公开(公告)号：US20190355885A1

公开(公告)日：2019-11-21

申请号：US16479535

申请日：2018-03-16

Applicant: DENKA COMPANY LIMITED

Inventor： Taiki NISHI ,  Katsunori YASHIMA ,  Yuki KIMOTO ,  Ikuo SUYAMA ,  Katsumichi KOGURE

IPC: H01L33/56 ,  B32B15/08 ,  C08L83/04

Abstract: Provided are a metal-base circuit board having excellent solder crack resistance, thermal conductivity, adhesive property, and insulation property and a resin composition for a circuit board used for the metal-base circuit board. A resin composition for a circuit board comprises a vinylsilyl group-containing polysiloxane (having a vinylsilyl group equivalent of 0.005 to 0.045 mol/kg) comprising (A) a dual-end type vinylsilyl group-containing polysiloxane having a weight average molecular weight of 30,000 to 80,000 and (B) a side-chain dual-end type vinylsilyl group-containing polysiloxane having a weight average molecular weight of 100,000 or more, a hydrosilyl group-containing polysiloxane (having a hydrosilyl group equivalent of 6 mol/kg or more), and an inorganic filler at 60 to 80% by volume. The mass ratio of (A) to (B), (A)/(B), is 80/20 to 30/70, and the molar ratio of (C) a hydrosilyl group to (D) a vinylsilyl group, (C)/(D), is 2.5 to 5.0.

公开(公告)号：US20160227644A1

公开(公告)日：2016-08-04

申请号：US14911707

申请日：2014-08-12

Applicant: DENKA COMPANY LIMITED

Inventor： Hideki HIROTSURU ,  Shuhei NONAKA ,  Toshikatsu MITSUNAGA ,  Koki IKARASHI ,  Kouji MIYATA ,  Taiki NISHI ,  Saori INOUE ,  Fumiya KOBAYASHI

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/03

CPC classification number: H05K1/0271 ,  C08K7/00 ,  C08K2003/385 ,  C08K2201/004 ,  H05K1/0203 ,  H05K1/0306 ,  H05K1/0353 ,  H05K1/0373 ,  H05K1/09 ,  H05K3/022 ,  H05K3/38 ,  H05K2201/0104 ,  H05K2201/066

Abstract: A boron nitride/resin composite circuit board having high heat dissipation characteristics and high relyability is provided. A boron nitride/resin composite circuit board, including: a plate-shaped resin-impregnated boron nitride sintered body having a plate thickness of 0.2 to 1.5 mm, the plate-shaped resin-impregnated boron nitride sintered body including 30 to 85 volume % of a boron nitride sintered body having boron nitride particles bonded three-dimensionally, the boron nitride particles having an average long diameter of 5 to 50 μm, and 70 to 15 volume % of a resin; and a metal circuit adhered onto both principal planes of the plate-shaped resin-impregnated boron nitride sintered body, the metal circuit being copper or aluminum, wherein: a ratio of a linear thermal expansion coefficient in a plane direction of the resin-impregnated boron nitride sintered body at 40 to 150° C. (CTE1) and a linear thermal expansion coefficient of the metal circuit at 40 to 150° C. (CTE2) (CTE1/CTE2) is 0.5 to 2.0.

Abstract translation: 提供具有高散热特性和高可靠性的氮化硼/树脂复合电路板。 一种氮化硼/树脂复合电路板，包括：板厚为0.2〜1.5mm的板状树脂浸渍氮化硼烧结体，含有30〜85体积％的板状树脂浸渍氮化硼烧结体 具有三维结合的氮化硼颗粒的氮化硼烧结体，平均长径为5〜50μm的氮化硼颗粒和70〜15体积％的树脂; 以及附着在板状树脂浸渍氮化硼烧结体的两个主平面上的金属电路，金属电路为铜或铝，其中：树脂浸渍硼的平面方向的线性热膨胀系数的比例 40℃〜150℃（CTE1）的金属电路的线性热膨胀系数（CTE2）（CTE1 / CTE2）为40〜150℃。