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公开(公告)号：US20230340314A1
公开(公告)日：2023-10-26
申请号：US18245852
申请日：2021-09-27
Applicant: Denka Company Limited
Inventor： Koki IKARASHI , Nobuya SUZUKI , Koji NISHIMURA
IPC: C09K5/14 , C01B21/082 , C04B35/583 , C04B35/63 , C04B35/64 , C04B41/48 , C04B41/83
CPC classification number: C09K5/14 , C01B21/0828 , C04B35/583 , C04B35/6303 , C04B35/64 , C04B41/48 , C04B41/83 , C01P2006/16 , C01P2006/12 , C01P2004/03 , C01P2004/61 , C01P2004/50 , C01P2006/32 , C04B2235/3856 , C04B2235/386 , C04B2235/5409 , C04B2235/5436 , C04B2235/9607
Abstract: Provided is a boron nitride sintered body in which an average number of lump particles having a particle size of 30 μm or more formed by aggregation of primary particles of boron nitride is 3 or less in a cross-sectional image including 100 or more particles observed at a magnification of 500 times with a scanning electron microscope. A method of manufacturing a boron nitride sintered body includes a nitriding step of sintering a raw material powder containing boron carbide in a nitrogen-containing atmosphere to obtain a fired product containing boron carbonitride, a pulverizing step of pulverizing the fired product to obtain a boron carbonitride powder having a specific surface area of 12 m2/g or more, and a firing step of molding and heating a blend containing the boron carbonitride powder and a sintering aid to obtain a boron nitride sintered body.
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2.发明公开公开(公告)号：US20230365471A1
公开(公告)日：2023-11-16
申请号：US18246082
申请日：2021-09-28
Applicant: Denka Company Limited
Inventor： Yusuke WAKUDA , Yoshitaka MINAKATA , Shinya SAKAGUCHI , Tomoya YAMAGUCHI , Koki IKARASHI , Koji NISHIMURA
IPC: C04B37/02 , B32B9/04 , B32B9/00 , B32B37/18 , B32B15/20 , C04B35/583 , C04B38/00 , C04B41/83 , C04B41/48 , C04B41/00 , H01L23/373
CPC classification number: C04B37/028 , B32B9/041 , B32B9/005 , B32B37/18 , B32B15/20 , C04B35/583 , C04B38/0054 , C04B41/83 , C04B41/4853 , C04B41/0072 , H01L23/3735 , B32B2260/021 , B32B2260/046 , B32B2307/748 , B32B2307/306 , B32B2315/02 , B32B2311/12 , B32B2250/02 , B32B2305/07 , B32B2305/026 , C04B2235/3856 , C04B2235/386 , C04B2237/407 , C04B2237/361 , C04B2237/61
Abstract: One aspect of the present disclosure provides a composite sheet including a porous sintered ceramic component having a thickness of less than 2 mm and a resin filled into pores of the sintered ceramic component, wherein the curing rate of the resin is 10 to 70%.
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3.发明公开公开(公告)号：US20230366829A1
公开(公告)日：2023-11-16
申请号：US18246096
申请日：2021-09-28
Applicant: Denka Company Limited
Inventor： Yusuke WAKUDA , Yoshitaka MINAKATA , Shinya SAKAGUCHI , Tomoya YAMAGUCHI , Koki IKARASHI , Koji NISHIMURA
CPC classification number: G01N21/8422 , G01N21/64 , G01N2021/8411 , G01N2021/8438
Abstract: One aspect of the present disclosure is a method for evaluating adhesiveness performance and heat radiation performance of a composite including a porous sintered ceramic component and a semi-cured product of a resin filled into pores of the sintered ceramic component, including a step of emitting ultraviolet rays to the surface of the semi-cured product of the composite; a step of measuring an emission intensity of fluorescence generated from the semi-cured product; and a step of evaluating adhesiveness performance and heat radiation performance of the composite using the value of the emission intensity.
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4.发明公开公开(公告)号：US20230146575A1
公开(公告)日：2023-05-11
申请号：US17907515
申请日：2021-03-26
Applicant: Denka Company Limited
Inventor： Koki IKARASHI , Nobuya SUZUKI , Koji NISHIMURA , Makoto TAKEDA , Seiji KOBASHI
IPC: C04B35/583 , C04B35/628 , C04B35/63 , C04B35/64 , C04B41/83 , C04B41/48 , C04B41/00
CPC classification number: C04B35/583 , C04B35/62884 , C04B35/62836 , C04B35/6303 , C04B35/64 , C04B41/83 , C04B41/4853 , C04B41/0072 , C04B2235/386 , C04B2235/3856 , C04B2235/3409 , C04B2235/442 , C04B2235/5436 , C04B2235/963
Abstract: Provided is a boron nitride sintered body having a porous structure, the boron nitride sintered body including a lump particle formed by aggregation of primary particles of boron nitride and having a particle diameter of 15 μm or more. Provided is a method for manufacturing a boron nitride sintered body, the method including: a nitriding step of firing a raw material powder containing boron carbide in an atmosphere containing nitrogen to obtain a fired product including lump particles each having a core part with primary particles of boron carbonitride aggregated and a shell part surrounding the core part; and a firing step of molding and heating a blend containing the fired product including lump particles and a sintering aid to obtain the boron nitride sintered body having a porous structure and including lump particles of boron nitride.
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Patent Agency Ranking
5.发明公开公开(公告)号：US20230357090A1
公开(公告)日：2023-11-09
申请号：US18246123
申请日：2021-09-28
Applicant: Denka Company Limited
Inventor： Yusuke WAKUDA , Yoshitaka MINAKATA , Shinya SAKAGUCHI , Tomoya YAMAGUCHI , Koki IKARASHI , Koji NISHIMURA
CPC classification number: C04B37/028 , C04B41/83 , C04B41/4884 , C04B35/583 , C04B38/068 , B32B9/005 , B32B9/041 , B32B15/20 , C04B2235/3856 , C04B2235/386 , C04B2237/361 , C04B2237/407 , C04B2237/61 , B32B2255/26 , B32B2307/748 , B32B2307/7376 , B32B2260/02 , B32B2260/046 , H01L23/15
Abstract: One aspect of the present disclosure provides a composite sheet including a porous sintered ceramic component having a thickness of less than 2 mm and a resin filled into pores of the sintered ceramic component, wherein the resin is a semi-cured product of a resin composition including a compound having a cyanate group and the content of triazine rings in the resin is 0.6 to 4.0 mass %.
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6.发明申请BORON NITRIDE/RESIN COMPOSITE CIRCUIT BOARD, AND CIRCUIT BOARD INCLUDING BORON NITRIDE/RESIN COMPOSITE INTEGRATED WITH HEAT RADIATION PLATE 有权硼酸盐/树脂复合电路板和电路板，包括氮化硼/树脂复合材料与热辐射板集成公开(公告)号：US20160227644A1
公开(公告)日：2016-08-04
申请号：US14911707
申请日：2014-08-12
Applicant: DENKA COMPANY LIMITED
Inventor： Hideki HIROTSURU , Shuhei NONAKA , Toshikatsu MITSUNAGA , Koki IKARASHI , Kouji MIYATA , Taiki NISHI , Saori INOUE , Fumiya KOBAYASHI
CPC classification number: H05K1/0271 , C08K7/00 , C08K2003/385 , C08K2201/004 , H05K1/0203 , H05K1/0306 , H05K1/0353 , H05K1/0373 , H05K1/09 , H05K3/022 , H05K3/38 , H05K2201/0104 , H05K2201/066
Abstract: A boron nitride/resin composite circuit board having high heat dissipation characteristics and high relyability is provided. A boron nitride/resin composite circuit board, including: a plate-shaped resin-impregnated boron nitride sintered body having a plate thickness of 0.2 to 1.5 mm, the plate-shaped resin-impregnated boron nitride sintered body including 30 to 85 volume % of a boron nitride sintered body having boron nitride particles bonded three-dimensionally, the boron nitride particles having an average long diameter of 5 to 50 μm, and 70 to 15 volume % of a resin; and a metal circuit adhered onto both principal planes of the plate-shaped resin-impregnated boron nitride sintered body, the metal circuit being copper or aluminum, wherein: a ratio of a linear thermal expansion coefficient in a plane direction of the resin-impregnated boron nitride sintered body at 40 to 150° C. (CTE1) and a linear thermal expansion coefficient of the metal circuit at 40 to 150° C. (CTE2) (CTE1/CTE2) is 0.5 to 2.0.
Abstract translation: 提供具有高散热特性和高可靠性的氮化硼/树脂复合电路板。 一种氮化硼/树脂复合电路板，包括：板厚为0.2〜1.5mm的板状树脂浸渍氮化硼烧结体，含有30〜85体积％的板状树脂浸渍氮化硼烧结体 具有三维结合的氮化硼颗粒的氮化硼烧结体，平均长径为5〜50μm的氮化硼颗粒和70〜15体积％的树脂; 以及附着在板状树脂浸渍氮化硼烧结体的两个主平面上的金属电路，金属电路为铜或铝，其中：树脂浸渍硼的平面方向的线性热膨胀系数的比例 40℃〜150℃（CTE1）的金属电路的线性热膨胀系数（CTE2）（CTE1 / CTE2）为40〜150℃。
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7.发明公开公开(公告)号：US20230150886A1
公开(公告)日：2023-05-18
申请号：US17906772
申请日：2021-03-30
Applicant: Denka Company Limited
Inventor： Makoto TAKEDA , Koki IKARASHI
IPC: C04B35/583 , C04B41/48 , C04B41/50
CPC classification number: C04B35/583 , C04B41/48 , C04B41/5093 , C04B2235/77 , C04B2235/386
Abstract: Provided is a boron nitride sintered body including boron nitride particles and pores, in which a compressive elastic modulus is 1 GPa or more. Provided is a method for manufacturing a boron nitride sintered body, the method including: a nitriding step of firing a boron carbide powder in a nitrogen atmosphere to obtain a fired product containing boron carbonitride; and a sintering step of molding and heating a blend containing the fired product and a sintering aid to obtain the boron nitride sintered body including boron nitride particles and pores, in which the sintering aid contains a boron compound and a calcium compound, and the blend contains 1 to 20 parts by mass of the boron compound and the calcium compound in total with respect to 100 parts by mass of the fired product.
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公开(公告)号：US20230142330A1
公开(公告)日：2023-05-11
申请号：US17908817
申请日：2021-03-26
Applicant: Denka Company Limited
Inventor： Koki IKARASHI , Makoto TAKEDA , Seiji KOBASHI , Koji NISHIMURA
CPC classification number: C04B41/4853 , C09K5/14 , C04B35/583 , C04B35/6303 , C04B35/64 , C04B38/0054 , C04B41/83 , C04B2235/386 , C04B2235/3409 , C04B2235/442 , C04B2235/5436 , C04B2235/6567 , C04B2235/77 , H05K1/0373
Abstract: Provided is a boron nitride sintered body including: a plurality of coarse particles each having a length of 20 μm or more; and fine particles smaller than the plurality of coarse particles, in which, when viewed in a cross-section, the plurality of coarse particles intersect with each other. Provided is a method for manufacturing a boron nitride sintered body, the method including: a raw material preparation step of firing a mixture containing boron carbonitride and a boron compound in a nitrogen atmosphere to obtain lump boron nitride having an average particle diameter of 10 to 200 μm; and a sintering step of molding and heating a blend containing the lump boron nitride and a sintering aid to obtain a boron nitride sintered body including coarse particles each having a length of 20 μm or more in a cross-section and fine particles smaller than the coarse particles.
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公开(公告)号：US20230085806A1
公开(公告)日：2023-03-23
申请号：US17908786
申请日：2021-03-26
Applicant: Denka Company Limited
Inventor： Koki IKARASHI , Makoto TAKEDA , Seiji KOBASHI , Koji NISHIMURA
IPC: C04B35/583 , C04B41/48 , C04B41/83
Abstract: Provided is a boron nitride sintered body including boron nitride particles and pores, the boron nitride sintered body having a sheet shape and a thickness of less than 2 mm. Provided is a method for manufacturing a boron nitride sintered body, the method including a sintering step of molding and heating a blend containing a boron carbonitride powder and a sintering aid to obtain a sheet-shaped boron nitride sintered body including boron nitride particles and pores, in which a thickness of the boron nitride sintered body obtained in the sintering step is less than 2 mm.
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