公开(公告)号：US09514957B2

公开(公告)日：2016-12-06

申请号：US14616711

申请日：2015-02-08

Applicant: DSP Group LTD.

Inventor： Avraham Bauer ,  Avraham Cohen

IPC: H01L23/02 ,  H01L21/3205 ,  H01L21/48 ,  H01L23/552 ,  H01L23/495 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L21/3205 ,  H01L21/4846 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/49548 ,  H01L23/49568 ,  H01L23/552 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A method that may include of at least partially surrounding with an insulating encapsulation lead frames, an integrated circuit attachment and wire bonding while preventing the insulating encapsulation from contacting at least one area of a base element; and at least partially surrounding an exterior of the insulating encapsulation with a conductive coating that contacts at least one area of the base element.

Abstract translation: 一种方法，其可以包括至少部分地围绕绝缘封装引线框架，集成电路附件和引线接合，同时防止绝缘封装接触基体元件的至少一个区域; 并且至少部分地围绕所述绝缘封装的外部，其中所述导电涂层与所述基体元件的至少一个区域相接触。

公开(公告)号：US20150235927A1

公开(公告)日：2015-08-20

申请号：US14616711

申请日：2015-02-08

Applicant: DSP Group LTD.

Inventor： Avraham Bauer ,  Avraham Cohen

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00 ,  H01L23/42 ,  H01L21/3205 ,  H01L21/56 ,  H01L21/48

CPC classification number: H01L21/3205 ,  H01L21/4846 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/49548 ,  H01L23/49568 ,  H01L23/552 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A method that may include of at least partially surrounding with an insulating encapsulation lead frames, an integrated circuit attachment and wire bonding while preventing the insulating encapsulation from contacting at least one area of a base element; and at least partially surrounding an exterior of the insulating encapsulation with a conductive coating that contacts at least one area of the base element.

Abstract translation: 一种方法，其可以包括至少部分地围绕绝缘封装引线框架，集成电路附件和引线接合，同时防止绝缘封装接触基体元件的至少一个区域; 并且至少部分地围绕所述绝缘封装的外部，其中所述导电涂层与所述基体元件的至少一个区域相接触。