Integration of an ion implant hard mask structure into a process for fabricating high density memory cells
    1.
    发明授权
    Integration of an ion implant hard mask structure into a process for fabricating high density memory cells 有权
    将离子注入硬掩模结构集成到用于制造高密度存储器单元的工艺中

    公开(公告)号:US06486029B1

    公开(公告)日:2002-11-26

    申请号:US09627563

    申请日:2000-07-28

    IPC分类号: H01L218247

    摘要: A process for fabricating a memory cell in a two-bit EEPROM device, the process includes forming an ONO layer overlying a semiconductor substrate, depositing a hard mask overlying the ONO layer, and patterning the hard mask. Preferably, the hard mask includes a material selected from the group consisting of tungsten, titanium, titanium nitride, polysilicon, silicon, silicon nitride, silicon oxi-nitride, and silicon rich nitride. In one preferred embodiment, the process further includes implanting the semiconductor substrate with a p-type dopant at an angle substantially normal to the principal surface of the semiconductor substrate and annealing the semiconductor substrate upon implanting the semiconductor substrate with a p-type dopant. In one preferred embodiment, the process further includes implanting the semiconductor substrate with an n-type dopant.

    摘要翻译: 一种用于在2位EEPROM器件中制造存储单元的工艺,该工艺包括形成覆盖半导体衬底的ONO层,沉积覆盖在ONO层上的硬掩模,以及对该硬掩模进行构图。 优选地,硬掩模包括选自钨,钛,氮化钛,多晶硅,硅,氮化硅,氧化氮化硅和富氮的氮化物的材料。 在一个优选实施例中,该方法还包括以基本上垂直于半导体衬底的主表面的角度注入具有p型掺杂剂的半导体衬底,并在用p型掺杂剂注入半导体衬底时退火半导体衬底。 在一个优选实施例中,该工艺还包括用n型掺杂剂注入半导体衬底。

    Process for fabricating high density memory cells using a polysilicon hard mask
    2.
    发明授权
    Process for fabricating high density memory cells using a polysilicon hard mask 有权
    使用多晶硅硬掩模制造高密度存储单元的方法

    公开(公告)号:US06436766B1

    公开(公告)日:2002-08-20

    申请号:US09430493

    申请日:1999-10-29

    IPC分类号: H01L218247

    CPC分类号: H01L27/11521 H01L27/115

    摘要: A process for fabricating a memory cell in a two-bit EEPROM device including forming an ONO layer overlying a semiconductor substrate, depositing a hard mask overlying the ONO layer, and patterning the hard mask. The hard mask is preferably made from polysilicon or silicon. The process further includes doping the semiconductor substrate with boron causing p-type regions to form in the semiconductor substrate, and doping the semiconductor substrate with n-type dopants, such as arsenic, causing n-type regions to form in the semiconductor substrate. The exposed ONO layer is then etched to expose part of the semiconductor substrate, and a bit-line oxide region is formed overlying the semiconductor substrate. The hard mask is then removed, preferably using a plasma etch process.

    摘要翻译: 一种用于在二位EEPROM器件中制造存储单元的方法,包括形成覆盖在半导体衬底上的ONO层,沉积覆盖在ONO层上的硬掩模,以及对该硬掩模进行构图。 硬掩模优选由多晶硅或硅制成。 该工艺还包括用硼掺杂导致在半导体衬底中形成p型区域的半导体衬底,并且用诸如砷的n型掺杂剂掺杂半导体衬底,从而在半导体衬底中形成n型区域。 然后对暴露的ONO层进行蚀刻以暴露半导体衬底的一部分,并且在半导体衬底上形成位线氧化物区域。 然后去除硬掩模,优选使用等离子体蚀刻工艺。

    Process for fabricating high density memory cells using a metallic hard mask
    3.
    发明授权
    Process for fabricating high density memory cells using a metallic hard mask 有权
    使用金属硬掩模制造高密度记忆单元的方法

    公开(公告)号:US06399446B1

    公开(公告)日:2002-06-04

    申请号:US09429722

    申请日:1999-10-29

    IPC分类号: H01L218247

    摘要: A process for fabricating a memory cell in a two-bit EEPROM device including forming an ONO layer overlying a semiconductor substrate, depositing a hard mask overlying the ONO layer, and patterning the hard mask. The hard mask is made from tungsten, titanium, or titanium nitride. The process further includes doping the semiconductor substrate with boron causing p-type regions to form in the semiconductor substrate, and doping the semiconductor substrate with n-type dopants, such as arsenic, causing n-type regions to form in the semiconductor substrate. The exposed ONO layer is then etched to expose part of the semiconductor substrate, and a bit-line oxide region is formed overlying the semiconductor substrate. The hard mask is then stripped, preferably using an H2O2 solution.

    摘要翻译: 一种用于在二位EEPROM器件中制造存储单元的方法,包括形成覆盖在半导体衬底上的ONO层,沉积覆盖在ONO层上的硬掩模,以及对该硬掩模进行构图。 硬掩模由钨,钛或氮化钛制成。 该工艺还包括用硼掺杂导致在半导体衬底中形成p型区域的半导体衬底,并且用诸如砷的n型掺杂剂掺杂半导体衬底,从而在半导体衬底中形成n型区域。 然后对暴露的ONO层进行蚀刻以暴露半导体衬底的一部分,并且在半导体衬底上形成位线氧化物区域。 然后将硬掩模剥离,优选使用H 2 O 2溶液。

    HEALTHCARE CHARGE CAPTURE AND INFORMATION DELIVERY SYSTEM AND METHOD
    4.
    发明申请
    HEALTHCARE CHARGE CAPTURE AND INFORMATION DELIVERY SYSTEM AND METHOD 审中-公开
    医疗保险费征收和信息交付系统及方法

    公开(公告)号:US20110022410A1

    公开(公告)日:2011-01-27

    申请号:US12898469

    申请日:2010-10-05

    IPC分类号: G06Q50/00 G06Q10/00

    摘要: A provider-patient encounter device delivers medical information and services by receiving content from context sponsors, linking the content to service codes and presenting the content to providers. The service codes represent medical procedure codes and medical diagnosis codes. Each service code includes a provider demographic code, a service priority code, and a supplemental service code. The provider-patient encounter device presents a selectable list of service codes and presents content from a context sponsor assigned to a service code when the provider selects the service code from the selectable list of service codes.

    摘要翻译: 提供者 - 患者接触设备通过从上下文赞助者接收内容来传递医疗信息和服务,将内容链接到服务代码并将内容呈现给提供者。 服务代码表示医疗程序代码和医疗诊断代码。 每个服务代码包括提供者人口统计代码,服务优先级代码和补充服务代码。 当提供者从可选择的服务代码列表中选择服务代码时,提供者 - 患者遭遇设备呈现服务代码的可选择列表,并且从分配给服务代码的上下文赞助商呈现内容。

    Healthcare charge capture and information delivery system and method
    5.
    发明授权
    Healthcare charge capture and information delivery system and method 有权
    医疗收费和信息传递系统及方法

    公开(公告)号:US07809590B2

    公开(公告)日:2010-10-05

    申请号:US11775603

    申请日:2007-07-10

    摘要: A provider-patient encounter device delivers medical information and services by receiving content from context sponsors, linking the content to service codes and presenting the content to providers. The service codes represent medical procedure codes and medical diagnosis codes. Each service code includes a provider demographic code, a service priority code, and a supplemental service code. The provider-patient encounter device presents a selectable list of service codes and presents content from a context sponsor assigned to a service code when the provider selects the service code from the selectable list of service codes.

    摘要翻译: 提供者 - 患者接触设备通过从上下文赞助者接收内容来传递医疗信息和服务,将内容链接到服务代码并将内容呈现给提供者。 服务代码表示医疗程序代码和医疗诊断代码。 每个服务代码包括提供者人口统计代码,服务优先级代码和补充服务代码。 当提供者从可选择的服务代码列表中选择服务代码时,提供者 - 患者遭遇设备呈现服务代码的可选择列表,并且从分配给服务代码的上下文赞助商呈现内容。

    HEALTHCARE CHARGE CAPTURE AND INFORMATION DELIVERY SYSTEM AND METHOD
    6.
    发明申请
    HEALTHCARE CHARGE CAPTURE AND INFORMATION DELIVERY SYSTEM AND METHOD 有权
    医疗保险费征收和信息交付系统及方法

    公开(公告)号:US20090018861A1

    公开(公告)日:2009-01-15

    申请号:US11775603

    申请日:2007-07-10

    IPC分类号: G06Q50/00

    摘要: A provider-patient encounter device delivers medical information and services by receiving content from context sponsors, linking the content to service codes and presenting the content to providers. The service codes represent medical procedure codes and medical diagnosis codes. Each service code includes a provider demographic code, a service priority code, and a supplemental service code. The provider-patient encounter device presents a selectable list of service codes and presents content from a context sponsor assigned to a service code when the provider selects the service code from the selectable list of service codes.

    摘要翻译: 提供者 - 患者接触设备通过从上下文赞助者接收内容来传递医疗信息和服务,将内容链接到服务代码并将内容呈现给提供者。 服务代码表示医疗程序代码和医疗诊断代码。 每个服务代码包括提供者人口统计代码,服务优先级代码和补充服务代码。 当提供者从可选择的服务代码列表中选择服务代码时,提供者 - 患者遭遇设备呈现服务代码的可选择列表,并且从分配给服务代码的上下文赞助商呈现内容。