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公开(公告)号：US11856871B2
公开(公告)日：2023-12-26
申请号：US17681303
申请日：2022-02-25
Applicant: D-WAVE SYSTEMS INC.
Inventor： Trevor M. Lanting , Danica W. Marsden , Byong Hyop Oh , Eric G. Ladizinsky , Shuiyuan Huang , J. Jason Yao , Douglas P. Stadtler
CPC classification number: H10N60/805 , G06N10/00 , H10N60/0156 , H10N60/0912 , H10N60/12 , H10N69/00
Abstract: Systems and methods for fabricating a superconducting integrated circuit that includes wiring layers comprising low-noise material are described. A superconducting integrated circuit can be implemented in a computing system that includes a quantum processor. Such a superconducting integrated circuit includes a first set of one or more wiring layers that form a noise-susceptible superconducting device that can decrease processor when exposed to noise. The superconducting integrated circuit can further include a second set of one or more wiring layers that form a superconducting device that is less susceptible to noise. Fabricating a superconducting device that contains low-noise material can include depositing and patterning a wiring layer comprising a first material that is superconductive in a respective range of temperatures and depositing and patterning a different wiring layer comprising a second material that is superconductive in a respective range of temperatures. The second material can be considered a low-noise material.
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公开(公告)号：US20200152851A1
公开(公告)日：2020-05-14
申请号：US16681431
申请日：2019-11-12
Applicant: D-WAVE SYSTEMS INC.
Inventor： Trevor M. Lanting , Danica W. Marsden , Byong Hyop Oh , Eric G. Ladizinsky , Shuiyuan Huang , J. Jason Yao , Douglas P. Stadtler
Abstract: Systems and methods for fabricating a superconducting integrated circuit that includes wiring layers comprising low-noise material are described. A superconducting integrated circuit can be implemented in a computing system that includes a quantum processor. Such a superconducting integrated circuit includes a first set of one or more wiring layers that form a noise-susceptible superconducting device that can decrease processor when exposed to noise. The superconducting integrated circuit can further include a second set of one or more wiring layers that form a superconducting device that is less susceptible to noise. Fabricating a superconducting device that contains low-noise material can include depositing and patterning a wiring layer comprising a first material that is superconductive in a respective range of temperatures and depositing and patterning a different wiring layer comprising a second material that is superconductive in a respective range of temperatures. The second material can be considered a low-noise material.
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公开(公告)号：US20220263007A1
公开(公告)日：2022-08-18
申请号：US17681303
申请日：2022-02-25
Applicant: D-WAVE SYSTEMS INC.
Inventor： Trevor M. Lanting , Danica W. Marsden , Byong Hyop Oh , Eric G. Ladizinsky , Shuiyuan Huang , J. Jason Yao , Douglas P. Stadtler
Abstract: Systems and methods for fabricating a superconducting integrated circuit that includes wiring layers comprising low-noise material are described. A superconducting integrated circuit can be implemented in a computing system that includes a quantum processor. Such a superconducting integrated circuit includes a first set of one or more wiring layers that form a noise-susceptible superconducting device that can decrease processor when exposed to noise. The superconducting integrated circuit can further include a second set of one or more wiring layers that form a superconducting device that is less susceptible to noise. Fabricating a superconducting device that contains low-noise material can include depositing and patterning a wiring layer comprising a first material that is superconductive in a respective range of temperatures and depositing and patterning a different wiring layer comprising a second material that is superconductive in a respective range of temperatures. The second material can be considered a low-noise material.
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