ELECTROSTATIC CHUCK TABLE
    1.
    发明申请

    公开(公告)号:US20180019168A1

    公开(公告)日:2018-01-18

    申请号:US15645462

    申请日:2017-07-10

    申请人: DISCO CORPORATION

    摘要: An electrostatic chuck table for holding a workpiece includes: a plate-shaped base transmittable with respect to a laser beam having a predetermined wavelength allowing the laser beam to be transmitted through the workpiece, the plate-shaped base having a first surface and a second surface opposite the first surface; an electrostatic attraction electrode assembly transmittable with respect to the laser beam having the predetermined wavelength, the electrostatic attraction electrode assembly being formed on the first surface of the base; and a resin layer transmittable with respect to the laser beam having the predetermined wavelength, the resin layer covering the electrode assembly and providing a holding surface for holding the workpiece thereon. The electrostatic chuck table is used in forming a modified layer within the workpiece held on the holding surface with the laser beam that is applied to the workpiece from the side of the second surface of the base.

    GRINDING APPARATUS
    2.
    发明申请
    GRINDING APPARATUS 有权
    研磨设备

    公开(公告)号:US20150158137A1

    公开(公告)日:2015-06-11

    申请号:US14560017

    申请日:2014-12-04

    申请人: DISCO CORPORATION

    IPC分类号: B24B7/22 B24B41/00 B24B57/02

    摘要: A grinding apparatus for grinding a wafer stored in a cassette is composed of a container for storing the wafer and a lid for enclosing the container. The grinding apparatus includes a cassette table for placing the cassette thereon, a lid removing unit for removing the lid from the cassette placed on the cassette table and leaving only the container on the cassette table, a chuck table for holding the wafer under suction, a chuck table moving unit for moving the chuck table to a grinding area, a grinding unit provided in the grinding area, the grinding unit having a grinding wheel for grinding the wafer held on the chuck table, a grinding water supplying unit for supplying a grinding water to abrasive members of the grinding wheel, and a waste water collecting unit for collecting a waste water generated in grinding the wafer by operating the grinding unit.

    摘要翻译: 用于研磨存储在盒中的晶片的研磨装置由用于存储晶片的容器和用于封闭容器的盖组成。 研磨装置包括用于将盒子放置在其上的盒式工作台,盖拆卸单元,用于从放置在盒式桌子上的盒子中取出盖子,仅将容器留在盒式桌子上,用于将晶片保持在抽吸下的卡盘台, 用于将卡盘台移动到研磨区域的卡盘台移动单元,设置在研磨区域中的研磨单元,所述研磨单元具有用于研磨保持在卡盘台上的晶片的研磨轮,用于供给研磨水的研磨供水单元 到研磨轮的研磨部件,以及废水收集单元,用于通过操作研磨单元来收集在研磨晶片时产生的废水。

    Grinding apparatus
    3.
    发明授权
    Grinding apparatus 有权
    研磨机

    公开(公告)号:US09314895B2

    公开(公告)日:2016-04-19

    申请号:US14560017

    申请日:2014-12-04

    申请人: DISCO CORPORATION

    IPC分类号: B24B7/22 B24B41/00 B24B57/02

    摘要: A grinding apparatus for grinding a wafer stored in a cassette composed of a container for storing the wafer and a lid for enclosing the container. The grinding apparatus includes a cassette table for placing the cassette thereon, a lid removing unit for removing the lid from the cassette placed on the cassette table and leaving only the container on the cassette table, a chuck table for holding the wafer under suction, a chuck table moving unit for moving the chuck table to a grinding area, a grinding unit provided in the grinding area, the grinding unit having a grinding wheel for grinding the wafer held on the chuck table, a grinding water supplying unit for supplying a grinding water to abrasive members of the grinding wheel, and a waste water collecting unit for collecting waste water generated in grinding the wafer by operating the grinding unit.

    摘要翻译: 一种用于研磨存储在由用于存储晶片的容器的盒中的晶片的研磨装置和用于封闭容器的盖。 研磨装置包括用于将盒子放置在其上的盒式工作台,盖拆卸单元,用于从放置在盒式桌子上的盒子中取出盖子,仅将容器留在盒式桌子上,用于将晶片保持在抽吸下的卡盘台, 用于将卡盘台移动到研磨区域的卡盘台移动单元,设置在研磨区域中的研磨单元,所述研磨单元具有用于研磨保持在卡盘台上的晶片的研磨轮,用于供给研磨水的研磨供水单元 砂轮的研磨部件和废水收集单元,用于通过操作磨削单元收集在研磨晶片时产生的废水。