes extending along the edge. The lightguide can guide the received light towards an opposing edge of the lightguide and gradually release light to provide illumination. An optic can manage light that reaches the opposing edge of the lightguide, for example via softening, spreading, concentrating, or diffusing the light. The optic can have a tubular shape and may have lengthwise extending features for light management.
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公开(公告)号:US20150098219A1
公开(公告)日:2015-04-09
申请号:US14569896
申请日:2014-12-15
Applicant: Cooper Technologies Company
Inventor: Jerold Tickner , Scott David Wegner , Evans Edward Thompson, III
CPC classification number: F21V21/04 , F21S8/02 , F21S8/026 , F21V7/09 , F21V15/01 , F21V21/048 , F21V23/009 , F21V29/004 , F21V29/2212 , F21V29/70 , F21V29/74 , F21V29/75 , F21V29/78 , F21Y2115/10
Abstract: A recessed light fixture includes an LED module, which includes a single LED package that is configured to generate all light emitted by the recessed light fixture. For example, the LED package can include multiple LEDs mounted to a common substrate. The LED package can be coupled to a heat sink for dissipating heat from the LEDs. The heat sink can include a core member from which fins extend. Each fin can include one or more straight and/or curved portions. A reflector housing may be coupled to the heat sink and configured to receive a reflector. The reflector can have any geometry, such as a bell-shaped geometry including two radii of curvature that join together at an inflection point. An optic coupler can be coupled to the reflector housing and configured to cover electrical connections at the substrate and to guide light emitted by the LED package.
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