公开(公告)号：US20180130688A1

公开(公告)日：2018-05-10

申请号：US15793574

申请日：2017-10-25

申请人： DISCO CORPORATION

发明人： Masahiro Tsukamoto ,  Ken Togashi

IPC分类号： H01L21/687 ,  B23K26/02 ,  B23K26/10 ,  H01L21/268 ,  H01L21/78

CPC分类号： H01L21/687 ,  B23K26/02 ,  B23K26/10 ,  H01L21/268 ,  H01L21/67766 ,  H01L21/67778 ,  H01L21/68707 ,  H01L21/78

摘要： A frame unit is transferred from a cassette to a predetermined position. The frame unit has a platelike workpiece, a tape attached to the workpiece, and a ring frame supporting a peripheral portion of the tape. The apparatus includes a holding unit for the frame unit, a moving unit for the holding unit, and a control unit. The holding unit includes a pair of gripping portions for gripping a front portion of the ring frame at two separate positions, and an abutting portion adapted to abut against the outer circumference of the ring frame. The ring frame is gripped, partially drawn from the cassette, and released. The abutting portion is brought into abutment against the outer circumference of the ring frame so as to move the ring frame into the cassette. The ring frame is gripped again, raised, and transferred to the predetermined position.

公开(公告)号：US20180019168A1

公开(公告)日：2018-01-18

申请号：US15645462

申请日：2017-07-10

申请人： DISCO CORPORATION

发明人： Sakae Matsuzaki ,  Noriko Ito ,  Ken Togashi ,  Kenji Furuta

IPC分类号： H01L21/78 ,  H01L21/67 ,  H01L21/268 ,  H01L21/683 ,  B23K26/00

CPC分类号： H01L21/78 ,  B23K26/359 ,  B23K26/53 ,  H01L21/268 ,  H01L21/67092 ,  H01L21/67115 ,  H01L21/6831 ,  H01L21/6833

摘要： An electrostatic chuck table for holding a workpiece includes: a plate-shaped base transmittable with respect to a laser beam having a predetermined wavelength allowing the laser beam to be transmitted through the workpiece, the plate-shaped base having a first surface and a second surface opposite the first surface; an electrostatic attraction electrode assembly transmittable with respect to the laser beam having the predetermined wavelength, the electrostatic attraction electrode assembly being formed on the first surface of the base; and a resin layer transmittable with respect to the laser beam having the predetermined wavelength, the resin layer covering the electrode assembly and providing a holding surface for holding the workpiece thereon. The electrostatic chuck table is used in forming a modified layer within the workpiece held on the holding surface with the laser beam that is applied to the workpiece from the side of the second surface of the base.

公开(公告)号：US10242904B2

公开(公告)日：2019-03-26

申请号：US15793574

申请日：2017-10-25

申请人： DISCO CORPORATION

发明人： Masahiro Tsukamoto ,  Ken Togashi

IPC分类号： H01L21/687 ,  B23K26/02 ,  B23K26/10 ,  H01L21/268 ,  H01L21/78 ,  H01L21/677

摘要： A frame unit is transferred from a cassette to a predetermined position. The frame unit has a platelike workpiece, a tape attached to the workpiece, and a ring frame supporting a peripheral portion of the tape. The apparatus includes a holding unit for the frame unit, a moving unit for the holding unit, and a control unit. The holding unit includes a pair of gripping portions for gripping a front portion of the ring frame at two separate positions, and an abutting portion adapted to abut against the outer circumference of the ring frame. The ring frame is gripped, partially drawn from the cassette, and released. The abutting portion is brought into abutment against the outer circumference of the ring frame so as to move the ring frame into the cassette. The ring frame is gripped again, raised, and transferred to the predetermined position.

公开(公告)号：US20160240424A1

公开(公告)日：2016-08-18

申请号：US15042443

申请日：2016-02-12

申请人： DISCO CORPORATION

发明人： Masahiro Tsukamoto ,  Ken Togashi

IPC分类号： H01L21/687 ,  H01L21/683

CPC分类号： H01L21/6838 ,  H01L21/67092 ,  H01L21/67132 ,  H01L21/6836 ,  H01L21/68721 ,  H01L2221/68327

摘要： A chuck table in processing apparatus holds a frame unit in which a wafer is fixed to an opening of a ring-shaped frame with an intermediary of adhesive tape by sucking an exposed surface of the wafer to a holding surface. The chuck table includes a circular region that forms the holding surface in which plural suction holes communicating with a suction source are formed, and a ring-shaped circumferential region that surrounds the circular region. The diameter of the circular region is smaller than the diameter of the wafer. The circumferential region is formed to include a diameter larger than the diameter of the wafer and smaller than the inner diameter of the ring-shaped frame, and a recess that suppresses the sticking of the adhesive tape is formed in an upper surface of the circumferential region that gets contact with the adhesive tape.

摘要翻译： 处理装置中的卡盘台通过将晶片的暴露表面吸附到保持表面而将晶片固定到具有粘合带中间的环形框架的开口的框架单元。 卡盘台包括形成保持表面的圆形区域，其中形成有与抽吸源连通的多个吸入孔以及围绕圆形区域的环形周向区域。 圆形区域的直径小于晶片的直径。 圆周区域形成为包括大于晶片直径的直径并且小于环形框架的内径，并且在周向区域的上表面中形成抑制粘合带粘附的凹部 与胶带接触。

公开(公告)号：US20150259235A1

公开(公告)日：2015-09-17

申请号：US14660146

申请日：2015-03-17

申请人： DISCO CORPORATION

发明人： Noboru Takeda ,  Hiroshi Morikazu ,  Xiaoming Qiu ,  Fumiteru Tashino ,  Ken Togashi

IPC分类号： C03B33/02 ,  B23K26/00

CPC分类号： C03B33/0222 ,  B23K20/10 ,  B23K26/0006 ,  B23K26/03 ,  B23K26/0624 ,  B23K26/0853 ,  B23K26/364 ,  B23K26/384 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/52 ,  B65G2249/04 ,  C03B33/033 ,  C03B33/04

摘要： A plate-shaped object processing method forms a through hole of a desired shape in a plate-shaped object. The method includes a through hole contour forming step of performing laser processing within the plate-shaped object along a contour of the through hole to be formed, by positioning, within the plate-shaped object, a focal point of a pulsed laser beam of a wavelength capable of passing through the plate-shaped object. The beam is applied along the contour of the through hole to be formed by a pulsed laser beam irradiation unit including a condenser applying the laser beams. A through hole is formed by breaking the laser-processed contour of the through hole and forming the through hole by positioning an ultrasonic transducer of an ultrasonic wave applying unit in correspondence with the contour of the through hole to be formed, and applying an ultrasonic wave.

摘要翻译： 板形物体处理方法在板状物体中形成所需形状的通孔。 该方法包括通孔轮廓形成步骤，通过在板状物体内定位一个脉冲激光束的焦点，沿着待形成的通孔的轮廓在该板状物体内进行激光加工 能够穿过板状物体的波长。 沿着通孔的轮廓施加光束，该通孔由包括施加激光束的聚光器的脉冲激光束照射单元形成。 通过使通孔的激光加工轮廓断裂并形成通孔，通过将超声波施加单元的超声波换能器与要形成的通孔的轮廓相对应地形成通孔，并且施加超声波 。

公开(公告)号：US20180045851A1

公开(公告)日：2018-02-15

申请号：US15666215

申请日：2017-08-01

申请人： DISCO CORPORATION

发明人： Ken Togashi ,  Masahiro Tsukamoto

IPC分类号： G01V8/20

CPC分类号： G01V8/20

摘要： Apparatus determines whether a stored object is a wafer alone or a frame unit formed by uniting the wafer and a ring frame. The apparatus includes first and second detecting units, the second detecting unit being stored more shallowly than the first detecting unit. The apparatus determines whether light transmitted by the first detecting unit is blocked by the object and does not reach a light receiving portion of the first detecting unit. When light transmitted from the second detecting unit is blocked by the object and does not reach a light receiving portion of the second detecting unit, the apparatus determines that the object is the frame unit, whereas when the light transmitted from the second detecting unit is not blocked by the object and reaches the light receiving portion of the second detecting unit, the apparatus determines that the object is the wafer.

公开(公告)号：US20170069524A1

公开(公告)日：2017-03-09

申请号：US15243291

申请日：2016-08-22

申请人： DISCO CORPORATION

发明人： Ken Togashi

IPC分类号： H01L21/683 ,  H01L21/67

CPC分类号： H01L21/6838 ,  H01L21/67092

摘要： A chuck table holds under suction a front side of a wafer which includes a device region including a plurality of devices, each having a plurality of electrode bumps, formed in a plurality of areas demarcated in a grid pattern, and an outer peripheral extra region surrounding the device region. The chuck table includes a holding surface for facing the electrode bumps and holding under suction the device region of the wafer, and an outer peripheral extra region support surrounding the holding surface and including an elastic member projecting beyond the holding surface for supporting the outer peripheral extra region of the wafer. The outer peripheral extra region support projects from the holding surface by a distance corresponding to the height of the electrode bumps.

摘要翻译： 一个夹盘在抽吸下保持在晶片的正面，该晶片的前侧包括一个装置区域，该装置区域包括多个装置，每个装置形成在多个划分为网格图案的区域中的多个电极凸块和围绕 设备区域。 卡盘台包括用于面对电极凸块并保持在晶片的装置区域的吸力的保持表面和围绕保持表面的外周额外区域支撑，并且包括突出超过保持表面的弹性构件，用于支撑外周边额外 晶片的区域。 外周附加区域支撑从保持表面伸出与电极凸块的高度相对应的距离。

公开(公告)号：US10094951B2

公开(公告)日：2018-10-09

申请号：US15666215

申请日：2017-08-01

申请人： DISCO CORPORATION

发明人： Ken Togashi ,  Masahiro Tsukamoto

IPC分类号： G01V8/20

摘要： Apparatus determines whether a stored object is a wafer alone or a frame unit formed by uniting the wafer and a ring frame. The apparatus includes first and second detecting units, the second detecting unit being stored more shallowly than the first detecting unit. The apparatus determines whether light transmitted by the first detecting unit is blocked by the object and does not reach a light receiving portion of the first detecting unit. When light transmitted from the second detecting unit is blocked by the object and does not reach a light receiving portion of the second detecting unit, the apparatus determines that the object is the frame unit, whereas when the light transmitted from the second detecting unit is not blocked by the object and reaches the light receiving portion of the second detecting unit, the apparatus determines that the object is the wafer.

公开(公告)号：US10090186B2

公开(公告)日：2018-10-02

申请号：US15243291

申请日：2016-08-22

申请人： DISCO CORPORATION

发明人： Ken Togashi

IPC分类号： H01L21/67 ,  H01L21/683

摘要： A chuck table holds under suction a front side of a wafer which includes a device region including a plurality of devices, each having a plurality of electrode bumps, formed in a plurality of areas demarcated in a grid pattern, and an outer peripheral extra region surrounding the device region. The chuck table includes a holding surface for facing the electrode bumps and holding under suction the device region of the wafer, and an outer peripheral extra region support surrounding the holding surface and including an elastic member projecting beyond the holding surface for supporting the outer peripheral extra region of the wafer. The outer peripheral extra region support projects from the holding surface by a distance corresponding to the height of the electrode bumps.

公开(公告)号：US20170358465A1

公开(公告)日：2017-12-14

申请号：US15617110

申请日：2017-06-08

申请人： DISCO CORPORATION

发明人： Ken Togashi ,  Masahiro Tsukamoto

IPC分类号： H01L21/67 ,  H01L21/677 ,  G05B19/27

CPC分类号： H01L21/6719 ,  G05B19/27 ,  G05B2219/2627 ,  G05B2219/40623 ,  G05B2219/45031 ,  H01L21/67092 ,  H01L21/67132 ,  H01L21/67219 ,  H01L21/67282 ,  H01L21/6773 ,  H01L21/67745

摘要： A wafer processing system includes a laser processing apparatus, a grinding apparatus, a tape sticking apparatus, a first cassette placement part, a second cassette placement part, a conveying unit that conveys a wafer, and a controller that controls the respective constituent elements. The controller includes a first processing program instructing section that conveys a wafer unloaded from a first cassette in order of the laser processing apparatus, the grinding apparatus, the tape sticking apparatus, and a second cassette and sequentially carries out processing by each apparatus for the one wafer, and a second processing program instructing section that conveys the wafer unloaded from the first cassette in order of the grinding apparatus, the laser processing apparatus, the tape sticking apparatus, and the second cassette and sequentially carries out processing by each apparatus for the one wafer.