公开(公告)号：US08987875B2

公开(公告)日：2015-03-24

申请号：US13789722

申请日：2013-03-08

Applicant: Delphi Technologies, Inc.

Inventor： Carl W. Berlin ,  Gary L. Eesley

IPC: H01L23/495 ,  H01L21/00 ,  H05K7/00 ,  H05K3/30 ,  H01L23/00 ,  H01L23/498 ,  H01L23/373

CPC classification number: H01L23/49575 ,  H01L23/3735 ,  H01L23/49513 ,  H01L23/49531 ,  H01L23/49537 ,  H01L23/49861 ,  H01L23/562 ,  H01L24/06 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/2732 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/75981 ,  H01L2224/83203 ,  H01L2224/83439 ,  H01L2224/8384 ,  H01L2924/1203 ,  H01L2924/12036 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/3511 ,  Y10T29/4913 ,  Y10T29/49149 ,  Y10T29/49169 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An assembly for packaging one or more electronic devices in die form. The assembly includes substrates on opposite sides of the assembly, with lead frames between the electronic devices and the substrates. The substrates, lead frames, and electronic devices are sintered together using silver-based sintering paste between each layer. The material and thicknesses of the substrates and lead frames are selected so stress experienced by the electronic devices caused by changes in temperature of the assembly are balanced from the center of the assembly, thereby eliminating the need for balancing stresses at a substrate level by applying substantially matching metal layers to both sides of the substrates.

Abstract translation: 一种用于以模具形式包装一个或多个电子设备的组件。 组件包括在组件的相对侧上的基板，电子设备和基板之间具有引线框架。 基板，引线框架和电子器件在各层之间使用银基烧结膏烧结在一起。 选择基板和引线框架的材料和厚度，使得由组件的温度变化引起的电子设备经受的应力从组件的中心平衡，从而消除了通过大体上施加基板水平的平衡应力的需要 将金属层与衬底的两侧相匹配。