公开(公告)号：US20230373129A1

公开(公告)日：2023-11-23

申请号：US18319607

申请日：2023-05-18

Applicant: DISCO CORPORATION

Inventor： Koyo HONOKI ,  Koji ITABASHI ,  Ryohei YAMAMOTO ,  Haruki MATSUO

IPC: B28D5/04 ,  B28D5/00 ,  B23K26/00 ,  B23K26/08 ,  B23K26/40

CPC classification number: B28D5/047 ,  B28D5/0094 ,  B28D5/0064 ,  B28D5/0011 ,  B28D5/0052 ,  B23K26/0093 ,  B23K26/0853 ,  B23K26/40 ,  B23K2101/40

Abstract: A peeling apparatus includes a holding table that holds an ingot, a water supply unit that forms a layer of water on an upper surface of the ingot, an ultrasonic unit that applies an ultrasonic wave to the upper surface of the ingot through the layer of water, a peeling confirmation unit that confirms peeling-off of a wafer to be manufactured, a wafer delivery unit that lowers a suction pad having a suction surface facing the upper surface of the ingot, to hold the wafer to be manufactured on the suction surface under suction, and delivers the wafer from the ingot, and a controller. After the peeling-off of the wafer is confirmed by the peeling confirmation unit, the controller positions the water supply unit, the ultrasonic unit, and the peeling confirmation unit at retracted positions and operates the wafer delivery unit to deliver the wafer from the ingot.

公开(公告)号：US20190160804A1

公开(公告)日：2019-05-30

申请号：US16197676

申请日：2018-11-21

Applicant: DISCO CORPORATION

Inventor： Kazuyuki HINOHARA ,  Haruki MATSUO ,  Kazuya HIRATA ,  Ryohei YAMAMOTO

IPC: B32B43/00

Abstract: A peeling apparatus includes an ingot holding unit holding an ingot in a hanging state where a portion of the ingot to be peeled off as the wafer is directed downwardly, a water container containing water therein, an ultrasonic unit immersed in the water in the water container, a moving unit moving the ingot holding unit vertically into a position where the ingot holding unit faces the ultrasonic unit and at least the portion of the ingot to be peeled off as the wafer is immersed in the water in the water container, and a nozzle ejecting water to the portion of the ingot to be peeled off as the wafer thereby to promote the peeling of the wafer from the ingot.