公开(公告)号：US20240043596A1

公开(公告)日：2024-02-08

申请号：US18269153

申请日：2021-11-12

Applicant: Denka Company Limited

Inventor： Yuki KIMOTO ,  Yasunori HAYASHI ,  Mizuki HASUMI

IPC: C08F265/06 ,  C09J151/00

CPC classification number: C08F265/06 ,  C09J151/003

Abstract: An ultraviolet curable resin composition having: a monomer and/or an oligomer having a polymerizable unsaturated double bond; a photopolymerization initiator; a polymerization inhibitor; and an acid having an acid dissociation constant (pKa1) in pure water of 4.0 or less.

公开(公告)号：US20240043575A1

公开(公告)日：2024-02-08

申请号：US18269157

申请日：2021-11-12

Applicant: Denka Company Limited

Inventor： Yuki KIMOTO ,  Yasunori HAYASHI ,  Mizuki HASUMI

IPC: C08F2/50 ,  C08F220/56 ,  C08F222/10 ,  C08F2/44 ,  C08K5/092 ,  C09J4/00 ,  H01L21/304

CPC classification number: C08F2/50 ,  C08F220/56 ,  C08F222/1065 ,  C08F2/44 ,  C08K5/092 ,  C09J4/00 ,  H01L21/304 ,  C09J2433/00 ,  C09J2203/326 ,  C09J2301/416

Abstract: An ultraviolet curable resin composition containing: a monomer and/or an oligomer having a polymerizable unsaturated double bond; a photopolymerization initiator; and an acid having an acid dissociation constant (pKa1) in pure water of 4.0 or less.

公开(公告)号：US20190355885A1

公开(公告)日：2019-11-21

申请号：US16479535

申请日：2018-03-16

Applicant: DENKA COMPANY LIMITED

Inventor： Taiki NISHI ,  Katsunori YASHIMA ,  Yuki KIMOTO ,  Ikuo SUYAMA ,  Katsumichi KOGURE

IPC: H01L33/56 ,  B32B15/08 ,  C08L83/04

Abstract: Provided are a metal-base circuit board having excellent solder crack resistance, thermal conductivity, adhesive property, and insulation property and a resin composition for a circuit board used for the metal-base circuit board. A resin composition for a circuit board comprises a vinylsilyl group-containing polysiloxane (having a vinylsilyl group equivalent of 0.005 to 0.045 mol/kg) comprising (A) a dual-end type vinylsilyl group-containing polysiloxane having a weight average molecular weight of 30,000 to 80,000 and (B) a side-chain dual-end type vinylsilyl group-containing polysiloxane having a weight average molecular weight of 100,000 or more, a hydrosilyl group-containing polysiloxane (having a hydrosilyl group equivalent of 6 mol/kg or more), and an inorganic filler at 60 to 80% by volume. The mass ratio of (A) to (B), (A)/(B), is 80/20 to 30/70, and the molar ratio of (C) a hydrosilyl group to (D) a vinylsilyl group, (C)/(D), is 2.5 to 5.0.